Solvent-free low-shrinkage epoxy pouring adhesive for repairing concrete cracks and preparation method of solvent-free low-shrinkage epoxy pouring adhesive

A low-shrinkage, crack-repairing technology, applied in the field of pouring glue, can solve the problems of low mechanical strength, achieve high bond strength, improve toughness, and have a wide range of applications

Active Publication Date: 2022-06-03
RES INST OF HIGHWAY MINIST OF TRANSPORT +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the long C-H chain structure in the cardanol structure, good flexibility and low mechanical strength, in order to reduce the decrease in mechanical strength, ether diluents with wide application, low viscosity and good dilution effect cannot be used, and relatively rigid esters should be used. The diluent replaces the ether diluent, and the mechanical strength of the obtained cured product is 29.2-38.3MPa, the bending strength is 49.1-57.4MPa, and the compressive strength is about 65.5-74.1MPa

Method used

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  • Solvent-free low-shrinkage epoxy pouring adhesive for repairing concrete cracks and preparation method of solvent-free low-shrinkage epoxy pouring adhesive
  • Solvent-free low-shrinkage epoxy pouring adhesive for repairing concrete cracks and preparation method of solvent-free low-shrinkage epoxy pouring adhesive
  • Solvent-free low-shrinkage epoxy pouring adhesive for repairing concrete cracks and preparation method of solvent-free low-shrinkage epoxy pouring adhesive

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preparation example Construction

[0027] The invention provides a solvent-free low-shrinkage type concrete crack repair epoxy pouring glue, and the preparation method is specifically as follows:

The preparation method of A component comprises the following steps:

S11. Preheat 100-120 parts of epoxy resin at 60° C. for 6-8 hours.

[0028] S12, at normal temperature, add 100-120 parts of epoxy resin and 10-15 parts of diluent in proportion to the reaction kettle, stir for 15-20 minutes, and keep the vacuum degree at -0.095--0.100MPa.

[0029] S13, add 0.5-1 part of defoaming agent and 0.2-0.5 part of leveling agent in proportion, stir for 10-15 minutes, and keep the vacuum degree at -0.095--0.100MPa.

[0030] S14. Clean the stirring teeth and the wall of the kettle, continue stirring for 5 to 6 minutes, keep the vacuum degree at -0.095 to -0.100 MPa, and then discharge the materials for separate packaging.

[0031] The preparation method of B component comprises the following steps:

Preparation of modified n...

Embodiment 1

Component A consists of the following components by weight:

50 parts of 618 bisphenol A type epoxy resin, 10 parts of 6002 bisphenol A type epoxy resin, 30 parts of 170 bisphenol F type epoxy resin, 10 parts of 165 bisphenol F type epoxy resin, 5 alkyl glycidyl ethers part, 8 parts of butanediol glycidyl ether, 0.5 part of defoamer, and 0.2 part of leveling agent.

[0042] Component B consists of the following components by weight:

①Preparation of modified nano-silica powder

10g of KH560 was added to 190g of absolute ethanol in the flask, and acetic acid was added dropwise to adjust the pH value of the solution to about 4. Stir at room temperature for 5 h. After stirring, add 12 g of SiO to the 2 Put it into the stirred solution, ultrasonically dispersed for 30 min, stirred at 75 °C for 4 h, cooled and centrifuged, and dried at 140 °C for 24 h to obtain the modified nano-silica powder containing epoxy groups on the surface.

[0043] ②Preparation of modified toughening a...

Embodiment 2

[0047] Component B consists of the following components by weight:

[0048] ②Preparation of modified toughening agent

[0049] 40 parts of N-aminoethylpiperazine, 40 parts of isophorone diamine, 10 parts of D230 polyetheramine, 10 parts of 651 low viscosity polyamide, 8 parts of modified toughening agent, 6 parts of accelerator, KH550 silane coupler 2 parts of the joint agent.

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Abstract

The invention relates to a solvent-free low-shrinkage epoxy pouring adhesive for repairing concrete cracks and a preparation method thereof, and belongs to the field of pouring adhesives, a self-made modified toughening agent is added into a component B. The preparation method of the modified toughening agent comprises two steps of preparing modified nano silicon dioxide powder and preparing the modified toughening agent. The reaction is actually a reaction of a thiol group with an epoxy group. A polysulfide rubber structure with good elasticity is introduced into the modified toughening agent, meanwhile, nano silicon dioxide rigid particles are contained, the toughness of a cured product can be effectively improved, the obtained perfusion adhesive has low shrinkage rate, and the unconstrained linear shrinkage rate can reach 0.2% or below. The obtained pouring glue has high tensile strength, high compressive strength and high bending strength. The obtained pouring glue has high cohesiveness, relatively high steel-to-steel tensile shear strength and high steel-to-steel butt joint bonding strength. And the steel has high bonding strength with concrete, and the positive pulling bonding strength of the steel to the C45 concrete can realize cohesive failure of the concrete.

Description

technical field [0001] The invention belongs to the field of pouring glue, in particular to a solvent-free low shrinkage type concrete crack repair epoxy pouring glue and a preparation method thereof. Background technique [0002] Cracks in concrete will reduce the overall stiffness and strength of components, accelerate the corrosion of steel bars, shorten the service life, and adversely affect the durability of concrete. Epoxy pouring adhesive has good adhesion and excellent mechanical properties and stability after curing, and is widely used in concrete crack repair and reinforcement. With the advancement of science and technology and social development, higher and higher requirements are also put forward for the pouring glue for concrete crack repair. [0003] Since epoxy pouring glue needs to have low viscosity, furfural-acetone dilution system is usually used, such as patent CN102585441A, which discloses a performance-controllable epoxy-polyketone pouring material and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/08C08G83/00
CPCC09J163/00C09J11/08C08G83/001C08L87/005Y02W30/91
Inventor 张劲泉张守祺王浩石晶李万恒
Owner RES INST OF HIGHWAY MINIST OF TRANSPORT
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