A kind of tin-based alloy and copper strip composite material and preparation method thereof

Abstract

The invention relates to a tin-based alloy and copper strip composite material and a preparation method thereof, belonging to the field of high-frequency brazing processing of non-ferrous metals. The tin-based alloy and copper tape composite material is composed of a core material and a coating layer wrapped on the surface of the core material. The preparation method adopts the principle of high-frequency brazing to realize the formation of a dense tin-based alloy material coating on the surface of the copper strip, including presetting flux on the surface of the copper-based strip, compounding the copper strip and the brazing material, high-frequency induction rapid brazing, and air-cooling solidification. , tape wrapping around the shaft, etc. This method has a simple process and is suitable for mass production. The composite material of tin-based alloy and copper tape prepared by this method has no leakage welding, no tin nodules defect, and has the characteristics of good electrical conductivity, strong solderability, good corrosion resistance, good oxidation resistance and firm coating, etc. It is mainly used for Electronic components, hybrid integrated circuits, solar photovoltaic modules and other electronic industry fields have broad market prospects.

Description

technical field [0001] The invention relates to a tin-based alloy and copper strip composite material and a preparation method thereof, in particular to a tin-plated alloy flat copper wire and a preparation method thereof, which are mainly used for electronic components, hybrid integrated circuits, solar photovoltaic modules and other electronic components The industrial field belongs to the field of high-frequency brazing processing of non-ferrous metals. Background technique [0002] With the continuous development of mechanical and electronic equipment in the direction of miniaturization and miniaturization, copper leads with excellent performance and current carrying capacity, fast transmission speed, good heat dissipation and low cost have gradually been widely used. Compared with pure tin-plated copper wire, tin-plated alloy copper tape composite material has larger current carrying capacity, higher reliability, better oxidation resistance and corrosion resistance, and...

AI Technical Summary

Problems solved by technology

[0003] The tin-copper strip composite material is prepared by single tin plating on the copper strip. It is easy to form copper-tin alloy during processing, and the uniformity is difficult to control. It is difficult to guarantee the thickness and solderability of the coating. Tin whisker defects are prone to occur during long-term service, and cannot meet high requirements. Requirements for the use of reliable hybrid integrated circuits or electronic components

[0004] At present, the three commonly used methods for preparing tin-copper strip composite materials are electroless plating, electroplating and hot-dip plating. It is difficult to control the alloy composition of the copper strip surface coating, and it is difficult to ensure the uniformity and consistency of the coating thickness, especially hot-dip plating. The discoloration of the copper strip will cause defects such as copper leakage, tin nodules, and tin slag, which will reduce the solderability of the solder and affect the characteristics of the copper wire itself. At the same time, the three methods have certain environmental pollution.

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