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Heat-resistant low-temperature-curing epoxy glue

A technology of epoxy adhesive and heat resistance, applied in the field of epoxy adhesive, can solve the problem of not being able to meet the requirements of good low-temperature curing, heat resistance of adhesion, and resistance to moisture and heat aging at the same time, so as to ensure storage stability and strong adhesion. Relay, high flexibility effect

Pending Publication Date: 2021-07-27
佛山禾邦新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the problems that existing epoxy adhesives cannot simultaneously satisfy good low-temperature curing, cohesive force, heat resistance, and moisture-heat aging resistance, the present invention provides a heat-resistant low-temperature curing epoxy adhesive

Method used

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  • Heat-resistant low-temperature-curing epoxy glue

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preparation example Construction

[0035] Curing agent is an indispensable raw material for the preparation of epoxy adhesives. Generally speaking, curing agents include aliphatic amine curing agents, aromatic amine curing agents, imidazole curing agents, acid anhydride curing agents and polythiol curing agents. agent etc. Based on the consideration of the low-temperature curing performance of the obtained epoxy glue, in a preferred embodiment, the curing agent of the present invention selects a combination of polyfunctional thiol and difunctional thiol, that is, the system of the present invention contains polyfunctional thiol, bifunctional Two types of curing agent materials of functional thiol. Among them, polyfunctional thiol is mainly used for cross-linking curing reaction, and difunctional thiol can realize the function of chain extension. The reasonable combination of two polythiol curing agents can ensure that the epoxy adhesive has more suitable cross-linking density and flexibility. sexual balance. ...

Embodiment 1

[0047] Embodiment 1 of the present invention provides a heat-resistant low-temperature curing epoxy adhesive, including the following components in parts by mass: 50 parts of bisphenol A epoxy resin, 45 parts of hydrogenated bisphenol A epoxy resin, hydroxyl-terminated poly 5 parts of ether ether ketone, 70 parts of curing agent 1,3,4,6-tetramercaptopropyl imidazo[4,5-D]imidazole-2,5[1H,2H]-dione, 1,3 parts of curing agent -20 parts of bis(3-mercaptopropyl)benzimidazol-2-one, 2 parts of solid dispersion latent curing agent, 0.4 part of stabilizer triisopropyl borate, antioxidant tetrakis[β-(3,5- 0.3 parts of di-tert-butyl-4-hydroxyphenyl) propionate] pentaerythritol ester, 2 parts of silane coupling agent γ-glycidyl etheroxypropyl trimethoxysilane, 20 parts of nano silicon dioxide, 5 parts of nano calcium carbonate .

[0048] After measuring the above-mentioned quantitative materials in the container, use dispersing equipment, mix well at room temperature or low temperature, ...

Embodiment 2

[0050] Embodiment 2 of the present invention provides a heat-resistant low-temperature curing epoxy adhesive, including the following components in parts by mass: 60 parts of bisphenol A epoxy resin, 35 parts of hydrogenated bisphenol A epoxy resin, hydroxyl-terminated poly Ether ether ketone 5 parts, curing agent 1,3,4,6-tetramercaptoethylimidazo[4,5-D]imidazole-2,5[1H,2H]-dione 80 parts, curing agent butanediol 20 parts of bis(3-mercaptobutyrate) ester, 2 parts of solid dispersion latent curing agent, 0.4 part of triethyl borate as stabilizer, antioxidant β-(3,5-di-tert-butyl-4-hydroxyphenyl ) 0.3 parts of octadecyl propionate, 2 parts of silane coupling agent γ-glycidyl etheroxypropyl trimethoxysilane, and 25 parts of nano silicon dioxide.

[0051] After measuring the above-mentioned quantitative materials in the container, use dispersing equipment, mix well at room temperature or low temperature, and perform defoaming treatment, and the target product epoxy glue is obtaine...

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Abstract

The invention provides heat-resistant low-temperature-curing epoxy glue. The heat-resistant low-temperature-curing epoxy glue is prepared from the following components in parts by mass: 100 parts of an epoxy resin composition, 65-120 parts of a curing agent, 0.5-5 parts of a curing accelerator, 0.2-5 parts of a stabilizer, 0-0.5 part of an antioxidant, 0.5-4 parts of a silane coupling agent and 10-35 parts of a filler, wherein the epoxy resin composition comprises bisphenol A type epoxy resin, hydrogenated bisphenol A type epoxy resin and hydroxyl-terminated polyether-ether-ketone. According to the invention, the epoxy resin and the thermoplastic polyether-ether-ketone are combined, and the silane coupling agent, the filler and other auxiliary components are added, so the heat resistance and damp-heat aging resistance of the epoxy glue can be effectively improved. The epoxy glue provided by the invention has the advantages of good storage stability at room temperature, rapid curing at low temperature, strong adhesive strength, good damp-heat aging resistance and the like, and can meet the requirements of use performance in special fields.

Description

technical field [0001] The invention belongs to the technical field of epoxy glue, and in particular relates to a heat-resistant low-temperature curing epoxy glue. Background technique [0002] Epoxy resin adhesive is a kind of adhesive with excellent performance, especially its strong environmental adaptability, strong adhesion, good environmental protection, etc., has been widely valued by people. Epoxy resin contains a variety of polar groups and highly active epoxy groups, so it has strong adhesion to metals, glass, cement, wood, plastics and other polar materials, especially to materials with high surface activity. At the same time, the cohesive strength of the epoxy cured product is also very high, so its bonding strength is very high. There are many kinds of epoxy resins, curing agents and modifiers, and the adhesive can have the required curing temperature and performance through reasonable and ingenious design. [0003] Epoxy adhesives or compositions often exist ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/08C09J11/06C09J11/04C08G59/66C08G59/68
CPCC09J163/00C09J11/08C09J11/06C09J11/04C08G59/66C08G59/68C08K2003/265C08L2205/025C08L2205/03C08L2201/08C08L63/00C08L61/16C08K3/36C08K3/26C08K5/5435C08K13/02
Inventor 赵文丰李建波常迪
Owner 佛山禾邦新材料科技有限公司
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