Method for preparing graphene composite with low percolation threshold value and high heat stability

A technology with high thermal stability and percolation threshold, which is applied in the field of preparation of graphene composite materials with low percolation threshold and high thermal stability, can solve the problem of damage to material processing and mechanical properties, irreversible weakening of electrical properties, and unsatisfactory thermal stability and other problems, to achieve the effect of excellent thermal stability, stable phase area size and high specific strength

Inactive Publication Date: 2013-12-25
SHANGHAI JIAO TONG UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, there are currently two major defects that restrict the industrial application and promotion of CPC materials: (1) To obtain low room temperature resistivity with a high filler content, taking the most common carbon-based filler as an example, conductive composites filled with common fillers such as carbon black (CB) Material Percolation Threshold It is about 15-25vol%, and highly conductive fillers such as carbon nanotubes (CNTs) and vapor grown carbon fibers (VGCF) a

Method used

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  • Method for preparing graphene composite with low percolation threshold value and high heat stability
  • Method for preparing graphene composite with low percolation threshold value and high heat stability
  • Method for preparing graphene composite with low percolation threshold value and high heat stability

Examples

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Example Embodiment

[0030] Example 1

[0031] This embodiment relates to a method for preparing a ternary graphene-based conductive polymer composite material with low percolation threshold and high thermal stability, including the following steps:

[0032] Step (1), graphene oxide (GO) grafted with γ-methacryloxypropyltrimethoxysilane (KH-570)

[0033] Weigh 500mg of graphene oxide (GO), add 500mL of deionized water, sonicate for 5h and stir overnight, then disperse for 30min at 50% power of the cell crusher, record it as solution A; also weigh 2g KH-570 and add 100mL pH=4.0 Deionized water, hydrolyzed at room temperature for 1 hour, recorded as solution B; mix the two solutions of A and B, react at 25°C for 24 hours, centrifuge at high speed and wash with ethanol 3 times; the product is dried in vacuum at 60°C for 24 hours to obtain GO-KH570;

[0034] Step (2), GO-KH570 mini-emulsion polymerization grafting styrene (St) and methyl methacrylate copolymer (MMA)

[0035] Weigh 300mg GO-KH570, 15g styrene ...

Example Embodiment

[0038] Example 2

[0039] This embodiment relates to a method for preparing a ternary graphene-based conductive polymer composite material with low percolation threshold and high thermal stability, including the following steps:

[0040] Step (1), graphene oxide grafting γ-methacryloxypropyltrimethoxysilane (KH-570)

[0041] Weigh 100mg of graphene oxide (GO), add 150mL of deionized water, sonicate for 2h and stir overnight, then disperse for 30min at 50% power of the cell crusher, record it as solution A; add 1g KH-570 to 100mL pH=4.0 Deionized water, hydrolyzed at room temperature for 1 hour, recorded as solution B; mix the two solutions A and B, react at 50°C for 20 hours, centrifuge at high speed and wash with ethanol 3 times after completion; the product is dried in vacuum at 60°C for 24 hours to obtain GO-KH570;

[0042] Step (2), GO-KH570 mini-emulsion polymerization grafting styrene (St) and methyl methacrylate copolymer (MMA)

[0043] Weigh 300mg GO-KH570, 15g styrene (St) an...

Example Embodiment

[0046] Example 3

[0047] This embodiment relates to a method for preparing a ternary graphene-based conductive polymer composite material with low percolation threshold and high thermal stability, including the following steps:

[0048] Step (1), graphene oxide grafting γ-methacryloxypropyltrimethoxysilane (KH-570)

[0049] Weigh 500mg of graphene oxide (GO), add 500mL of deionized water, sonicate for 5h and stir overnight, then disperse for 30min at 50% power of the cell crusher, record it as solution A; also weigh 2g of KH-570 and add 500mL pH=4.0 Deionized water, hydrolyzed at room temperature for 1 hour, recorded as solution B; mix the two solutions A and B, react at 75°C for 16 hours, centrifuge at high speed and wash with ethanol 3 times after completion; the product is dried in vacuum at 60°C for 24 hours to obtain GO-KH570;

[0050] Step (2), GO-KH570 mini-emulsion polymerization grafting styrene (St) and methyl methacrylate copolymer (MMA)

[0051] Weigh 200mg GO-KH570, 15g ...

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Abstract

The invention relates to a method for preparing a graphene composite with a low percolation threshold value and high heat stability. The method comprises the following steps: introducing double bonds by the grafting of graphene oxide with a silane coupling agent; polymerizing preliminarily-modified fillers with styrene and methyl methacrylate fine emulsion, and preparing modified fillers of grafting random copolymers; mixing the modified fillers with polystyrene and a poly methyl methacrylate solution, and using hydrazine hydrate for synchronous reduction; precipitating polymers, drying and performing. TEM tests for the graphene composite provided by the utility model show that part of fillers are distributed at two phases of interfaces and generates good compatibilization to a system, and the percolation threshold value is only 0.11 vol%. Meanwhile, SEM tests show that phase coarsening is inhibited before and after heat treatment, the heat stability of the system is obviously increased, and the graphene composite can be widely used in the field of conductive polymer composites.

Description

technical field [0001] The invention relates to a method for preparing a graphene composite material, in particular to a method for preparing a graphene composite material with a low percolation threshold and high thermal stability. Background technique [0002] Filled conductive polymer composites (Conductive Polymer Composites, CPC) are conductive fillers (carbon-based, metal-based, metal oxide three types) and insulating polymer matrix, through dispersion compounding, lamination compounding and the formation of surface conductive film The multi-phase composite conductive system formed after treatment in the same way. Because it has both the conductivity of the filler and the ease of processing of the polymer matrix, the cost is low, and the resistivity (ρ), mechanical and thermal properties can be adjusted in a wide range, it occupies an important position in the global conductive polymer material market. It is widely used in energy, optoelectronic devices, electromagnet...

Claims

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Application Information

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IPC IPC(8): C08L25/06C08L33/12C08K9/04C08K9/06C08K3/04C08F292/00C08F212/08C08F220/14
Inventor 方立骏侯世杰江平开
Owner SHANGHAI JIAO TONG UNIV
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