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Electro-deposition photoresist and preparation method and film forming method thereof

A photoresist and electrodeposition technology, applied in the direction of optomechanical equipment, photosensitive materials for optomechanical equipment, optics, etc., can solve problems such as line gaps, etch, thin line product scrapping, etc., and achieve low cost , easy industrialization, and simple process

Inactive Publication Date: 2011-08-17
GUANGDONG DANBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As an important chemical in the production of printed circuit boards, currently domestic and foreign photoresists mainly use dry film resists, resist inks and some other liquid resist materials, but due to their obvious shortcomings, For example, the resolution limit and the conformity with the copper foil surface are not enough, and it is easy to cause defects such as gaps or etch in the circuit during etching, and even lead to the scrapping of thin line products. Obviously, it cannot adapt to the current miniaturization, high density and high reliability of FPC. development needs

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0049] A method for preparing an electrodeposited photoresist, comprising the following steps: 1) preparation of the water-based acrylic copolymer matrix resin; 2) preparation of the photoresist; the prepared water-based acrylic copolymer The solid content of the matrix resin is 42.0-49.0wt%, and the acid value is 89-93; the solid content of the prepared photoresist is 17-20wt%, and the pH is 7-9.

[0050] A method for forming a film of an electrodeposition photoresist, comprising the steps of: loading the above photoresist into an electrodeposition tank, using a positively charged copper foil substrate as an anode, and two negatively charged stainless steel plates As a cathode, vertically suspended and immersed in the photoresist for electrodeposition film formation, the conditions are: deposition temperature: 23-25°C; application voltage: 60-90V; DC current density: 40-60mA / dm 2 ; Deposition time: 60-90s; Drying time: (10-15min) × (90-105°C).

Embodiment 1

[0053] The ratio is as follows:

[0054] Acrylic 100 parts

[0055] 400 parts of tert-butyl methacrylate

[0056] Ethyl acrylate 250 parts

[0057] 230 parts of 2-ethylhexyl acrylate

[0058] Benzoyl peroxide (BPO) 10 parts

[0059] Azobisisobutyronitrile (AIBN) 8 parts

[0060] tert-butyl cellosolve / isopropanol 920 parts / 260 parts

[0061] PAG-1 / PAG-2 2 parts / 4 parts

[0062] Benzophenone / benzoin dimethyl ether (DMPA) 1.5 parts / 1.5 parts

[0063] TMPTA / HDDA 30 parts / 20 parts

[0064] Polyoxyethylene 2-octylphenol ether 15 parts

[0065] Vapor SiO 2 / talcum powder 20 parts / 10 parts

[0066] Acetone 50 parts

[0067] 10 parts of triethylamine

[0068] 700 parts of deionized water

[0069] In the flask equipped with stirrer, reflux condenser, thermometer, constant pressure dropping funnel and nitrogen conduit, add the mixed organic solvent of 920g tert-butyl cellosolve and 260g isopropanol, after introducing N 2While stirring, heat to 80°C and keep it constant; ...

Embodiment 2

[0089] The ratio is as follows:

[0090] 100 parts of methacrylic acid

[0091] 400 parts of tert-butyl acrylate

[0092] 250 parts of hydroxyethyl methacrylate

[0093] Laurate methacrylate 230 parts

[0094] Michler's ketone 3 parts

[0095] PETA / TPGDA 30 parts / 20 parts

[0096] Glycerin polyoxyethylene ether (G-18) 15 parts

[0097] Other component proportioning is with embodiment one.

[0098] The synthesis of the matrix resin, the preparation of the ED photoresist, the ED film-forming process and the test method are the same as in Example 1, and the test results are as follows:

[0099] The average molecular weight of the base resin is 27700, the acid value is 90, and the solid content is 46.5wt%.

[0100] The solid content of the ED photoresist was 18.2 wt%, pH 8.1.

[0101] The test results of the ED film are as follows:

[0102] Thickness (μm): 7-9

[0103] Touch dry time (s): 17-21

[0104] Pencil hardness (H): 3

[0105] Adhesion (Level): 0

[0106] Deve...

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Abstract

The invention discloses an electro-deposition photoresist, which comprises the following components: 17.0 to 19.0 weight percent of water-based acrylic copolymer matrix resin, 0.5 to 0.7 weight percent of photoproduction acid agent, 0.2 to 0.4 weight percent of photosensitizer, 4.0 to 5.0 weight percent of active thinning gent, 1.0 to 2.0 weight percent of surfactant, 2.0 to 3.0 weight percent of inorganic filler and 70.0 to 72.0 weight percent of solvent. The invention also discloses a preparation method for the electro-deposition photoresist, which comprises the following steps of: 1) preparation of the water-based acrylic copolymer matrix resin; and 2) preparation of the photoresist. The invention also discloses a film forming method for the electro-deposition photoresist, which comprises the following steps of: filling the photoresist into an electro-deposition tank, and performing electro-deposition curing to form a film. The cost is low, the process is simple, and industrialization is easy.

Description

technical field [0001] The present invention relates to a polymer adhesive and its preparation, in particular to an electrodeposition (Electrodeposition, abbreviated as ED) type photoresist and its preparation method and film-forming method, which are mainly used for flexible packaging substrate fine circuit Graphic transfer in production. Background technique [0002] In recent years, with the process of thinning, shortening and multi-functionalization of electronic machines, there is an increasing demand for high-precision thin-line flexible packaging substrates (Flexible Printed Circuit, abbreviated as FPC) to adapt to it, especially high A high-quality resist layer is extremely important. As an important chemical in the production of printed circuit boards, currently domestic and foreign photoresists mainly use dry film resists, resist inks and some other liquid resist materials, but due to their obvious shortcomings, For example, the resolution limit and the conformit...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/004G03F7/027G03F7/038C25D13/06
Inventor 刘萍张双庆
Owner GUANGDONG DANBOND TECH
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