Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Preparation method of fluororesin-containing modified polyimide film

A polyimide film and polyimide technology are applied in the field of preparation of polymer films for the electronics and motor industries, and can solve the problems of high viscosity of polyamic acid, decreased mechanical properties of the film, foaming and the like, and achieve high resistance to Corona performance, not easy to bond and delaminate, good comprehensive performance

Active Publication Date: 2016-02-17
NANJING UNIV OF SCI & TECH
View PDF6 Cites 11 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The problem with the first type of film is that the adhesion delamination and blistering between the fluororesin film or coating and the polyimide film are prone to occur at high temperatures
The problem with the second type of film is that due to the high viscosity of polyamic acid, it is difficult to achieve uniform dispersion of inorganic fillers in polyamic acid, especially in industrial production, the amount of filler added is likely to be limited or eventually The problem that the mechanical properties of the obtained film are greatly reduced

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] In the first step, 1.0 mol of diaminodiphenyl ether was dissolved in N-methylpyrrolidone in a four-neck flask filled with nitrogen, equipped with a thermometer and a stirrer. After it was completely dissolved, the reaction temperature was lowered to 10° C., and then 1.0 mol of pyromellitic dianhydride was added in 6 times within 1 hour to control the solid content of the reaction system to 15%. The polyamic acid solution (I) can be obtained by constant temperature reaction for 3 hours after the addition of the dianhydride monomer. Add polytetrafluoroethylene (PTFE) powder with a particle diameter of 500nm into the polyamic acid solution (I), and the addition amount is 62% of the mass of the polyamic acid solution (I). Subsequently, a mixed solvent of N-methylpyrrolidone and 3,5,5-trimethyl-2-cyclohexenone with a volume ratio of 1:1 was added, and the amount of the mixed solvent was polyimide solution (I) 20% of the mass. The mixed system was ground in a ball mill for ...

Embodiment 2

[0023] In the first step, in a four-necked flask with nitrogen, a thermometer and a stirrer, 0.40mol of diaminodiphenyl ether and 0.60mol of 2,2-bis[4-(4-aminophenoxy) Phenyl]butane was dissolved in N,N-dimethylacetamide. After it was completely dissolved, the reaction temperature was lowered to 10°C, and then 0.7mol of pyromellitic dianhydride and 0.34mol of 3,3',4,4'-biphenyltetracarboxylic dianhydride, and control the solid content of the reaction system to 17%. After adding the dianhydride monomer, react at constant temperature for 5 hours to obtain the polyamic acid solution (I). The mixed powder of polytetrafluoroethylene (PTFE) and ethylene-chlorotrifluoroethylene copolymer (ECTFE) with a particle size of 5 μm and a mass ratio of 1:1 is added to the polyamic acid solution (I), in an amount of 80% of polyamic acid solution (I) quality. Subsequently, a mixed solvent of N-methylpyrrolidone and 3,5,5-trimethyl-2-cyclohexenone with a volume ratio of 1:1 was added, and the ...

Embodiment 3

[0026] In the first step, in a four-necked flask with nitrogen, a thermometer and a stirrer, 0.70 mol of diaminodiphenyl ether, 0.15 mol of 1,3-bis(4-aminophenoxy)benzene and 0.15 mol of p-phenylenediamine was dissolved in N,N-dimethylformamide, after it was completely dissolved, the reaction temperature was lowered to 10°C, and then 0.50 mol of pyromellitic dianhydride was added in 6 times within 1 hour , 0.30 mol of 3,3',4,4'-biphenyltetracarboxylic dianhydride and 0.22 mol of tribenzoic acid triphenylene ether tetracarboxylic dianhydride, and the solid content of the reaction system was controlled to be 16%. After the addition of the dianhydride monomer, react at a constant temperature for 4 hours to obtain a polyamic acid solution (I). Particle diameter is that 400nm, mass ratio is the polytetrafluoroethylene (PTFE) of 1:1 and the mixed powder of polyvinyl fluoride (PVF) joins in this polyamic acid solution (I), and addition is polyamic acid solution ( 1) 55% of mass. Su...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Particle sizeaaaaaaaaaa
Tensile strengthaaaaaaaaaa
Initial decomposition temperatureaaaaaaaaaa
Login to View More

Abstract

The invention discloses a preparation method of a fluororesin-containing modified polyimide film. The preparation method specifically comprises the following steps of firstly, adding ultrafine fluororesin powder into a precursor polyamide acid solution of polyamide; then, adding and stirring a mixed solvent of N-methyl pyrrolidone and 3,5,5-trimethyl-2-cyclohexenone to form a sizing agent; mixing the sizing agent with the polyamide acid solution in an appropriate amount, and simultaneously adding a chemical imidization additive to form a polyamide acid blended solution after high-speed stirring; coating, drying and imidizing the blended solution to obtain a modified polyimide film material. The modified polyimide film prepared by the invention has excellent corona resistance while the characteristics of high strength, high heat resistance and the like of polyimide are maintained, the stability and the durability of the polyimide film in an electric field can be increased, and the polyimide film can be well applied to the fields of a high-speed motor and the like.

Description

technical field [0001] The invention relates to the field of preparation of polymer films used in electronics and motor industries, in particular to a preparation method of a corona-resistant polyimide film. Background technique [0002] Due to its high strength, high heat resistance, low dielectric constant, outstanding chemical corrosion resistance and other advantages, polyimide film has a wide range of applications in aerospace, high-speed rail, electronics, motors and other fields. In recent years, with the rapid development of high-speed railways and subways, higher requirements have been placed on the performance of high-power traction locomotive motors. A problem worthy of special attention is that under high voltage, the weak part of the motor insulation is prone to corona, which greatly reduces the running stability and service life of the motor. Therefore, it has become a development trend to prepare corona-resistant polyimide films to wrap copper flat wires, and...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C08J5/18C08L79/08C08L27/18C08L23/08C08L27/14C08G73/10
CPCC08G73/1007C08G73/1032C08G73/1071C08J5/18C08J2379/08C08J2427/18C08L79/08C08L2205/02C08L2205/03C08L27/18C08L23/0892C08L27/14
Inventor 徐勇张茜茜杨宇李林霜
Owner NANJING UNIV OF SCI & TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com