Preparation method of tungsten/copper layer composite material based on surface nanocrystallization of tungsten sheet
A composite material and nano-technology, which is applied in the field of the preparation of mutually insoluble metal tungsten/copper layered composite materials, can solve the problems of destroying the consistency of the system components, unable to use large-scale, difficult to control the coating, etc., and achieve the production cost. Inexpensive, easy to operate, good binding effect
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[0029] Example 1: Preparation of a tungsten / copper layered composite material based on the surface nanocrystallization of a tungsten sheet, the steps are as follows:
[0030] Step 1. Pre-treatment of tungsten sheet:
[0031] Take the 25×20×0.1mm tungsten sheet (purity ≥99.95wt%) as the sample, and use 800#, 1000# and 1500# metallographic sandpaper to smooth the sample. Each time the sandpaper is changed, the sample is polished. Rotate the direction by 90°, until the previous polishing traces completely disappeared, and finally there are only 1500# sandpaper polishing traces on the surface of the tungsten sheet; after polishing, polish the polished tungsten sheet with 0.5μm diamond polishing agent, and then separate them in acetone and isocyanate. Ultrasonic cleaning in propanol and methanol for 10 minutes to achieve the purpose of degreasing, and finally ultrasonic cleaning in absolute ethanol and ultrapure water for 10 minutes. After cleaning, put it in a vacuum drying oven for 2...
Example Embodiment
[0055] Example 2. Preparation of a tungsten / copper layered composite material based on the surface of a tungsten sheet. The steps are basically the same as that of Example 1, except that: in step 4, the plating time is 45 minutes, and the final tungsten / copper layered composite The surface of the composite material is smooth and bright, and the thickness of the copper metal layer is about 6.2μm. After the cross-cut test and the thermal shock test, the copper metal layer has no peeling or peeling phenomenon, and the bonding force with the tungsten matrix is good.
Example Embodiment
[0056] Example 3. Preparation of a tungsten / copper layered composite material based on the surface nanocrystallization of a tungsten sheet. The steps are basically the same as in Example 1, except that: in step 4, the plating temperature is controlled at 60°C, and the final tungsten / copper The surface of the layered composite material is smooth and bright, and the thickness of the copper metal layer is about 5.2 μm. After the cross-cut test and the thermal shock test, the copper metal layer has no peeling or peeling phenomenon, and the bonding force with the tungsten matrix is good.
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