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Polymer metal binder containing 3,4-dihydropyrimidin-2-one structure and its preparation method and application

A technology of dihydropyrimidine and adhesives, which is applied in the field of polymer metal adhesives and their preparation, can solve the problems of difficult storage and low temperature tolerance during curing time, and achieve good bonding effect and satisfactory adhesion. It takes a short time to achieve the effect of large-scale industrial production

Active Publication Date: 2017-07-18
TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] For metal adhesives, the adhesives currently on the market are mostly epoxy adhesives with a relatively long curing time or cyanoacrylate adhesives with low temperature tolerance, such as: epoxy curing time Generally about 24 hours, cyanoacrylates are generally affected by water and are not easy to store

Method used

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  • Polymer metal binder containing 3,4-dihydropyrimidin-2-one structure and its preparation method and application
  • Polymer metal binder containing 3,4-dihydropyrimidin-2-one structure and its preparation method and application
  • Polymer metal binder containing 3,4-dihydropyrimidin-2-one structure and its preparation method and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] Example 1, preparation of polymer metal binder containing 3,4-dihydropyrimidin-2-one structure:

[0036] 1) According to figure 1 The synthetic route diagram in prepares monomer 1, monomer 2 and monomer 3 containing aldehyde group and β-diketone structure, concrete steps are as follows: under potassium carbonate and sodium iodide effect (make the mole of potassium carbonate and compound B Ratio is 2:1.1, makes the mol ratio of sodium iodide and compound B be 1:1.1), compound B and compound C, compound D or compound E are 1.1:1 in organic solvent N,N-two The reaction was carried out in methylamide, the reaction temperature was 110°C, and the reaction time was 8h;

[0037] Then, under the action of triethylamine (making the molar ratio of triethylamine and compound I be 2:1.1), the obtained compound F, compound G or compound H is respectively mixed with compound I in a molar ratio of 1:1.1. In the organic solvent dichloromethane, heated to reflux at 40°C for 6h to obtai...

Embodiment 2

[0039] Example 2, preparation of a polymer metal binder containing 3,4-dihydropyrimidin-2-one structure:

[0040] 1) According to image 3 The synthetic route diagram in prepares the monomer 4 that contains aldehyde group and β-diketone structure, concrete steps are as follows: under the effect of potassium carbonate and sodium iodide (make the mol ratio of potassium carbonate and compound B be 2:1.1, make iodine The molar ratio of sodium chloride and compound B is 1:1.1), compound J and compound C are reacted in the organic solvent N,N-dimethylamide at a molar ratio of 1.1:1, and the reaction temperature is 110°C. The time is 8h;

[0041] Then, under the action of triethylamine (making the mol ratio of triethylamine and compound I be 2:1.1), the obtained compound K and compound I are in the organic solvent dichloromethane in the molar ratio of 1:1.1, Heat to reflux at 40°C for 6h to obtain monomer 4;

[0042] 2) The monomer 4 obtained in step 1) and 0.125mmol / L aqueous ure...

Embodiment 3

[0043] Embodiment 3, bonding experiment between metal materials:

[0044] 1) Dissolve 1.2g of urea in water, and obtain 3mL urea 0.125mmol / L aqueous solution at constant volume;

[0045] 2) Drop 37 μL of urea aqueous solution on the surface of the metal sheet in a 1cm×1cm area, and volatilize to form a film;

[0046] 3) Drop about 40 mg of monomer 1, monomer 2, monomer 3 or monomer 4 obtained in step 1) of Example 1 on the film, and press the two metal sheets tightly;

[0047] 4) Heat the two compressed metal sheets at 130°C for 20 minutes, take them out and cool to room temperature, and then bond the two metal sheets together;

[0048] Tensile test: The multi-function digital testing machine controlled by the computer is used to test the bond shear strength:

[0049]The polymer metal adhesive containing 3,4-dihydropyrimidin-2-one structure obtained from monomer 1 has an adhesive strength of 1.2 MPa to aluminum sheets, 1.4 MPa to stainless steel sheets, and 1.4 MPa to copper...

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Abstract

The invention discloses a high-polymer metal adhesive containing 3,4-dihydropyrimidyl-2-one structure, and a preparation method and application thereof. The method comprises the following step: carrying out Biginelli reaction on a compound containing formyl group and beta-dione and a compound A. The metal adhesive has the advantages of simple preparation technique, controllable technological parameters, abundant sources of raw materials required by preparation, and low price, implements monomer polymerization curing by the Biginelli reaction so as to achieve the bonding effect, and has favorable bonding effect on metal materials. The bonding shear strength is 1.2 MPa above. The metal adhesive has the characteristics of short bonding lime and favorable temperature tolerance, and can easily implement large-scale industrial production.

Description

technical field [0001] The invention belongs to the field of polymer metal adhesives, and in particular relates to a polymer metal adhesive containing a 3,4-dihydropyrimidin-2-one structure and a preparation method and application thereof. Background technique [0002] Adhesive is a general term for various stress materials that connect or bond the same or different materials. Most of them are made of polymer substances, and rely on chemical reactions or physical actions to achieve curing and achieve the purpose of bonding. Adhesives currently on the market mainly include epoxy resins, cyanoacrylates, phenolic resins, and urea-formaldehyde resins. The bonding principle of the adhesive is mostly to form a strong intermolecular force, a hydrogen bond or a certain covalent bond between the two surfaces of the adhesive so as to closely bond the two surfaces. [0003] For metal adhesives, the adhesives currently on the market are mostly epoxy adhesives with a relatively long cur...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G12/12C09J161/24C09J5/06
Inventor 陶磊危岩赵原
Owner TSINGHUA UNIV
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