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Preparation method of tungsten/copper layer composite material based on surface nanocrystallization of tungsten sheet

A composite material and nano-technology, which is applied in the field of the preparation of mutually insoluble metal tungsten/copper layered composite materials, can solve the problems of destroying the consistency of the system components, unable to use large-scale, difficult to control the coating, etc., and achieve the production cost. Inexpensive, easy to operate, good binding effect

Active Publication Date: 2018-09-25
TIANJIN UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Traditional connection / composite technologies (diffusion welding, brazing, etc.) often need to introduce third-party metals as intermediate layers, such as Ti, Ni, etc., which will destroy the consistency of system components, easily form hidden defects, and affect performance
In addition, currently commonly used tungsten-copper connection / composite technologies include plasma spraying, active metal casting, and chemical / physical vapor deposition. Disadvantages such as large-scale use

Method used

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  • Preparation method of tungsten/copper layer composite material based on surface nanocrystallization of tungsten sheet
  • Preparation method of tungsten/copper layer composite material based on surface nanocrystallization of tungsten sheet
  • Preparation method of tungsten/copper layer composite material based on surface nanocrystallization of tungsten sheet

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Effect test

Embodiment 1

[0029] Embodiment 1: the preparation of the tungsten / copper layered composite material based on the surface nanometerization of the tungsten sheet, the steps are as follows:

[0030] Step 1. Pretreatment of tungsten sheet:

[0031] Take a tungsten sheet (purity ≥ 99.95wt%) with a size of 25×20×0.1mm as the sample, and use 800#, 1000# and 1500# metallographic sandpaper to polish the sample in turn, and each time the sandpaper is changed, the The direction is rotated 90° until the previous grinding traces completely disappear, and finally only the grinding traces of 1500# sandpaper are left on the surface of the tungsten sheet; after the grinding is completed, the polished tungsten sheet is polished with 0.5 μm diamond polishing agent, and then polished in acetone and isophthalic acid respectively. Ultrasonic cleaning in propanol and methanol for 10 minutes to achieve the purpose of oil removal, and finally ultrasonic cleaning in absolute ethanol and ultrapure water for 10 minut...

Embodiment 2

[0055] Embodiment 2, the preparation of the tungsten / copper layered composite material based on the nanometerization of the surface of the tungsten sheet. The surface of the composite material is smooth and bright, and the thickness of the copper metal layer is about 6.2 μm. After the scratch test and thermal shock test, the copper metal layer has no peeling and peeling phenomenon, and the bonding force with the tungsten substrate is good.

Embodiment 3

[0056] Example 3, the preparation of tungsten / copper layered composite material based on nano-sized tungsten sheet surface, the steps are basically the same as in Example 1, the only difference is: in step 4, the electroplating temperature is controlled at 60°C, and the final tungsten / copper The surface of the layered composite material is flat and bright, and the thickness of the copper metal layer is about 5.2 μm. After the scratch test and thermal shock test, the copper metal layer has no peeling and peeling phenomenon, and the bonding force with the tungsten substrate is good.

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Abstract

A preparation method of a tungsten / copper layer composite material based on surface nanocrystallization of a tungsten sheet is disclosed. The method includes performing surface pretreatment on the tungsten sheet; performing two steps of anodic oxidation and hydrogen reduction annealing in order to obtain a tungsten sheet having a deeply deoxygenated surface nanometer porous structure; electroplating the surface of the tungsten sheet having the nanometer porous structure with copper; and finally subjecting a tungsten / copper electroplated sample to high-temperature diffusion annealing to obtainthe tungsten / copper layer composite material. During preparation, the nanometer porous structure on the surface of the tungsten sheet can increase the contact area and improve surface activity, and can play a role of mechanically meshing a copper layer. A thermal shock method and a cross cut method are adopted to detect whether the copper metal layer shows peeling and shedding phenomena or not. The preparation method has characteristics of a simple process, a stable and pollution-free electroplating solution, a high connection efficiency, a low production cost, and good repeatability, can prepare a tungsten / copper material having a complex shape and based on the inner surface of a workpiece, avoid influences of metal middle layers on material performance, and facilitate industrial application of the tungsten / copper composite material.

Description

technical field [0001] The invention relates to the technical field of metal layered composites, in particular to a method for preparing a mutually insoluble metal tungsten / copper layered composite material based on the nanometerization of the surface of a tungsten sheet. Background technique [0002] Plasma-oriented components are key material components of nuclear fusion engineering, which require materials with low ion beam sputtering rate, high temperature resistance and high thermal conductivity. Due to its high melting point, high hardness, resistance to neutron radiation, high thermal conductivity, low sputtering corrosion rate and stable chemical properties, tungsten is often selected as a high temperature resistant material and is widely used in aerospace, energy and electronics. applications, such as the lining of fuel nozzles, and has been identified as one of the hottest candidates for plasma-facing materials in fusion reactors. Metal copper has high thermal con...

Claims

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Application Information

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IPC IPC(8): C25D11/26C25D3/38C25D5/50
CPCC25D3/38C25D5/50C25D11/26
Inventor 黄远张洁王祖敏刘永长
Owner TIANJIN UNIV
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