An aluminum-based diamond composite ultra-high hardness dicing knife and its manufacturing method

Abstract

The invention discloses an aluminum-based diamond composite ultra-high hardness dicing blade and a manufacturing method thereof. The ultra-high hardness dicing blade comprises three parts of a toughness ceramic skeleton, an aluminum alloy composite material and a diamond blade film layer; the toughness ceramic skeleton is specifically a toughened porous ceramic skeleton composed of silicon nitrideceramic body composite silicon carbide whiskers; the aluminum alloy composite material is specifically formed by secondly sintering 7A75 aluminum alloy mixed powder mixed with carbon powder and polyvinyl alcohol; the aluminum alloy composite material is wrapped with the toughness ceramic skeleton, and the diamond blade film layer is fixed to the surface of the aluminum alloy composite material. The blade has high surface hardness, good core toughness, crack resistance, high temperature resistance, good heat dissipation performance, good cutting performance and long service life.

Description

technical field [0001] The invention relates to the field of special materials, in particular to an aluminum-based diamond composite ultra-high hardness scribing knife and a manufacturing method thereof. Background technique [0002] The inner circle cutting technology is often used in the silicon wafer slicing process, which developed and matured in the late 1970s. As the diameter of the silicon wafer increases, the size of the inner circle blade required in the inner circle cutting process increases, and the tension force of the blade also increases accordingly. At the same time, the thickening of the cutting edge of the blade increases the cutting loss, and the high-speed cutting increases the damage layer on the surface of the silicon wafer and the loss of the tool. These shortcomings restrict the improvement of the efficiency of the inner circle cutting technology in the direction of large film diameter and the reduction of production costs. Coupled with the difficult...

AI Technical Summary

Problems solved by technology

However, wire cutting technology has obvious weaknesses compared with inner circle cutting technology. First, the average error of sheet thickness is relatively large (about twice that of inner circle cutting technology).

Second, it is not easy to realize intelligent detection and control in the cutting process

The third is that the success rate of the cutting process is high and the risk is high. Once the wire breaks and cannot be saved, a single crystal rod will be wasted directly

Fourth, single-chip quality control cannot be achieved. The cutting quality of a batch of wafers can only be detected after one cutting is completed, and the cutting quality between wafers is also different.

[0004] The slicing knives in the prior art are in a contradictory state due to their size, bonding force, strength and present. At present, there is no one with high surface hardness, good core toughness, crack resistance, high temperature resistance, good heat dissipation performance, and good cutting performance. Slicing knife for cutting semiconductors with long service life