The present application relates to the technical fields of
epoxy resin synthesis, in particular to a phenolic
epoxy resin, a preparation method and application thereof. The phenolic
epoxy resin has the structure shown in the following formula I: Formula I; wherein, in the formula I, n represents a
polymerization degree, and is 0.2-0.6; R1, R2 and R3 are each independently selected from H or C1-C 10
alkyl; and R4 is selected from H or a fused ring group. The preparation method of the phenolic epoxy resin adds a phenolic compound for
molecular modification in a refining stage, increases the proportion of secondary hydroxyl groups in the epoxy resin, promotes the curing of the epoxy resin, effectively shortens the
gel time of the epoxy resin, does not change the mechanical properties of the cured epoxy resin, avoids adding a
small molecule accelerator in the epoxy resin compound, and therefore can effectively improve the electrical properties of the cured product.