Two-stage plasma gasifying, melting and cracking method and device of waste containing organic matters

A plasma, gasification and melting technology, applied in the field of gasification, melting and cracking, can solve the problems of high energy consumption and fly ash, and achieve the effect of wide application field, no impact on efficiency, and high degree of resource utilization

Active Publication Date: 2011-04-06
HOOTECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] The purpose of the present invention is to overcome the shortcomings of the above-mentioned prior art, to provide a two-stage plasma gasification melting cracking method and its device containing organic waste, to solve the problem of plasma arc melting and cracking treatment of organic waste. The serious shortage of high consumption and high fly ash, so as to fully achieve the maximum utilization of organic matter energy and processing efficiency, completely crack tar, reduce the probability of dioxin formation, and obtain as much high-quality and high-calorific value syngas as possible, for the follow-up Gasification power generation, hydrogen energy recovery or the production of green liquid fuels provide guarantees, and at the same time complete the one-step recovery of precious metals and the glass body that can be directly used in the field of building materials, laying the foundation for large-scale commercial development and application of organic waste materials. Solve the problem of possible pollutant emission during the gasification of organic matter, especially the gasification of hazardous waste

Method used

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  • Two-stage plasma gasifying, melting and cracking method and device of waste containing organic matters
  • Two-stage plasma gasifying, melting and cracking method and device of waste containing organic matters
  • Two-stage plasma gasifying, melting and cracking method and device of waste containing organic matters

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Embodiment 1

[0056] Medical waste, calorific value HHV (higher calorific value) 15MJ / kg, processing capacity 500kg / hr, composition (%wt): 50C, 7H, 25.7O, 1N, 0.5S, 0.8Cl, 15ASH (ash), 35Moisture ( Humidity); DC plasma arc power 100kW; obtained vitrified body about 75kg / hr; syngas generation 1200℃, 1550NM 3 / hr, synthetic gas chemical heat dry basis HHV4.14MJ / NM 3, wet basis HHV3.39MJ / NM 3 , sensible heat 2932MJ / hr; synthesis gas molar ratio (% mol): 0.01CH 4 , 0.00C 2 h 2 , 0.00C 2 h 4 , 13.76CO, 7.82CO 2 , 15.17H 2 , 0.12HCl, 18.19H 2 O, 0.08H 2 S, 44.87N 2 ; Dioxin emission in tail gas after purification and utilization of syngas 3 .

Embodiment 2

[0058] Rice husk, calorific value HHV (higher calorific value) 10.2MJ / kg, capacity, 1000kg / hr, composition (%wt): 32.4C, 4.6H, 38.5O, 0.6N, 0.2S, 23.7ASH, 15Moisture; DC The plasma arc power is 200kW; the obtained glass body is about 240kg / hr; the synthesis gas is generated at 1200°C, 2211NM 3 / hr, syngas chemical heat dry basis HHV (high heating value) 3.72MJ / NM 3 , wet basis HHV3.02MJ / NM 3 , sensible heat 4329MJ / hr; synthesis gas molar ratio (% mol): 0.01CH 4 , 0.00C 2 h 2 , 0.00C 2 h 4 , 14.33CO, 11.02CO 2 , 11.57H 2 , 0.00HCl, 18.83H 2 O, 0.04H 2 S, 44.20N 2 .

Embodiment 3

[0060] Abandoned computer motherboards with components, organic matter mainly brominated epoxy resin 40%wt, inorganic oxides 30%wt, metal 30%wt, after two-stage plasma gasification melting cracking treatment, DC plasma arc power consumption is about 750kWh / T, 295kg / T of mixed metal ingots can be obtained, the metal recovery rate is 98.5%, the glass body is about 320kg / T, and about 40kg / T of carbonate-based thinner slag containing K and or Na is required.

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Abstract

The invention relates to a treatment method of waste containing organic matters, in particular to two-stage plasma gasifying, melting and cracking method and device of the waste containing organic matters, belonging to the field of gasifying, melting and cracking techniques. In the invention, the serious defects of high energy consumption of the waste containing organic matters and more flying ash during the plasma arc melting and cracking are solved, thereby thoroughly utilizing the energy of the organic matters and maximizing the treating efficiency, thoroughly cracking the tar, reducing the generation rate of Dioxin, obtaining synthesis gas with high quality and high heat value as much as possible, providing guarantee for the subsequent gasification power generation, the hydrogen energy recovery or the production of green liquid fuel, simultaneously finishing one-step recovery of noble metals and direct utilization of glass bodies in the field of building materials, laying foundation for the large-scale commercial development and application of the energy of the waste containing organic matters, and thoroughly solving the possible pollutant discharging problem in the gasifying process of the organic matters, particularly the dangerous waste.

Description

technical field [0001] The invention relates to a treatment method for organic waste, in particular to a two-stage plasma gasification melting cracking method and device for organic waste, belonging to the technical field of gasification melting cracking. Background technique [0002] Chinese invention patent Takeda Shigeji et al. CN 1935399A, a method for decomposing organic waste and a thermal decomposer for organic waste, introduces that the discharge material releases electrons at a certain temperature for irregular movement, and under the action of a permanent magnetic field set around, the excitation Accelerated spiral motion, accompanied by mutual impact, bombards organic matter to generate positive ions and electrons, induces corona plasma reaction, and presents an extremely unstable electric field. The newly generated positive ions and electrons randomly multiplied to induce the corona plasma reaction, causing the adjacent organic matter to generate positive ions an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B09B3/00F23G5/027
CPCC10J3/18C10J2300/0956C03B5/005C22B7/001C10J2300/1238C10J2300/1634C03B5/025Y02P10/20Y02P40/50
Inventor 丁恩振丁家亮
Owner HOOTECH
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