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This invention discloses a PCB high-current layout structure and method based on EMB (Electronic Power Module), relating to the field of PCB high-current layout technology. It includes a PCB body, on which high-current trace areas corresponding to the three-phase motor power supply circuit of the EMB system are divided. Each high-current trace area is provided with at least one current-carrying enhancement structure. The current-carrying enhancement structure includes any one or more combinations of a board-edge exposed copper solder enhancement structure, a segmented metal block current-carrying structure, and an integral polygonal metal current-carrying structure. This invention significantly improves the current-carrying capacity of high-current traces without increasing the PCB area through three flexibly combinable current-carrying enhancement structures, perfectly adapting to the compact design requirements of EMB systems with limited installation space. The current-carrying enhancement structure also has a heat dissipation enhancement function, significantly improving heat dissipation efficiency, effectively solving the problem of localized overheating of traces under instantaneous high-current conditions, delaying PCB aging, and improving the operational stability of the EMB system.