Method for preparing copper-base tungsten coating through compounded process of laser and thermal spraying

A composite process and thermal spraying technology, which is applied in the direction of metal material coating process, coating, fusion spraying, etc., to achieve the effect of overcoming low bonding strength, dense surface layer, and good thermal radiation resistance

Active Publication Date: 2010-06-02
GUANGDONG INST OF NEW MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Through the structural design of the gradient coating, the thermal stress problem caused by the mismatch of thermal expansion coefficients between copper and tungsten is solved; the thermal spray coating is remelted by high-energy laser beams to prepare a tungsten coating with a good metallurgical bond with the copper substrate and a dense surface layer , to improve the cohesive bonding properties of the coating, the substrate and the coating, so as to meet the requirements of good thermal radiation and thermal shock resistance of the tungsten coating under high temperature conditions

Method used

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  • Method for preparing copper-base tungsten coating through compounded process of laser and thermal spraying
  • Method for preparing copper-base tungsten coating through compounded process of laser and thermal spraying
  • Method for preparing copper-base tungsten coating through compounded process of laser and thermal spraying

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] 1) Put the oxygen-free red copper plate degreased with acetone and roughened by sand blasting into the vacuum chamber of the low-pressure plasma system, evacuate to 0.1kPa, fill with argon as the protective gas, and turn on the transfer arc for surface cleaning and preheating , and then spray nickel-based alloy powder, composition: C 0.1%, Cr1.2%, Si 0.5%, B 0.3%, Cu 30%, Ni 67.9%, particle size range 10-50μm, coating thickness 0.1mm nickel-based Transition bottom layer;

[0024] 2) The nickel-based transition bottom layer obtained in laser remelting step 1): The process parameters are: laser power 4kW, spot size 2mm, scanning speed 1m / min, lap rate 30%, argon protection during scanning, and the back of the copper plate Use forced water cooling to keep the surface temperature below 300°C to ensure that the copper plate and coating are not oxidized;

[0025] 3) After roughening the transition bottom layer by sandblasting, low-pressure plasma spraying Ni-W alloy powder, ...

Embodiment 2

[0034] 1) Put the oxygen-free red copper plate degreased by acetone and roughened by sand blasting into the vacuum chamber of the low-pressure plasma system, vacuumize to 0.1kPa and fill with argon as a protective gas, and turn on the transfer arc to clean and pre-heat the surface of the copper plate. Heat, then spray Ni-based alloy powder, composition: C 0.1%, Cr1.8%, Si 1.2%, B 0.8%, Cu 40%, Ni 56.1%, particle size range 10-50μm, coating thickness 0.1mm;

[0035] 2) The coating obtained in step 1) is subjected to laser remelting: the process parameters are: laser power 7kW, spot size 3.5mm, scanning speed 3m / min, lap rate 10%, to obtain a nickel-based transition bottom layer; Protected by argon gas, the back of the copper plate is cooled by forced water to keep the surface temperature below 300°C to ensure that the copper plate and the coating are not oxidized;

[0036] 3) Repeat step 1) to carry out low-pressure plasma spraying of Ni-W alloy powder, composition: Ni 50%, W 5...

Embodiment 3

[0040] 1) Put the oxygen-free red copper plate degreased by acetone and roughened by sand blasting into the vacuum chamber of the low-pressure plasma system, vacuumize to 0.1kPa and fill with argon as a protective gas, and turn on the transfer arc to clean and pre-heat the surface of the copper plate. Heat, then spray Ni-based alloy powder, composition: C 0.1%, Cr 2.5%, Si 1.5%, B 1.2%, Cu 50%, Ni 44.7%, particle size range 10-50μm, coating thickness 0.1mm;

[0041] 2) The coating obtained in step 1) is subjected to laser remelting: the process parameters are: laser power 10W, spot size 5mm, scanning speed 4m / min, overlap rate 50%, to obtain a nickel-based transition bottom layer, and pass argon during the scanning process Gas protection, the back of the copper plate is cooled by forced water, so that the surface temperature is lower than 300 ° C, to ensure that the copper plate and the coating are not oxidized;

[0042] 3) Repeat step 1) for low-pressure plasma spraying of Ni...

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Abstract

The invention relates to a method for preparing a copper-base tungsten coating through a compounded process of laser and thermal spraying. The method is characterized by comprising the following steps of: preparing a nickel base alloy transition bottom layer on the surface of a copper matrix by using a low pressure plasma coating system, and remelting the transition bottom layer with laser beams; and then preparing an intermediate transmission layer and the tungsten coating of a Ni-W alloy by using the low pressure plasma coating system, and then remelting with the laser beams to obtain the tungsten coating. By using a gradient coating structure, the method effectively solves the problem of thermal stress caused by mismatching of the coefficient of thermal expansion of the copper and the tungsten, and improves the cohesion strength of the tungsten coating and the matrix, the tungsten coating and the tungsten coating. The coating and the matrix can achieve metallurgical bonding by using the laser beam remelting, bonding property is also improved and the tungsten coating with compact surface is obtained. The tungsten coating prepared by the method has excellent anti-heat radiation and anti-thermal shock properties and is suitable to be used as heated end component materials in equipment, such as first wall material in a ray target, a rocket nozzle, an airplane nozzle throat and a nuclear fusion device.

Description

technical field [0001] The invention relates to a method for preparing a tungsten coating, in particular to a method for preparing a copper-based tungsten gradient coating by using a combined technology of laser and thermal spraying. Background technique [0002] Tungsten has high temperature properties such as high melting point, high hardness, high sputtering threshold, low sputtering rate, and good thermal shock resistance. Throat liners, the first wall in nuclear fusion devices and other fields are widely used. However, tungsten is subject to high-flux thermal radiation and thermal shock under high-temperature conditions, and the working conditions are harsh. It must be forced to cool on the other side to release heat in time to meet the use requirements. Copper has excellent thermal conductivity and good plastic toughness at room temperature. Combining tungsten and copper together to release heat quickly with the good heat transfer performance of copper is currently re...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C4/08C23C4/134
Inventor 刘敏周克崧马文有邓畅光李福海邝子奇陈兴驰
Owner GUANGDONG INST OF NEW MATERIALS
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