A method for processing high-precision metal patterns on the surface of ceramic material products

Abstract

The invention discloses a method for processing a high-precision metal pattern on the surface of a ceramic material product. In the method, the ceramic material product is firstly pretreated, and a metal film with a thickness of 0.01-100 μm is plated on the surface of the ceramic material product, and then the metal film is coated on the metal film. Coating corrosion-resistant photosensitive material, exposure and development, and finally etching the metal film with etching solution, removing the cured photosensitive material after etching, exposing the pattern of the metal film layer, and further electroplating on the surface of the metal film layer as required or electroless plating treatment. The method of the present invention is used to make micro-nano level high-precision metal patterns on the surface of ceramic material products. The metal patterns produced have the characteristics of adjustable color, adjustable conductivity, and arbitrary design of patterns, which can improve the product quality of ceramic material products. It is high-grade and ornamental, and does not damage the ceramic substrate, and the cost is low.

Description

technical field

[0001] The invention relates to a method for processing metal patterns on the surface of ceramic material products, in particular to a method for processing high-precision metal patterns on the surface of ceramic material products. Background technique

[0002] With the development of science and technology, people have higher and higher requirements for making high-precision metal circuits or patterns on the surface of ceramic materials. At present, the traditional processing methods of metal patterns on the surface of ceramic materials mainly include screen printing, metal thermal spraying, inkjet printing, laser etching, etc., but all of them have the problem of low precision.

[0003] Screen printing is first screen printing and then sintering at a certain temperature to obtain a surface metal pattern. Screen printing is limited by the diameter of the screen and the characteristics of the paste, and its printing accuracy is difficult to reach below 100μm...

Examples

Embodiment 1

[0030] This embodiment provides a method for processing a high-precision metal LOGO pattern on a ceramic mobile phone base plate, said method comprising the following steps:

[0031] (1) Pretreatment: Use corundum powder with a powder particle size of 0.001-5 μm to mechanically grind and polish the white or black zirconia ceramic mobile phone bottom plate into a mirror state, so that the surface roughness Ra of the ceramic mobile phone bottom plate is controlled at 0.5 μm or less ;

[0032] (2) Metal coating: After cleaning the pretreated ceramic mobile phone bottom plate, apply magnesium-aluminum alloy film on the surface of the ceramic mobile phone bottom plate by magnetron sputtering. The temperature is 50-350°C, and then argon gas is introduced, and the magnesium-aluminum alloy is used as the target material, and the magnetron sputtering target is turned on for sputtering, and the vacuum degree is kept at 0.001-10Pa, and the sputtering is carried out for 1-10 minutes, so a...

Embodiment 2

[0039] This embodiment provides a method for processing a high-precision metal LOGO pattern on a ceramic mobile phone base plate, said method comprising the following steps:

[0040] (1) Pretreatment: Use silicon carbide powder with a powder particle size of 0.001-5 μm to mechanically grind and polish the white or black zirconia ceramic mobile phone bottom plate into a mirror state, so that the surface roughness Ra of the ceramic mobile phone bottom plate is controlled at 0.5 μm or less. the following;

[0041] (2) Metal coating: After cleaning the pretreated ceramic mobile phone bottom plate, use multi-arc ion plating to coat titanium film on the surface of the ceramic mobile phone bottom plate. Specifically, hang the ceramic watch in the furnace, vacuumize, and control the temperature in the furnace to 50 ~350°C, with titanium as the target material, a mixed gas of nitrogen, ethylene, and argon is introduced, so that the color, hardness and wear resistance of the metal film ...

Embodiment 3

[0048] This embodiment provides a method for processing a high-precision metal circuit on an alumina substrate, the method comprising the following steps:

[0049] (1) Pretreatment: Use zirconia ceramic powder with a powder particle size of 0.001-5 μm to mechanically grind and polish the alumina substrate into a mirror state, so that the surface roughness Ra of the alumina substrate is controlled at 0.5 μm or less;

[0050] (2) Metal coating: After the pretreated alumina substrate is cleaned, the copper-nickel alloy film is plated on the surface of the ceramic watch by physical vapor deposition, and the thickness of the copper-nickel alloy film is 0.01-100 μm;

[0051] (3) Coating photosensitive material: Coating UV ink on the copper-nickel alloy film of the alumina substrate by scraping, controlling the thickness of the UV ink at 0.01-50 μm, and then drying at 20-135 °C;

[0052] (4) Exposure and development: cover the designed film or mask pattern on the UV ink on the surfac...

technical field

[0001] The invention relates to a method for processing metal patterns on the surface of ceramic material products, in particular to a method for processing high-precision metal patterns on the surface of ceramic material products. Background technique

[0002] With the development of science and technology, people have higher and higher requirements for making high-precision metal circuits or patterns on the surface of ceramic materials. At present, the traditional processing methods of metal patterns on the surface of ceramic materials mainly include screen printing, metal thermal spraying, inkjet printing, laser etching, etc., but all of them have the problem of low precision.

[0003] Screen printing is first screen printing and then sintering at a certain temperature to obtain a surface metal pattern. Screen printing is limited by the diameter of the screen and the characteristics of the paste, and its printing accuracy is difficult to reach below 100μm...

Examples

Embodiment 1

[0030] This embodiment provides a method for processing a high-precision metal LOGO pattern on a ceramic mobile phone base plate, said method comprising the following steps:

[0031] (1) Pretreatment: Use corundum powder with a powder particle size of 0.001-5 μm to mechanically grind and polish the white or black zirconia ceramic mobile phone bottom plate into a mirror state, so that the surface roughness Ra of the ceramic mobile phone bottom plate is controlled at 0.5 μm or less ;

[0032] (2) Metal coating: After cleaning the pretreated ceramic mobile phone bottom plate, apply magnesium-aluminum alloy film on the surface of the ceramic mobile phone bottom plate by magnetron sputtering. The temperature is 50-350°C, and then argon gas is introduced, and the magnesium-aluminum alloy is used as the target material, and the magnetron sputtering target is turned on for sputtering, and the vacuum degree is kept at 0.001-10Pa, and the sputtering is carried out for 1-10 minutes, so a...

Embodiment 2

[0039] This embodiment provides a method for processing a high-precision metal LOGO pattern on a ceramic mobile phone base plate, said method comprising the following steps:

[0040] (1) Pretreatment: Use silicon carbide powder with a powder particle size of 0.001-5 μm to mechanically grind and polish the white or black zirconia ceramic mobile phone bottom plate into a mirror state, so that the surface roughness Ra of the ceramic mobile phone bottom plate is controlled at 0.5 μm or less. the following;

[0041] (2) Metal coating: After cleaning the pretreated ceramic mobile phone bottom plate, use multi-arc ion plating to coat titanium film on the surface of the ceramic mobile phone bottom plate. Specifically, hang the ceramic watch in the furnace, vacuumize, and control the temperature in the furnace to 50 ~350°C, with titanium as the target material, a mixed gas of nitrogen, ethylene, and argon is introduced, so that the color, hardness and wear resistance of the metal film ...

Embodiment 3

[0048] This embodiment provides a method for processing a high-precision metal circuit on an alumina substrate, the method comprising the following steps:

[0049] (1) Pretreatment: Use zirconia ceramic powder with a powder particle size of 0.001-5 μm to mechanically grind and polish the alumina substrate into a mirror state, so that the surface roughness Ra of the alumina substrate is controlled at 0.5 μm or less;

[0050] (2) Metal coating: After the pretreated alumina substrate is cleaned, the copper-nickel alloy film is plated on the surface of the ceramic watch by physical vapor deposition, and the thickness of the copper-nickel alloy film is 0.01-100 μm;

[0051] (3) Coating photosensitive material: Coating UV ink on the copper-nickel alloy film of the alumina substrate by scraping, controlling the thickness of the UV ink at 0.01-50 μm, and then drying at 20-135 °C;

[0052] (4) Exposure and development: cover the designed film or mask pattern on the UV ink on the surfac...