High-performance organic silicon resin-polymethyl methacrylate composite material mixed with nanometer silicon nitride for LED package, and preparation method of high-performance organic silicon resin-polymethyl methacrylate composite material

Abstract

The invention discloses a high-performance organic silicon resin-polymethyl methacrylate composite material mixed with nanometer silicon nitride for LED package. The composite material is a high-performance material which is formed by polymerization and curing of vinylphenyl silicone oil, hydrogen containing silicon resin, vinyl silicone resin and methyl methacrylate and has the hybrid advantages of organic silicon resin and polymethyl methacrylate; besides, powder formed by compounding nanometer silicon nitride which is mixed in the composite material, surface-treated with a silane coupling agent and wrapped by silica sol, magnesium sulfate whiskers and grapheme is good in compatibility with resin, and high in surface activity, after the powder is uniformly dispersed in the resin, the refractive index, the heat-conducting property, the heat dissipation performance, the high-temperature oxidation resistance, the insulation performance and other performance of the composite material can be improved greatly, and the prepared material is high in mechanical property, long in service life, high in transparency, and excellent in optical performance.

Description

technical field [0001] The invention relates to the technical field of LED packaging materials, in particular to a high-performance organic silicon resin-polymethyl methacrylate composite material mixed with nanometer silicon nitride for LED packaging and a preparation method thereof. Background technique [0002] LED packaging refers to the packaging of light-emitting chips, which plays a key role in the LED industry chain. The packaging materials used are used to fix and protect the chip from environmental temperature, humidity, external mechanical vibration, impact and other factors. To change the component parameters, on the other hand, it is to reduce the gap between the chip and the refractive index of the air to increase the light efficiency and dissipate the generated heat in time. Commonly used packaging materials mainly include epoxy resin, modified epoxy resin and silicone resin. Epoxy resins are mainly used for low-power LED packaging materials, which are...

AI Technical Summary

Problems solved by technology

[0003] At present, the performance requirements of high-power LEDs on the market for packaging materials mainly include: high refractive index, high light transmittance, high thermal conductivity, UV resistance, heat aging resistance, and low thermal expansion coefficient, etc. China's silicone packaging materials mainly rely on imported products, and these products still have many defects, such as low mechanical strength, poor resistance to ultraviolet radiation, refractive index, light transmittance, thermal conductivity, and the concentration of modified fillers in silicone resins. Dispersion, compatibility, stability after encapsulation, etc. need to be further improved