Growth device and growth method of iridium-free zone-melting gallium oxide crystal

A growth device, gallium oxide technology, applied in crystal growth, single crystal growth, single crystal growth and other directions, can solve the problem of not meeting the needs of large-scale and large-scale industries, affecting the crystal growth process and crystal quality, and high maintenance costs , to achieve the effect of no macroscopic defects, elimination of instability, and low cost

Active Publication Date: 2022-07-01
杭州镓仁半导体有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] β-Ga 2 o 3 Crystal growth methods include pulling method, guided mode method, Bridgman method, floating zone method, etc. Among them, most of the crucibles used are precious metals as crucible materials, mainly iridium and platinum-rhodium alloys, but due to the melting point of gallium oxide At 1793°C, at the same time, gallium oxide will volatilize and decompose at high temperature, and there is a problem that metal gallium will be enriched in the melt and cause corrosion to the iridium crucible, which will affect the crystal growth process and crystal quality; and the platinum-rhodium alloy crucible has a low melting point It is close to the melting point of gallium oxide, so the temperature control needs to be extremely accurate, ...

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  • Growth device and growth method of iridium-free zone-melting gallium oxide crystal
  • Growth device and growth method of iridium-free zone-melting gallium oxide crystal
  • Growth device and growth method of iridium-free zone-melting gallium oxide crystal

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Embodiment 1

[0068] The present embodiment provides a method for growing a gallium oxide crystal by melting in an iridium-free zone, comprising the following steps:

[0069] 1) Rod preparation: 5N grade gallium oxide powder or dopant mixed with doping elements is pressed into powder rods with molds and hydraulic devices, and sintered at 1300 °C in a vertical rotating sintering furnace for 32 hours to obtain external 2) Rod processing: Use diamond wire cutting or laser cutting to trim the rod to obtain a raw rod with a diameter of 50mm and a length of 100mm. The alloy fixing parts are fixed, and there are rigid connecting joints on the fixing parts.

[0070] 3) Material rod installation: Lift the first rotating pulling device to the top of the furnace, fix the prepared gallium oxide material rod on the first rotating pulling device through a latch or a holding connection, and calibrate the material rod with a laser calibrator. Straight, lower the first rotary pulling device at a speed of 2...

Embodiment 2

[0075] The present embodiment provides a method for growing a gallium oxide crystal by melting in an iridium-free zone, comprising the following steps:

[0076] 1) Preparation of material rod: directly use the pure gallium oxide material rod obtained as patent CN202210047059.0.

[0077] 2) Material bar processing: Use diamond wire cutting or laser cutting to trim the material bar to obtain a raw material bar with a diameter of 100mm and a length of 200mm. Rigid connection connector.

[0078] 3) Material rod installation: Lift the first rotating pulling device to the top of the furnace, fix the prepared gallium oxide material rod on the first rotating pulling device through a latch or a holding connection, and calibrate the material rod with a laser calibrator. Straight, lower the first rotary pulling device at a speed of 2000mm / h to the highest temperature setting that has been calibrated, and install the zirconia fiber insulation material and quartz cylinder on the upper par...

Embodiment 3

[0083] The present embodiment provides a method for growing a gallium oxide crystal by melting in an iridium-free zone, comprising the following steps:

[0084] 1) Preparation of material rod: directly use the Si-doped material rod obtained as patent CN202210047059.0;

[0085] 2) Material bar processing: Use diamond wire cutting or laser cutting to trim the material bar to obtain a raw material bar with a diameter of 50mm and a length of 200mm. Rigid connection connector.

[0086] 3) Material rod installation: Lift the first rotating pulling device to the top of the furnace, fix the prepared gallium oxide material rod on the first rotating pulling device through a latch or a holding connection, and calibrate the material rod with a laser calibrator. Straight, lower the first rotary pulling device at a speed of 2000mm / h to the highest temperature setting that has been calibrated, and install the zirconia fiber insulation material and quartz cylinder on the upper part of the fu...

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Abstract

The invention discloses a growth device and a growth method of an iridium-free zone-melting gallium oxide crystal. The iridium-free zone-melting method provided by the invention belongs to a method for growing single crystals by a melt method, precious metal is not used as a heating source, an external heating body is used for heating, heat passes through an atmosphere isolation device made of a high-transmittance and high-heat-conduction material to heat and melt a solid gallium oxide polycrystal charge rod or a ceramic rod, then seed crystals are in contact with a melt, and the single crystals are grown by a single crystal growing method. By controlling process conditions such as temperature, rising and falling, rotating speed and the like, a melting region gradually moves upwards, so that a melt region far away from a thermal field is subjected to directional crystallization according to the crystal orientation of seed crystals, and finally, large-size and high-quality gallium oxide single crystals with determined crystal orientation are obtained.

Description

technical field [0001] The invention relates to the field of single crystal growth equipment and technology, in particular to a β-Ga with high quality, large size and definite crystal orientation obtained by a zone melting growth method under conditions close to normal pressure 2 O 3 A growth device and a growth method of a single crystal iridium-free zone melting method gallium oxide crystal. Background technique [0002] Gallium oxide crystal is a transparent ultra-wide bandgap oxide semiconductor material, in which β-Ga 2 O 3 The crystal phase has the advantages of wide band gap (4.9eV) and high breakdown electric field strength, which is far superior to the third-generation semiconductor materials such as silicon carbide and gallium nitride. Research shows that its Barriga figure of merit is about 3400 times that of Si. , about 10 times that of SiC, which can reduce the power loss of the device during use, and will have extremely broad application prospects in the fie...

Claims

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Application Information

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IPC IPC(8): C30B13/16C30B13/28C30B29/16
CPCC30B13/16C30B13/28C30B29/16
Inventor 张辉王嘉斌夏宁马可可李成吴丹杨德仁
Owner 杭州镓仁半导体有限公司
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