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Low temperature curable bottom filling adhesive with heat transfer function and preparation method thereof

A technology of underfill glue and thermally conductive filler, which is applied in the direction of chemical instruments and methods, heat exchange materials, adhesives, etc., can solve the problems of low thermal conductivity, low thermal expansion coefficient, and low shrinkage rate of underfill glue, and achieve high adhesion Strength, excellent heat dissipation performance, and mechanical shock resistance

Inactive Publication Date: 2017-05-31
NANJING NUOBANG NEW MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved by the present invention is to overcome the shortcomings of the prior art, propose a low-temperature curing underfill with thermal conductivity and its preparation method, and solve the defects of the existing underfill such as small thermal conductivity, low-temperature storage, and high-temperature curing. ;The filler has a high thermal conductivity (excellent heat dissipation performance), and has a low thermal expansion coefficient, and a low shrinkage rate that is more compatible with the chip, which can avoid cracks caused by deformation of the multi-layer chip due to thermal shock

Method used

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  • Low temperature curable bottom filling adhesive with heat transfer function and preparation method thereof
  • Low temperature curable bottom filling adhesive with heat transfer function and preparation method thereof
  • Low temperature curable bottom filling adhesive with heat transfer function and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0037] This embodiment provides a preparation and application process of a low-temperature curing underfill with heat conduction function. The preparation method of the underfill includes the following steps:

[0038] (1) Add γ-glycidyl etheroxypropyl trimethoxysilane: 4.6 parts in ethanol solvent, adjust the pH value to 3.2 with oxalic acid, and after hydrolysis reaction at room temperature for 60 minutes, add spherical alumina 180 with a particle size of 1.5 μm Parts, 410 parts of spherical alumina of 45 μm, kept the system temperature at 50°C for 4 hours, then filtered, washed with toluene, and dried in vacuum at 60°C for 24 hours;

[0039] (2) Weigh 90 parts of bisphenol E diglycidyl ether, 10 parts of bisphenol F diglycidyl ether, 15 parts of trimethylolpropane triglycidyl ether, 14 parts of Kane MX125 and 6 parts of polyvinyl alcohol were added to the reaction kettle, the stirring speed was 450r / min, the temperature of the system was heated to 50°C, and stirred for 70 m...

Embodiment 2

[0043] This embodiment provides a preparation and application process of a low-temperature curing underfill with heat conduction function. The preparation method of the underfill includes the following steps:

[0044] (1) Add β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane: 4.2 parts in the ethanol solvent, adjust the pH value to 4 with oxalic acid, and after 40 minutes of hydrolysis at room temperature, add a particle size of 0.8 165 parts of spherical alumina of μm, 390 parts of spherical alumina of 40 μm, keep the system temperature at 40°C for 4.5h, filter, wash with toluene, and dry in vacuum at 60°C for 24h;

[0045] (2) Weigh 70 parts of bisphenol E diglycidyl ether, 30 parts of polybutadiene epoxy resin, 10 parts of glycidyl caprylate, 8 parts of Kane MX153, 7 copies of Kane Add MX154, 11 parts of sodium alkylsulfonate, and 4 parts of phenylethyl alcohol oleate into the reaction kettle, stir at 600r / min, heat the system to 45°C, and stir for 60 minutes to obtain a homo...

Embodiment 3

[0049] This embodiment provides a preparation and application process of a low-temperature curing underfill with heat conduction function. The preparation method of the underfill includes the following steps:

[0050] (1) Add 3.2 parts of β-(3,4-epoxycyclohexyl)ethyltriethoxysilane to the ethanol solvent, adjust the pH value to 4 with oxalic acid, and after hydrolysis reaction at room temperature for 45 minutes, add a particle size of 130 parts of 0.5 μm spherical alumina, 320 parts of 35 μm spherical alumina, maintain the system temperature at 45°C for 3 hours, filter, wash with toluene, and dry in vacuum at 60°C for 24 hours;

[0051] (2) Weigh 85 parts of bisphenol E diglycidyl ether, 15 parts of bisphenol A diglycidyl ether, 25 parts of cresyl glycidyl ether, 13 parts of Kane MX170, 16 parts of sodium polyacrylate, and 8 parts of GPES type defoamer were added to the reaction kettle, the stirring speed was 300r / min, the temperature of the heating system was 50°C, and stirr...

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Abstract

The invention relates to low temperature curable bottom filling adhesive with heat transfer function, comprising component A and component B; the component A is made from 100 parts of epoxy resin, 10-35 parts of modified epoxy resin, 0.5-5 parts of epoxy modified silicone oil, 5-15 parts of active diluent, 250-600 parts of heat transfer filler, 0.5-2 parts of a dispersant, 0.5-2 parts of a defoaming agent, and 0.2-4 parts of a rheological agent; the component B is made from 100 parts of liquid epoxy curing agent, 8-20 parts of a toughening agent, 250-600 parts of heat transfer filler, 0.5-5 parts of epoxy modified silicone oil, 0.5-2 parts of an adhesion promoter, 0.5-2 parts of a dispersant, 1-4 parts of a rheological agent, and 0.5-2 parts of a defoaming agent. The defects of low heat transfer coefficient, low temperature storage, high temperature curing and the like in existing filling adhesive can be overcome, and a chip packaged and cured by 3D MCP has high adhesive strength, good resistance to mechanical impact and good radiating performance.

Description

technical field [0001] The invention relates to the technical field of packaging adhesives in the semiconductor industry and their applications, in particular to the preparation and application process of underfill adhesives capable of fast low-temperature curing and having a heat conduction function for chip packaging technology. Background technique [0002] Electronic information, image processing, and mass data storage have become increasingly important today. Electronic storage tools represented by solid-state drives have very fast data transmission speeds, but this type of hard drive with a width of 2.5 inches is used to accommodate memory chips. The space of the hard disk is relatively limited, and the chip with higher capacity can increase the overall storage space of the hard disk, but the higher cost also increases the price of the hard disk. [0003] NAND flash memory is a better storage solution than hard drives, and NAND is rapidly gaining prominence as people c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/02C09J163/00C09J11/04C09K5/14
CPCC08K2201/014C08L2203/206C08L2205/025C08L2205/035C09J11/04C09J163/00C09K5/14C08L63/00C08K13/06C08K9/06C08K7/18C08K3/36C08K3/346
Inventor 刘兵刘勇
Owner NANJING NUOBANG NEW MATERIAL CO LTD
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