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Bi-component epoxy resin adhesive and preparation method thereof

A technology of epoxy resin glue and epoxy resin, which is applied in the direction of epoxy resin glue, adhesives, adhesive additives, etc., can solve the problems of poor comprehensive performance, change of fluidity, poor sealing performance, etc., and achieve stable fluidity, The effect of excellent bonding performance and excellent flame retardant effect

Pending Publication Date: 2022-05-27
苏州乐文高分子材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] When the epoxy resin adhesive is used as the bonding and sealing material of electronic products, it is required to have moderate fluidity. If the fluidity is small, the adhesive will not be leveled when used, and the appearance will be poor. If the fluidity is too large Cause the adhesive to flow into the interior of the electronic component, resulting in poor sealing performance, and cause poor connection or action of the electronic component
The fluidity of the existing epoxy resin adhesives will change with the storage time during the storage process, thus affecting the performance of the adhesives; secondly, the comprehensive performance of the existing epoxy resin adhesives is poor. With the addition of flame retardant, the mechanical strength of the system decreases

Method used

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  • Bi-component epoxy resin adhesive and preparation method thereof
  • Bi-component epoxy resin adhesive and preparation method thereof
  • Bi-component epoxy resin adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] A two-component epoxy resin adhesive is prepared by mixing A component and B component with a volume ratio of 1:1.2;

[0042] Component A includes the following raw materials in parts by weight: 92 parts of modified epoxy resin, 3 parts of diluent (trimethylolpropane triglycidyl ether), thixotropic agent (weight ratio of 1:0.5 particle size of 2- 8μm fumed silica and nanoscale calcium carbonate) 6 parts, flame retardant (melamine) 3 parts, silane coupling agent (methyltrimethoxysilane) 5 parts, dispersing agent (sodium lauryl sulfate) 1 parts, 1 part of defoamer (polyoxyethylene polyoxypropanolamine ether), 1 part of UV light absorber (10nm titanium dioxide);

[0043] Component B includes the following raw materials by weight: 86 parts of curing agent (phthalic anhydride), 3 parts of curing accelerator (triethanolamine);

[0044] The preparation process of the modified epoxy resin is as follows: the hydrogenated bisphenol A epoxy resin and the hydroxyl-terminated polyb...

Embodiment 2

[0050] A two-component epoxy resin adhesive is prepared by mixing A component and B component with a volume ratio of 1:0.6;

[0051] Component A includes the following raw materials by weight: 80 parts of modified epoxy resin, 9 parts of diluent (dodecyl glycidyl ether), thixotropic agent (weight ratio of 1:0.4, particle size of 2-8μm Fumed silica and nanoscale calcium carbonate) 8 parts, flame retardant (melamine) 5 parts, silane coupling agent (methyltrimethoxysilane) 3 parts, dispersing agent (sodium dodecyl sulfate) 0.2 parts, 0.3 part of defoamer (polyoxyethylene polyoxypropanolamine ether), 0.5 part of UV light absorber (10nm titanium dioxide);

[0052] Component B includes the following raw materials by weight: 80 parts of curing agent (maleic anhydride) and 1 part of curing accelerator (triethanolamine);

[0053] The preparation process of the modified epoxy resin is as follows: the hydrogenated bisphenol A epoxy resin and the hydroxyl-terminated polybutadiene (number...

Embodiment 3

[0059] A two-component epoxy resin adhesive is prepared by mixing A component and B component with a volume ratio of 1:1.5;

[0060] Component A includes the following raw materials in parts by weight: 96 parts of modified epoxy resin, 20 parts of diluent (tetradecyl glycidyl ether), thixotropic agent (weight ratio of 1:0.8, particle size of 2-8 μm) Fumed silica and nanoscale calcium carbonate) 10 parts, flame retardant (melamine uric acid) 10 parts, silane coupling agent (methyltrimethoxysilane) 12 parts, dispersing agent (sodium lauryl sulfate) 1 part , 3 parts of defoamer (polyoxyethylene polyoxypropanolamine ether), 6 parts of UV light absorber (10nm titanium dioxide);

[0061] Component B includes the following raw materials by weight: 93 parts of curing agent (maleic anhydride), 5 parts of curing accelerator (benzyl alcohol);

[0062] The preparation process of the modified epoxy resin is as follows: the hydrogenated bisphenol A epoxy resin and the hydroxyl-terminated p...

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Abstract

The invention discloses a two-component epoxy resin adhesive which is prepared by mixing a component A and a component B in a volume ratio of 1: (0.6-1.5), the component A comprises the following raw materials in parts by weight: 80-100 parts of modified epoxy resin, 3-20 parts of a diluent, 2-10 parts of a thixotropic agent, 3-10 parts of a flame retardant, 3-12 parts of a silane coupling agent and 1-10 parts of an auxiliary agent; the component B comprises the following raw materials in parts by weight: 80-100 parts of a curing agent and 1-5 parts of a curing accelerator; wherein the thixotropic agent is a mixture of fumed silica and nanoscale calcium carbonate; the flame retardant is one or a mixture of more of melamine, melamine urate and melamine phosphate. The product has the advantages of stable flowing performance, moderate fluidity at room temperature, high thixotropy, excellent adhesive property, excellent flame retardant property and excellent mechanical property.

Description

technical field [0001] The invention relates to the technical field of adhesives, in particular to a two-component epoxy resin adhesive and a preparation method thereof. Background technique [0002] Due to its high cohesive strength and high cross-linking density, epoxy resin adhesives have excellent bonding properties to most rigid materials, as well as excellent electrical insulation properties and chemical resistance, suitable for glass, rigid plastics, electronic components As well as the rapid bonding and packaging of precision devices, it is suitable for efficient production line operations. It is widely used in the bonding and sealing of electronic products, and the protective reinforcement and sealing protection of important parts. [0003] When epoxy resin adhesives are used as bonding and sealing materials for electronic products, they are required to have moderate flowability. This causes the adhesive to flow into the electronic components, resulting in poor sea...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/02C09J11/06C09J11/04
CPCC09J163/00C09J11/06C09J11/04C08K2003/265C08K2201/011C08K7/26C08K3/26C08K5/34922C08K5/34928
Inventor 李兰兰
Owner 苏州乐文高分子材料科技有限公司
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