N-doped crystalline silicon and preparation method thereof

A silicon nitride and polysilicon technology, applied in the field of polysilicon, its preparation, and single crystal silicon, can solve the problems of nitrogen doping concentration limitation, inability to guarantee the growth of single crystal silicon, limitation of single crystal growth process, etc., and achieves simple process and low cost. Low, easy-to-control effects

Inactive Publication Date: 2013-08-28
王敬 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, under the nitrogen atmosphere of more than 60 hours from melting silicon until the final single crystal is formed, the segregation of silicon nitride is unavoidable, and the precipitation of silicon nitride will inevitably lead to the formation of a large number of dislocations and grain boundaries, thus Growth of monocrystalline silicon cannot be guaranteed
Therefore, if nitrogen is doped through nitrogen, the final nitrogen doping concentration will be limited, and the growth process of single crystal will be limited.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

example 1

[0035] First, a mixture of polysilicon material, silicon nitride nanopowder with a particle size of 20nm and boron (B) as an electroactive dopant is loaded into a quartz crucible and the furnace is installed, and the furnace chamber is evacuated and heated to 1500 ° C, and This temperature is maintained until the mixture is completely melted, resulting in a molten silicon mixture. Then, the molten silicon material mixture is solidified by changing the thermal field in the furnace while cooling the bottom of the crucible to obtain a polycrystalline silicon ingot. Wherein, the addition amount of B is the amount that makes the electroactive dopant concentration in the formed polycrystalline silicon ingot be 0.14ppm, the addition amount of silicon nitride nanopowder is such that the nitrogen concentration in the polycrystalline silicon ingot is 0.4ppm. quantity.

[0036] The nitrogen concentration was tested by secondary ion mass spectrometry, and the nitrogen concentration in th...

example 2

[0038] First, dislocation-free single crystal silicon is placed in the bottom layer of the quartz crucible, and a mixture of silicon nitride nanopowder with a particle size of 20nm and boron as an electrically active dopant is placed in the upper layer and loaded into a single crystal furnace. Evacuate the furnace chamber, and heat the bottom of the crucible while blowing cold air until the temperature of the mixture part is 1480°C, and keep at this temperature until the mixture is completely melted and the upper layer of the single crystal silicon is close to the mixture. part of the material melts. And because the bottom of the crucible is ventilated with cold air, the lower layer of the monocrystalline silicon can be kept below the melting point of silicon, so that the monocrystalline silicon of a certain thickness in the lower layer remains as a seed crystal. Wherein, the amount of B added is such that the B doping concentration in the formed polycrystalline silicon ingot ...

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PUM

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Abstract

The invention discloses a preparation method of an N-doped polysilicon ingot, which comprises the following steps that: the mixture of polysilicon material, silicon nitride nano powder with the grain size of 1 to 100nm and electrically active dopant is put into a quartz crucible and is loaded into a furnace; a furnace chamber is vacuumized and heated to 1420 to 1550DEG C, the temperature is insulated until the mixture is fully melted, to obtain molten silicon mixture; and then the molten silicon mixture is solidified to obtain the polysilicon ingot, wherein the electrically active dopant is any one type of B, P or Ga and the added amount makes the concentration of the electrically active dopant in the polysilicon ingot be 0.02 to 2ppm, and the added amount of the silicon nitride nano powder makes the nitrogen concentration in the polysilicon ingot be 0.0002 to 1ppm. The preparation method of N-doped polysilicon can dope nitrogen with existing equipment, and has the advantages of uniform nitrogen doping, high concentration of doped nitrogen, simple and easily controllable process and low cost. In addition, the invention also discloses a preparation method of an N-doped mono-crystalline ingot.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to single crystal silicon, polycrystalline silicon and a preparation method thereof with relatively high mechanical strength. Background technique [0002] Solar energy is a renewable green energy source. Using the photoelectric conversion properties of semiconductor materials to prepare solar cells can convert solar energy into electrical energy. Since the birth of the first monocrystalline silicon solar cell in 1954, solar cell technology and industry have developed tremendously. Solar cells can be divided into: 1) silicon solar cells; 2) batteries made of inorganic salts such as gallium arsenide III-V compounds, cadmium sulfide, copper indium selenide and other multi-component compounds; 3) solar cells made of functional polymer materials energy batteries; 4) nanocrystalline solar cells, etc. Among them, silicon solar cells, especially crystalline silicon solar cells...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C30B29/06C30B28/06C30B11/00
Inventor 王敬翟志华
Owner 王敬
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