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Leadless solder for electronic industry and preparation method

A lead-free solder paste, a technology in the electronics industry, applied in welding equipment, metal processing equipment, welding media, etc., can solve the problems of seeping into the ground, melting into the groundwater system, endangering human and animal health, and having few types of lead-free solder paste , to achieve the effect of not easy to stratify and deteriorate, enhance the shear thinning behavior, and solve the contradiction between activity and corrosion

Inactive Publication Date: 2007-03-14
昆山成利焊锡制造有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, traditional solder paste products are composed of tin-lead solder powder and flux. After the PCB is soldered, the heavy metal lead in the solder paste will be scattered in the environment with the discarded electronic products in the future. After long-term corrosion by acid rain, the lead will seep into the ground , Dissolved into the groundwater system, long-term accumulation in the body of humans or animals after drinking will cause heavy lead poisoning, endangering the health of humans and animals. Just because people are aware of the importance of protecting the environment, environmental protection laws and regulations are also becoming more and more strict.
Therefore, the application of lead-free solder paste in the field of microelectronic surface assembly technology is unavoidable. There are few types of lead-free solder paste, some are easy to dry, and some have unsatisfactory soldering performance.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Put 20kg of disproportionated rosin, 11kg of polymerized rosin and 4kg of hydrogenated rosin into the container, heat and stir until completely melted, add 5kg of hydrogenated castor oil, 5kg of palmitic acid amide at 230°C; 0.5kg of paraffin; 5kg of adipic acid, decane diacid 5kg, perfluoroadipic acid 0.5kg, perfluorosebacic acid 0.5kg, dibromobutene diol 1kg, triethanolamine 3kg and polyethylene glycol 8kg, 2-ethyl-1,3-hexanediol 12kg, 4.5kg of diethylene glycol mono-n-ethyl ether, 15kg of triethylene glycol mono-ethyl ether, stir for 5 minutes, seal the container after cooling to room temperature, and put it in a refrigerator with a temperature of 1°C, and refrigerate for 48 hours to make flux. Take 7kg and 93kg of the above-mentioned flux, 25 micron lead-free tin powder made of Cu 0.01kg, Ag 4kg, Ce 0.01kg and Sn 95.98kg, put it into a solder paste mixer and stir for 10 minutes, then pack it into a packaging bottle and seal it Store solder paste products at 10°C.

Embodiment 2

[0027] Add 25kg of disproportionated rosin, 15kg of polymerized rosin and 5kg of hydrogenated rosin into the container, heat and stir until completely melted, add 4kg of hydrogenated castor oil at 210°C; 6kg of p-phenylcalix[6], 2g of paraffin; dibromobutene Diol 0.5kg and polyethylene glycol 2kg, 2-ethyl-1,3-hexanediol 15kg, diethylene glycol mono-n-ethyl ether 10.5kg, triethylene glycol monoethyl ether 15kg stirred for 8 minutes, cooled to room temperature Seal the container, put it in a refrigerator at 5°C, and refrigerate for 48 hours to make flux. Finally, take 10kg and 90kg of the above-mentioned flux, which are made of Cu 1.0kg, Ag 0.1kg, Ce 0.1kg and Sn 98.8kg. Put the 30 micron lead-free solder powder into the solder paste mixer and stir for 12 minutes, then pack it into packaging bottles and seal it to store the solder paste product at 8°C.

Embodiment 3

[0029] Put 30kg of disproportionated rosin and 10kg of hydrogenated rosin into the container, heat and stir until completely melted, add 1kg of ethylene bis-stearic acid amide at 200°C; 5kg of p-tert-butylcalix[8]arene; 5kg of adipic acid , sebacic acid 5kg, perfluoroadipic acid 1kg, isopropylamine 0.5kg and polyethylene glycol 5kg, 2-ethyl-1,3-hexanediol 15kg, diethylene glycol mono-n-ethyl ether 8kg, triethylene glycol mono After stirring for 10 minutes with 14.5kg of diethyl ether, after cooling to room temperature, seal the container, put it in a refrigerator with a temperature of 8°C, and refrigerate for 48 hours to make flux. .01kg, Ce 0.5kg and Sn 97.49kg of 45 micron lead-free solder powder into the solder paste mixer and stirred for 14 minutes, then packed into packaging bottles and sealed at 5 ℃ to store the solder paste products.

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PUM

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Abstract

The invention relates to a method for producing leadless soldering paste. Wherein, it is formed by 87-93% leadless tin solder powder and 7-13% welding flux; the leadless soldering powder is 25-45micrometer powder made from Cu, Ag, Ce, and Sn; the welding flux is formed by improved rosin, thixotropic agent, stabilizer, activator and solvent; first fusing the improved rosin, adding thixotropic agent, stabilizer, activator and solvent, to obtain welding flux; then mixing the leadless tin solder powder and welding flux in tin paste machine to be bottled. The invention has better protective property, less corrosion and high insulated property.

Description

technical field [0001] The invention relates to a lead-free solder paste suitable for the electronic industry, belonging to soldering materials. [0002] The present invention also relates to the preparation method of the lead-free solder paste Background technique [0003] In recent years, with the increasingly high-speed development of electronic products, the application of surface mount technology is more extensive, because this technology allows size reduction, high density, high performance and low cost. However, traditional solder paste products are composed of tin-lead solder powder and flux. After the PCB is soldered, the heavy metal lead in the solder paste will be scattered in the environment with the discarded electronic products in the future. After long-term corrosion by acid rain, the lead will seep into the ground , Dissolved into the groundwater system, long-term accumulation in the body of humans or animals after drinking will cause heavy lead poisoning, e...

Claims

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Application Information

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IPC IPC(8): B23K35/26B23K35/362
Inventor 苏传猛何繁丽谢明贵
Owner 昆山成利焊锡制造有限公司
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