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Curing agent for carboxyl resin, preparation method and composition applying curing agent

A technology of carboxyl resin and curing agent, which is applied in the field of curing agent for carboxyl resin and its preparation, can solve the problems such as the inability to apply a light curing system, and achieves the effects of avoiding mass generation, avoiding by-products, and high yield

Active Publication Date: 2018-09-07
HUANGSHAN HUAHUI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Curing agents with epoxy groups or alkenyl double bond groups are more common in the field of powder coatings. As CN107418287A discloses a method for manufacturing a coating curing agent and its application in coatings, the coating curing agent includes at least benzoic acid Triglycidyl triformate, but it can also include diglycidyl trimesate, using trimesic acid and allyl chloride to undergo a substitution reaction under the action of an alkali, and then undergo an epoxidation reaction under the action of hydrogen peroxide to obtain All curing agent products with epoxy groups are used in powder coatings as polyester curing agents, but not in light-curing systems

Method used

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  • Curing agent for carboxyl resin, preparation method and composition applying curing agent
  • Curing agent for carboxyl resin, preparation method and composition applying curing agent
  • Curing agent for carboxyl resin, preparation method and composition applying curing agent

Examples

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Embodiment 1

[0047] A curing agent for carboxyl resin, which is made by reacting phenyl polyacid, phenyl polyphenol, sodium hydroxide, allyl bromide, and epichlorohydrin as main raw materials. The raw materials include: trimellitic acid 7mol, phloroglucinol 4mol, sodium hydroxide 40mol, allyl bromide 12mol, epichlorohydrin 35mol, methimazole 0.5mol, 1-(4-fluorophenyl) biguanide 1.5mol;

[0048] Prepared by a method comprising the following steps:

[0049] (1) Preparation of sodium salt: Add pyromellitic acid and catechol to the reaction kettle, add aqueous sodium hydroxide solution, and raise the temperature to 70°C under stirring conditions for full neutralization reaction. After 3 hours, the reaction The final material was spray-dried to obtain a white powdery solid (water content less than 0.3%);

[0050] (2) Preparation of intermediate: Add the white solid, catalyst A and solvent n-hexane obtained in step (1) into the reactor, and heat it to reflux under stirring; slowly add allyl bromi...

Embodiment 2

[0053] A curing agent for carboxyl resin, which is made by reacting phenyl polyacid, phenyl polyphenol, sodium hydroxide, allyl bromide, and epichlorohydrin as main raw materials. The raw materials include the following: pyromellitic acid 2 mol of dianhydride, 8 mol of phthalic acid, 7 mol of resorcinol, 35 mol of sodium hydroxide, 14 mol of allyl bromide, 31.8 mol of epichlorohydrin, 0.3 mol of benzimidazole, 1.9 mol of metformin hydrochloride;

[0054] Prepared by a method comprising the following steps:

[0055] (1) Preparation of sodium salt: Add pyromellitic dianhydride, trimellitic acid, and resorcinol into the reaction kettle, add aqueous sodium hydroxide solution, and heat it up to 60°C under stirring conditions for full neutralization After 2 hours of reaction, the reacted material was spray-dried to obtain a white powdery solid (water content less than 0.3%);

[0056] (2) Preparation of intermediate: Add the white solid, catalyst A and solvent n-hexane obtained in s...

Embodiment 3

[0059] A curing agent for carboxyl resin, which is made by reacting phenyl polyacid, phenyl polyphenol, sodium hydroxide, allyl bromide, and epichlorohydrin as main raw materials. The raw materials include trimesic acid 5mol, isophthalic acid 6mol, catechol 6mol, sodium hydroxide 24.2mol, allyl bromide 18mol, epichlorohydrin 39mol, methimazole 0.7mol, metformin hydrochloride 1.1mol;

[0060] Prepared by a method comprising the following steps:

[0061] (1) Preparation of sodium salt: Add trimesic acid, isophthalic acid, and hydroquinone to the reaction kettle, add aqueous sodium hydroxide solution, and heat it up to 80°C under stirring conditions to fully neutralize the reaction. After 1 h, the reacted material was spray-dried to obtain a white powdery solid (water content less than 0.3%);

[0062] (2) Preparation of intermediate: Add the white solid, catalyst A and solvent n-hexane obtained in step (1) into the reactor, and heat it to reflux under stirring; slowly add allyl ...

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PUM

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Abstract

The invention provides a curing agent for carboxyl resin as well as a preparation method and an application of the curing agent. The curing agent is prepared from main raw materials including phenyl polyacid, phenyl polyphenol, sodium hydroxide, allyl bromide, epichlorohydrin and a catalyst through joint reaction. The curing agent contains both epoxy groups and double-bond groups, so that the curing agent can be subjected to a reaction with carboxyl groups in branch chains of carboxyl acrylic resin and can also be subjected to a reaction with double bonds remaining in main chains, and a densefilm with higher crosslinking density is formed.

Description

technical field [0001] The invention belongs to the technical field of curing agents, and in particular relates to a curing agent for carboxyl resins and a preparation method thereof. Background technique [0002] In recent years, as the country attaches great importance to environmental protection, coating film protection materials on metal, wood and other substrates have become more and more important. Therefore, environmentally friendly materials such as UV curing materials, powder coatings and water-based coatings have attracted much attention. For example, solder resist ink in photocurable materials is a layer of coating film printed on PCB circuit boards to cover surface circuits. Compared with traditional solvent-based inks and heat-curable inks, it has fast curing speed, energy saving, and environmental protection. With the advantages of friendliness and wide applicability, it is widely used in energy chemical industry, machinery manufacturing, electronic appliances ...

Claims

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Application Information

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IPC IPC(8): C08G63/91C08G63/133C09D133/00C09D5/03C09D7/65C09D11/107
CPCC08G63/127C08G63/133C08G63/914C09D5/033C09D11/107C09D133/00C08L67/07
Inventor 林光伟杨志萍何领王永垒叶敏汤增荣
Owner HUANGSHAN HUAHUI TECH
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