An integrated structure of mems piezoelectric printing nozzle assembly

Abstract

The invention discloses an MEMS piezoelectric printing nozzle assembly integrated structure. An MEMS piezoelectric printing nozzle chip is disposed on one side of a silicon adapter substrate, and a packaging substrate is disposed on the other side of the silicon adapter substrate; a driving / control integrated circuit chip is disposed between the silicon adapter substrate and the packaging substrate; a heat sink is disposed on the other side of the packaging substrate, and one end of the packaging substrate is electrically connected to an electrical interface through a flexible circuit board; the MEMS piezoelectric print nozzle chip is formed by allowing silicon wafer bonding to form ink chambers arranged in an array; a nozzle is correspondingly disposed on the bottom of each ink chamber; and metal wiring layers disposed on the upper and lower surfaces of the silicon adapter substrate are electrically connected to TSV via holes extending through the silicon adapter substrate. The structure reduces the size of the integrated packaging of the print nozzle assembly, ensures the shortest electrical interconnect length and minimum interconnect resistance, reduces the Joule heat consumption of the print nozzle assembly through the small interconnect resistance, and reduces parasitic parameters such as interconnection resistance, capacitance and inductance, reduces signal transmissionloss, delay, and distortion, and can improve the performance of the printing head.

Description

technical field [0001] The invention belongs to the technical field of advanced electronic packaging, and in particular relates to an integrated structure of a MEMS piezoelectric printing nozzle assembly. Background technique [0002] The MEMS piezoelectric inkjet print head has the characteristics of high resolution and high scalability, and is especially suitable for emerging industrial market applications such as printed electronics, packaging, textiles, and 3D printing. Compared with using a whole piece of piezoelectric ceramic body material as a brake, the piezoelectric ceramic thin film deposited by sol-gel method or sputtering method can better control the ink droplet size to adjust the gray value and reduce power consumption, And it has become the mainstream piezoelectric actuator in the MEMS piezoelectric inkjet print head. In order to obtain high-quality printing effects, each nozzle of the print head needs to be electrically driven and controlled independently, t...

AI Technical Summary

Problems solved by technology

First prepare a CMOS integrated circuit on an SOI wafer, then dig out the piezoelectric ink cavity and movable diaphragm from the back of the wafer, and prepare ink supply grooves and nozzles on the other wafer using MEMS technology, and use wafer stacking The bonding process aligns and adheres the above two wafers together, and finally forms a piezoelectric material on the top of the active diaphragm area. The disadvantages are as follows: (1) The part of the CMOS integrated circuit located on the active diaphragm is under piezoelectric braking. It also moves together. The stress and strain in the silicon lattice will change the carrier mobility in the semiconductor and affect the performance of this part of the CMOS circuit. At the same time, the long-term periodic deformation will also affect the life of the CMOS circuit.

(2) The CMOS circuits on the wafer are not fully arranged, that is, there is a large amount of free area, which is uneconomical for the CMOS process charged by area

(3) The piezoelectric material is finally formed, and there are strict restrictions on the preparation process of the piezoelectric material, especially the process temperature

Therefore, constructing integrated structures of MEMS piezoelectric inkjet printheads with high nozzle density, low cost, high efficiency and reliability remains an ongoing challenge.

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