High-performance organic silicon resin-polymethyl methacrylate composite material mixed with nanometer silicon nitride for LED package, and preparation method of high-performance organic silicon resin-polymethyl methacrylate composite material

A polymethyl methacrylate and nano-silicon nitride technology, which is applied in the field of high-performance silicone resin-polymethyl methacrylate composite material and its preparation, can solve the problems of low mechanical strength, poor ultraviolet radiation resistance, and resistance to ultraviolet radiation. Thermal aging, low thermal expansion coefficient, etc., to achieve the effects of good mechanical properties, long service life and good compatibility

Inactive Publication Date: 2015-10-28
朱志
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AI Technical Summary

Problems solved by technology

[0003] At present, the performance requirements of high-power LEDs on the market for packaging materials mainly include: high refractive index, high light transmittance, high thermal conductivity, UV resistance, heat aging resistance, and low thermal expansion coefficient, etc. China's silicone packaging materials mainly rely on imported

Method used

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Examples

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Example Embodiment

[0014] Example

[0015] The composite material of this embodiment is prepared from the following raw materials in parts by weight: phenyltrimethoxysilane 70, silicone vinyl double capping agent 0.4, silicone hydrogen-containing double capping agent 0.2, tetramethyltetraphenyl ring Tetrasiloxane 10, tetramethylammonium hydroxide 0.2, octamethylcyclotetrasiloxane 12, 2 phenylbutynol 3, erucamide 0.1, toluene 50, platinum catalyst 0.01, 30% dilute Hydrochloric acid 0.5, deionized water 5, methyl methacrylate 12, 20% solid content silica sol 10, graphene 0.1, silane coupling agent kh550 0.1, nano silicon nitride 2, magnesium sulfate whisker 2, peroxide Dibenzoyl 0.01.

[0016] The method for preparing the high-performance silicone resin polymethyl methacrylate composite material mixed with nano silicon nitride for LED packaging is:

[0017] (1) First, tetramethyltetraphenylcyclotetrasiloxane and octamethylcyclotetrasiloxane are vacuum dehydrated under stirring conditions, and then 0.2 ...

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Abstract

The invention discloses a high-performance organic silicon resin-polymethyl methacrylate composite material mixed with nanometer silicon nitride for LED package. The composite material is a high-performance material which is formed by polymerization and curing of vinylphenyl silicone oil, hydrogen containing silicon resin, vinyl silicone resin and methyl methacrylate and has the hybrid advantages of organic silicon resin and polymethyl methacrylate; besides, powder formed by compounding nanometer silicon nitride which is mixed in the composite material, surface-treated with a silane coupling agent and wrapped by silica sol, magnesium sulfate whiskers and grapheme is good in compatibility with resin, and high in surface activity, after the powder is uniformly dispersed in the resin, the refractive index, the heat-conducting property, the heat dissipation performance, the high-temperature oxidation resistance, the insulation performance and other performance of the composite material can be improved greatly, and the prepared material is high in mechanical property, long in service life, high in transparency, and excellent in optical performance.

Description

technical field [0001] The invention relates to the technical field of LED packaging materials, in particular to a high-performance organic silicon resin-polymethyl methacrylate composite material mixed with nanometer silicon nitride for LED packaging and a preparation method thereof. Background technique [0002] LED packaging refers to the packaging of light-emitting chips, which plays a key role in the LED industry chain. The packaging materials used are used to fix and protect the chip from environmental temperature, humidity, external mechanical vibration, impact and other factors. To change the component parameters, on the other hand, it is to reduce the gap between the chip and the refractive index of the air to increase the light efficiency and dissipate the generated heat in time. Commonly used packaging materials mainly include epoxy resin, modified epoxy resin and silicone resin. Epoxy resins are mainly used for low-power LED packaging materials, which are...

Claims

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Application Information

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IPC IPC(8): C08L83/07C08L83/05C08L33/12C08K9/06C08K9/10C08K7/08C08K3/34C08K3/04
Inventor 朱志
Owner 朱志
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