Scaling powder for lead-free solder wire
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- 郴州金箭焊料有限公司
- Publication Date
- 2013-06-05
- Estimated Expiration
- Not applicable · inactive patent
Abstract
Description
technical field
[0001] The invention designs a flux for lead-free solder wire, especially for modifying its welding fumes and residues. Background technique
[0002] With the rapid development of electronic products and the widespread application of lead-free products, people's awareness of environmental protection has become stronger, and the requirements for lead-free soldering have become increasingly stringent, which has prompted people to improve lead-free soldering from the formulation of solder and flux.
[0003] Tin solder can be modified by adding metal elements, such as trace elements, or by changing the alloy ratio to adjust the performance of the solder, and can also be improved by optimizing the production process, etc., and so on, there are many methods.
[0004] The optimization or innovative improvement of flux can greatly improve the welding effect. Flux has the functions of removing oxides on the surface of the busbar and solder alloy during welding, preve...