Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Pre-diffusion film for passivating contact structure and its preparation method and application

A pre-diffusion sheet, contact structure technology, applied in the direction of final product manufacturing, sustainable manufacturing/processing, climate sustainability, etc. Increase the surface recombination rate and other issues to improve the surface passivation effect, reduce the content of metal impurities in the body, and reduce the effect of transition dependence

Active Publication Date: 2020-11-24
NINGBO INST OF MATERIALS TECH & ENG CHINESE ACADEMY OF SCI
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The disadvantages of the tunneling oxygen passivation contact structure (TOPCon) are: during the high-temperature annealing process, if the process is not properly controlled, impurities 10 doped with polysilicon will enter the silicon oxide layer in large quantities, thereby destroying the silicon oxide layer and reducing the interface passivation effect; metal sintering When the slurry burns through the polysilicon layer, it directly contacts the silicon surface, which significantly increases the surface recombination rate
[0009] The disadvantage of silicon heterojunction (SHJ) is that it requires extremely high quality and thickness of intrinsic amorphous silicon
[0010] The disadvantage of the non-doped heterojunction (DASH) structure is: similar to the silicon heterojunction, the structure requires extremely high quality and thickness of intrinsic amorphous silicon
The thickness of intrinsic amorphous silicon needs to be strictly controlled at about 5-6nm. A lower thickness will affect the passivation effect, and a higher thickness will affect the carrier transport capacity.
Strict requirements for intrinsic silicon thin films have become the main reason for limiting the improvement of battery yield

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Pre-diffusion film for passivating contact structure and its preparation method and application
  • Pre-diffusion film for passivating contact structure and its preparation method and application
  • Pre-diffusion film for passivating contact structure and its preparation method and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] This embodiment provides a pre-diffuser, such as image 3 Shown, in order to form pre-diffusion impurity layer 4 by pre-diffusion doping impurity on the surface of silicon chip 1, pre-diffusion doping impurity can be phosphorus, boron etc., the preparation of pre-diffusion sheet is illustrated below with phosphorus as example, boron doping The preparation principle and method of the pre-diffusion sheet are similar to those of phosphorus doping.

[0039] Method 1: Clean the silicon wafer 1, put it into a tube annealing furnace, and use POCl 3 Perform high-temperature diffusion treatment for the phosphorus source, then remove the phosphosilicate glass layer and the phosphorus-rich layer, and finally clean the surface to obtain a pre-diffusion sheet.

[0040] Method 2: Clean the silicon wafer 1, apply a layer of phosphorus source on the surface of the silicon wafer 1 by spraying, spin coating, printing, printing and other methods, then anneal at high temperature to diffus...

Embodiment 2

[0042] This embodiment provides a method for making a passivation contact structure using the above-mentioned pre-diffusion sheet, and the structure diagram of the passivation contact structure prepared is as follows Figure 4 shown.

[0043] The preparation method of the pre-diffusion TOPCon passivation structure: clean the surface of the pre-diffusion sheet, and then sequentially deposit a layer of ultra-thin silicon oxide (the first covering layer 2) with a thickness usually less than 2 nanometers, a layer of n-type or p-type doped Miscellaneous polysilicon thin film (second covering layer 3), wherein silicon oxide is prepared by hot nitric acid method; finally high-temperature annealing is carried out at 800-900°C, specifically, the high-temperature annealing temperature of n-type silicon wafer is 800-850°C, p The high-temperature annealing temperature of the type silicon wafer is 850-900°C, and then the metal electrodes are deposited.

[0044]The preparation method of th...

Embodiment 3

[0049] This embodiment provides a method for preparing a crystalline silicon battery using the above-mentioned pre-diffusion sheet.

[0050] Preparation method of pre-diffusion TOPCon crystalline silicon battery (Take n-type pre-diffusion TOPCon crystalline silicon battery as an example, the preparation principle and method of p-type crystalline silicon battery can refer to n-type): n-type silicon wafer 1 surface cleaning, texturing, surface Boron expansion, chemical polishing on the back side, pre-diffusion on the back side, etch cleaning, preparation of silicon oxide (first cover layer 2) and doped polysilicon (second cover layer 3) on the back side, high temperature crystallization, preparation of passivation and anti-reflection stacks on the front side 6 and the emitter 7, the back can be coated with a silicon nitride layer, double-sided metallized to form a metal electrode 5, wherein at least the front metal electrode 5 forms a metal grid line. After the battery was fabri...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
electrical resistivityaaaaaaaaaa
electrical resistivityaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

The invention provides a pre-diffusion sheet for a passivation contact structure. The pre-diffusion sheet comprises a passivation contact matrix and a doping pre-diffusion layer, wherein the doping pre-diffusion layer is combined with a surface of the passivation contact matrix, a part of doing substance of the doping pre-diffusion layer is diffused and enters different depths in the surface of the passivation contact matrix, and the square resistance of the passivation contact structure with the doping pre-diffusion layer is larger than 90 ohms per square. By pre-diffusion, certain surface doping is formed on the surface of the passivation contact matrix, an energy band is bent on the surface to a certain extent, the carrier selectivity and the transmission capability are improved, the contact resistance is reduced, the thickness requirement of tunneling amorphous silicon, tunneling silicon oxide or other passivation tunneling layers is also reduced, meanwhile, the doping concentration dependence on doping amorphous silicon is also reduced, the excessive dependence on a work function of a new material is reduced, and the battery yield is improved.

Description

technical field [0001] The invention relates to a passivation contact interface structure, in particular to a pre-diffusion sheet that can be used in the passivation contact structure of solar cells, and to a preparation method thereof. Background technique [0002] Passivation contact is also called carrier selective collection, which is a hot research direction of silicon solar cells in recent years. The passivation contact structure can form a significant energy band bending on the silicon surface, allowing one kind of carrier to pass through while the other kind of carrier cannot pass through, forming a good carrier collection, and at the same time inhibiting the carrier from being released at the interface. compound. Therefore, the passivation contact structure can realize high-efficiency passivation and carrier collection, and eliminate the direct contact between silicon and metal, thereby improving the passivation effect and enabling the solar cell to obtain a high o...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L31/0224H01L31/0747H01L31/18
CPCY02E10/50Y02P70/50
Inventor 曾俞衡叶继春闫宝杰廖明墩杨阵海杨清张志黄玉清郭雪琪王志学
Owner NINGBO INST OF MATERIALS TECH & ENG CHINESE ACADEMY OF SCI
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products