Preparation method of tungsten/copper layer composite material based on surface nanocrystallization of tungsten sheet
A composite material and nano-technology, which is applied in the field of the preparation of mutually insoluble metal tungsten/copper layered composite materials, can solve the problems of destroying the consistency of the system components, unable to use large-scale, difficult to control the coating, etc., and achieve the production cost. Inexpensive, easy to operate, good binding effect
Active Publication Date: 2018-09-25
TIANJIN UNIV
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A preparation method of a tungsten/copper layer composite material based on surface nanocrystallization of a tungsten sheet is disclosed. The method includes performing surface pretreatment on the tungsten sheet; performing two steps of anodic oxidation and hydrogen reduction annealing in order to obtain a tungsten sheet having a deeply deoxygenated surface nanometer porous structure; electroplating the surface of the tungsten sheet having the nanometer porous structure with copper; and finally subjecting a tungsten/copper electroplated sample to high-temperature diffusion annealing to obtainthe tungsten/copper layer composite material. During preparation, the nanometer porous structure on the surface of the tungsten sheet can increase the contact area and improve surface activity, and can play a role of mechanically meshing a copper layer. A thermal shock method and a cross cut method are adopted to detect whether the copper metal layer shows peeling and shedding phenomena or not. The preparation method has characteristics of a simple process, a stable and pollution-free electroplating solution, a high connection efficiency, a low production cost, and good repeatability, can prepare a tungsten/copper material having a complex shape and based on the inner surface of a workpiece, avoid influences of metal middle layers on material performance, and facilitate industrial application of the tungsten/copper composite material.
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Property | Measurement | Unit |
Average pore size | 68.0 | nm |
Thickness | 5.2 | µm |
tensile | MPa | |
Particle size | Pa | |
strength | 10 |
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