N-doped crystalline silicon and preparation method thereof
A silicon nitride and polysilicon technology, applied in the field of polysilicon, its preparation, and single crystal silicon, can solve the problems of nitrogen doping concentration limitation, inability to guarantee the growth of single crystal silicon, limitation of single crystal growth process, etc., and achieves simple process and low cost. Low, easy-to-control effects
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example 1
[0035] First, a mixture of polysilicon material, silicon nitride nanopowder with a particle size of 20nm and boron (B) as an electroactive dopant is loaded into a quartz crucible and the furnace is installed, and the furnace chamber is evacuated and heated to 1500 ° C, and This temperature is maintained until the mixture is completely melted, resulting in a molten silicon mixture. Then, the molten silicon material mixture is solidified by changing the thermal field in the furnace while cooling the bottom of the crucible to obtain a polycrystalline silicon ingot. Wherein, the addition amount of B is the amount that makes the electroactive dopant concentration in the formed polycrystalline silicon ingot be 0.14ppm, the addition amount of silicon nitride nanopowder is such that the nitrogen concentration in the polycrystalline silicon ingot is 0.4ppm. quantity.
[0036] The nitrogen concentration was tested by secondary ion mass spectrometry, and the nitrogen concentration in th...
example 2
[0038] First, dislocation-free single crystal silicon is placed in the bottom layer of the quartz crucible, and a mixture of silicon nitride nanopowder with a particle size of 20nm and boron as an electrically active dopant is placed in the upper layer and loaded into a single crystal furnace. Evacuate the furnace chamber, and heat the bottom of the crucible while blowing cold air until the temperature of the mixture part is 1480°C, and keep at this temperature until the mixture is completely melted and the upper layer of the single crystal silicon is close to the mixture. part of the material melts. And because the bottom of the crucible is ventilated with cold air, the lower layer of the monocrystalline silicon can be kept below the melting point of silicon, so that the monocrystalline silicon of a certain thickness in the lower layer remains as a seed crystal. Wherein, the amount of B added is such that the B doping concentration in the formed polycrystalline silicon ingot ...
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