Photosensitive resin composition, yellow light slurry and preparation method thereof

Abstract

The invention provides a photosensitive resin composition, comprising a macromolecular polymer composed of a plurality of monomer units, wherein the monomers forming the monomer units in the macromolecular polymer comprise a photopolymerization initiator, a hydrophilic monomer and a hydrophobic monomer, wherein the monomers are all compounds containing an olefinic double bond; and the yellow lightslurry prepared by using the photosensitive resin composition provided by the invention can be well matched with noble metal powder, is not easy to be delaminated and precipitated, can be self-initiated and self-crosslinking solidified, and can be used for preparing a substrate circuit with excellent conductivity, high resolution and good adhesion. In addition, the invention also provides a preparation method of a photosensitive resin composition, yellow light slurry and a preparation method thereof.

Description

technical field [0001] The invention relates to a photosensitive resin composition and belongs to the field of electronic materials. Background technique [0002] With the innovation of technology, the functions of electronic products are becoming more and more perfect, and "light", "thin" and "small" have become the development trend of electronic products. [0003] Hardware miniaturization, light weight, and integration are a system engineering, and the three parts of the circuit chip, passive components, and circuit substrate must be reduced at the same time. Among them, the chip technology relies on the yellow light process and follows Moore's law, from 90nm in 2003 to below 14nm today. This year, first-tier manufacturers, such as IBM, have begun to tackle key problems in the 5nm process. However, the performance improvement and size reduction of the chip alone cannot complete the "light", "thin" and "small" system engineering, because passive components (resistors, cap...

AI Technical Summary

Problems solved by technology

[0006] To improve the performance of the yellow light paste, the key point is to improve the performance of the photosensitive resin composition. The photosensitive resin composition currently on the market often uses an all-organic system, which has poor adaptability to inorganic metal powder. In the case of powder-to-filler ratio, homogeneous materials cannot be formed after mixing with each other, resulting in adverse phenomena such as stratification and precipitation, and finer nano-scale metal powders even agglomerate due to inability to disperse well

Part of the photosensitive resin has too strong coating on the metal powder, which leads to the inability of close contact between the metal powder after curing, and the inability to form a conductive network and conduct electricity.

A small number of photosensitive resin compositions that can be matched also cannot reflect the high-resolution characteristics of yellow light materials due to their low proportion. In case of a wide range of short circuits etc.

And due to the influence of the material and surface energy of the circuit board, after the photosensitive resin composition is cured, the predetermined bonding strength cannot be achieved, and a large area falls off after development, or the adhesion is insufficient, and the product durability test cannot be passed.

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