Annular-gate single-photon avalanche diode capable of preventing edge breakdown and preparation method of annular-gate single-photon avalanche diode capable of preventing edge breakdown
A single-photon avalanche, photodiode technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as guard ring depletion, incompatibility, device performance degradation, etc., to improve detection efficiency and device performance. , the effect of reducing lattice defects
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Embodiment 1
[0039] Embodiments of the present invention provide a single photon avalanche diode detector structure that can effectively suppress edge breakdown and is compatible with a standard CMOS process. The detector consists of a N-well in a deep N-well + / P-well structure built photodiode and ring gate electrode. When the device is working, the voltage on the ring gate is added to reduce the electric field at the edge of the photosensitive area, thereby suppressing edge breakdown. In addition, the device structure proposed by the embodiments of the present invention can also flexibly adjust the gate voltage, so that the SPAD can adapt to different overbias voltages.
[0040] The structure of the single photon avalanche diode detector described in the embodiment of the present invention is as follows: figure 1 shown. detector by N + / P-well constitutes the photosensitive area, and by controlling the N + / P-well type photodiode around the ring gate voltage to weaken the fringe el...
Embodiment 2
[0044] For ease of description, the embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings. figure 1 and figure 2 are the cross-section and top view of the detector respectively, for the convenience of explanation, figure 2 The oxide layer 8 and the metal electrodes 10, 11, 12 and 13 are not shown.
[0045]In the illustration, 1 is the substrate. The substrate material is a P-type lightly doped silicon wafer, which is used as the supporting part of the designed single photon avalanche diode. In the illustration, 2 is a deep N well. On the one hand, the deep N well is used as a local substrate of the photodiode, and on the other hand, it is also used to realize the mutual isolation of the detector and other electronic devices. In the illustration, 3 is the P well region, and the P well adopts a medium doping concentration. In the illustration, 4 is a heavily doped N region, which together with the above...
Embodiment 3
[0067] The embodiment of the present invention also provides a method for manufacturing the photodetector, the main process steps of which include:
[0068] 1) A lightly doped deep N well 2 is formed on a P-type lightly doped silicon substrate 1 by using standard CMOS processes such as oxidation, photolithography, ion implantation, and annealing, so as to realize electrical isolation from other electronic devices and avoid their mutual influences;
[0069] 2) Prepare a moderately doped P-type well region 3 in the above-mentioned deep N well region, and then regenerate a silicon dioxide thin layer;
[0070] 3) Fabricate the annular polysilicon gate 9 . First, a layer of polysilicon is deposited on the newly grown gate oxide layer by chemical vapor deposition (CVD), and then the pattern of the polysilicon gate 9 is prepared by dry etching technology;
[0071] 4) Prepare N-type heavily doped contact region 4 in P-type well region 3 to form N + / P-well type photodiode, the N-ty...
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