Photo-sensistive polyimide resin and composition and preparing method

A technology of photosensitive polyimide resin and polyimide resin, applied in the direction of photosensitive materials used in optomechanical equipment, etc., can solve the problems of inability to meet the use requirements, high dielectric constant and water absorption rate of polyimide film, etc. Achieve the effect of tolerant lithography process conditions, simple lithography process conditions, and good storage stability

Inactive Publication Date: 2007-06-13
北京永晶科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The above-mentioned photosensitive polyimide resin has a shortcoming, that is, the dielectric constant (>3.2) and water absorption (>1.0%) of the polyimide film formed after complete thermal curing are relatively high, which cannot meet the requirements of advanced microelectronics. Packaging requirements for low dielectric constant of packaging materials

Method used

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  • Photo-sensistive polyimide resin and composition and preparing method
  • Photo-sensistive polyimide resin and composition and preparing method
  • Photo-sensistive polyimide resin and composition and preparing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] Example 1 In a 1500ml three-necked round bottom flask equipped with a mechanical stirrer, a thermometer and a nitrogen protection device, 260 parts by weight of g 4,4'-[2,2,2-trifluoro-1-(3-tri Fluoromethylphenyl)ethyl]bisphthalic anhydride (TFDA), 286 parts by weight of 2-hydroxyethyl methacrylate and 550 parts by weight of tetrahydrofuran. The reaction mixture was heated to 80° C. and stirred for 6 hours to generate the corresponding aromatic diacid dimethacrylate. The above product was reacted with 98 parts by weight of thionyl chloride to generate the corresponding fluorine-containing aromatic dichloride dimethacrylate (TFDE-Cl).

[0036] In a 1000ml three-necked round-bottomed flask equipped with a mechanical stirrer, a thermometer and a nitrogen protection device, add 100 parts by weight of 4,4-diaminodiphenylmethyl ether (ODA) and 500 parts by weight of N,N-dimethylethyl ether Amide, start stirring to form a homogeneous solution; then, polycondensation reaction ...

Embodiment 2

[0040] Example 2 In a 1000ml three-necked round bottom flask equipped with a mechanical stirrer, a thermometer and a nitrogen protection device, add 210 parts by weight of 4,4'-bis(2,2'-bistrifluoromethyl-4-amino Phenoxy) benzene (6FAPB) and 500 parts by weight of N, N-dimethylacetamide, start stirring, so that it forms a homogeneous solution; (TFDE-Cl) and 5 parts by weight of phenynyl phthalic anhydride undergo polycondensation reaction at room temperature for 10 hours to generate photosensitive polyimide resin (TFDE-6FAPB).

[0041] 25 parts by weight of glycidyl dimethacrylate and 10 parts by weight of epoxypropylene triethoxysilane were added to the above-mentioned photosensitive polyimide resin, and stirred at room temperature for 2 hours to form a homogeneous solution. Finally, in a dark room equipped with a yellow light, 1.2 parts by weight of 2,6-bis(4'-diethylaminobenzyl)cyclohexanone was mixed with the above resin solution, and stirred at room temperature for 2 hou...

Embodiment 3

[0043] Example 3 In a 1000ml three-necked round bottom flask equipped with a mechanical stirrer, a thermometer and a nitrogen protection device, add 248 parts by weight of 4,4'-bis(2,2'-bistrifluoromethyl-4-amino Phenoxy) biphenyl (6FABB) and 500 parts by weight N, N-dimethylacetamide, start stirring to make it form a homogeneous solution; The ester (TFDE-Cl) and 3.6 parts by weight of 4-chlorophthalic anhydride undergo polycondensation reaction at room temperature for 10 hours to generate photosensitive polyimide resin (TFDE-6FABB).

[0044] Add 25 parts by weight of glycidyl methacrylate and 10 parts by weight of γ-aminopropyltriethoxysilane to the above-mentioned photosensitive polyimide resin, and stir at room temperature for 2 hours to form a homogeneous solution . Finally, in a dark room equipped with a yellow light, 0.8 parts by weight of bis(methylcyclopentadienyl)-bis(2,6-difluorobenzene)titanium was mixed with the above resin solution, and stirred at room temperatur...

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Abstract

The invention relates to a kind of light-sensitive polyimide resin and its combination as well as their preparation methods. The said resin combination contains 10-70 portions of light-sensitive polyimide resin, 0.1-50 portions of light-sensitive assistant, 0-100 portions of cross linkage assistant and 0-50 portions viscous assistant by weight. The said light-sensitive polyimide resin is prepared by mixture of fluoric aromatic methacrylate ester, aromatic diamine monomer and compound with the molecular weight conditioner. Exposed to ultraviolet rays (the i and g line), The said resin then generates solidified cross linkage actions; figures with high-resolution can be obtained by dissolving the non-exposed part in water or aqueous solvent. The polyimide film has low dielectric and hygroscopic absorption coefficient, fine thermal stability, mechanical and optical property. It can be applied to passivate and protective film on chips and interlaminar dielectric film of the multi-layer circuit interconnection.

Description

technical field [0001] The invention relates to a photosensitive polyimide resin and its composition and preparation method. Background technique [0002] Polyimide resin has the advantages of high temperature resistance, low temperature resistance, corrosion resistance, high insulation, low dielectric constant and low dielectric loss, and excellent mechanical properties. It is widely used in chip surface passivation and multilayer interconnection structures in semiconductor manufacturing processes. The interlayer insulation of advanced microelectronic packages (BGA, CSP, SiP, etc.), the distribution of package substrate signal lines, the ball-making process of micro-solder balls, the stress-buffering internal coating protective film of plastic-encapsulated circuits, and the manufacturing process of liquid crystal flat panel displays, etc. aspect. In these applications, the electronic circuits on one side of the polyimide film often need to be electrically connected to the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/08C08K5/18G03F7/004
Inventor 袁向文邱昭武付寅张连起
Owner 北京永晶科技有限公司
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