Heat-resistant and anti-corrosion 3D printing material for electronic engineering and preparation method thereof

Abstract

The invention discloses a heat-resistant and anti-corrosion 3D printing material for electronic engineering. The heat-resistant and anti-corrosion 3D printing material for electronic engineering comprises the following raw materials: modified polyphenylene sulfide, ethylene-propylene-diene monomer rubber, butadiene styrene rubber, epoxy resin, polyurethane acrylate, tripolycyanamide hydrobromide, ethylene-propylene-diene monomer rubber, ammonium polyphosphate, aluminum hydroxide, talcum powder, mica iron oxide, zinc oxide, magnesium oxide, asbestos fiber, glass fiber, nano-sized titanium dioxide, ethyl orthosilicate, a silane coupling agent KH-560, trioctyl trimellitate, sodium stearate, dioctyl phthalate, dicumyl peroxide, m-xylylenediamine, phenylpropyl triazole, ammonium polyphosphate, dimethyl methylphosphate, liquid paraffin, a phase solvent, an antioxidant, a defoaming agent and a modified filler. The invention further provides a preparation method of the heat-resistant and anti-corrosion 3D printing material for electronic engineering. The 3D printing material prepared according to the preparation method provided by the invention has excellent heat resistance and corrosion resistance and high in mechanical properties.

Description

technical field [0001] The invention relates to the technical field of 3D printing materials, in particular to a heat-resistant and anti-corrosion 3D printing material for electronic engineering and a preparation method thereof. Background technique [0002] Polyphenylene sulfide is a thermoplastic material with excellent properties. According to its structure, it is mainly divided into two types: polymer linear type and bridging type. Linear polyphenylene sulfide has good dimensional stability due to acid, alkali and high temperature resistance. The nutritional range is relatively wide. Polyphenylene sulfide was developed in the late 20th century with good heat resistance, superior chemical corrosion resistance and flame retardancy, excellent electrical insulation properties and good dimensional stability, but due to the molecular structure of polyphenylene sulfide resin Sulfur exists in a divalent state. The electrons in the outermost layer of sulfur are unstable, and it ...

AI Technical Summary

Problems solved by technology

Polyphenylene sulfide was developed in the late 20th century with good heat resistance, superior chemical corrosion resistance and flame retardancy, excellent electrical insulation properties and good dimensional stability, but due to the molecular structure of polyphenylene sulfide resin Sulfur exists in a divalent state. The electrons in the outermost layer of sulfur are unstable, and it is easy to lose electrons and combine with oxygen, resulting in oxidative degradation, macromolecular breakage, and macroscopic manifestations of material aging, damage, and shortened service life, so its application is limited.

However, polyphenylene sulfide is one of the 3D printing materials, and its heat-resistant and anti-corrosion properties cannot meet the needs of actual use. Therefore, it is urgent to design a heat-resistant and anti-corrosion 3D printing material for electronic engineering to solve the problems in the prior art.

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