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Core-shell structure compound fiber, preparing method thereof and application of compound fiber to polymer base flexible compound thin film

A composite fiber and composite film technology, which is applied in fiber processing, textiles and papermaking, artificial filaments of inorganic raw materials, etc., can solve the problems of high inorganic additives, reduced mechanical flexibility of polymers, and reduced breakdown field strength, etc., to achieve high Effects of dielectric strength and energy storage density, excellent dielectric properties, and high dielectric constant

Inactive Publication Date: 2019-06-21
WUHAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

According to some current studies, the dielectric constant of the polymer can be improved by combining ceramic particles with the polymer, but a higher amount of inorganic addition is required to obtain a significantly improved dielectric constant (generally the volume fraction is greater than 50%), so that It will cause the mechanical flexibility of the polymer to be greatly reduced, and the defects caused by adding too much inorganic components will also greatly reduce the breakdown field strength
Judging from the current research situation, the introduction of inorganic ceramics can indeed increase the dielectric constant of the composite material, but it will lead to a significant decrease in the breakdown field strength.

Method used

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  • Core-shell structure compound fiber, preparing method thereof and application of compound fiber to polymer base flexible compound thin film
  • Core-shell structure compound fiber, preparing method thereof and application of compound fiber to polymer base flexible compound thin film
  • Core-shell structure compound fiber, preparing method thereof and application of compound fiber to polymer base flexible compound thin film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] Weigh or measure 1.7g of tetrabutyl titanate and 9g of ethanol to fully stir, and stir to a uniform and stable state to obtain solution A, then weigh 1.275g of barium acetate dissolved in 5g of acetic acid and stir to obtain a uniform and stable state to obtain solution B, Mix and stir solution A and solution B until uniform, then add 0.8g PVP and stir for 2 hours to form a stable sol; measure 6ml ethanol and 3ml N,N-dimethylformamide (DMF) and stir well, add 0.1868g cobalt acetate, Stir 0.606g of ferric nitrate until completely dissolved, then add 0.8g of PVP and stir for 2 hours to form a stable sol, transfer the two sols to two syringes for coaxial electrospinning, and electrospinning is performed under an electric field of 1.5kV / cm Carry out, V(BTO)=0.5ml / h, V(CFO)=0.4ml / h; the electrospun fibers obtained by drum collection are treated as fired fibers at 20-650°C, at 10°C / min Raise the temperature, keep it at 400°C for 30 minutes, continue to raise the temperature, ...

Embodiment 2

[0048] Weigh or measure 1.7g of tetrabutyl titanate and 9g of ethanol to fully stir, and stir until a uniform and stable state to obtain solution A, then weigh 1.275g of barium acetate dissolved in 5g of acetic acid and stir to obtain a uniform and stable state to obtain solution B, the solution A and solution B were mixed and stirred until uniform, then 0.8g of PVP was added and stirred for 2 hours to form a stable sol; measure 6ml of ethanol and 3ml of N,N-dimethylformamide (DMF) and stir well, then add 0.1868g of cobalt acetate, 0.606 Stir with 1 g ferric nitrate until completely dissolved, then add 0.8 g PVP and stir for 2 hours to form a stable sol, transfer the two sols to two syringes for coaxial electrospinning, and electrospinning is carried out under an electric field of 1.5 kV / cm , V(BTO)=0.5ml / h, V(CFO)=0.3ml / h; the electrospun fibers obtained by drum collection are treated as fired fibers at 20-650°C, and the temperature is raised at 10°C / min , kept at 400°C for 3...

Embodiment 3

[0051] Take 0.2 g of the composite fiber in Example 1 and place it in 20 ml of ethanol, and perform drying treatment after ultrasonication for 20 min at room temperature. Measure 2ml of DMF solvent in a 25ml three-necked flask, add 0.35gP(VDF-HFP), stir for more than 10h, then add 0.0118g of composite fiber and 2ml of DMF solvent evenly, stir for 10h to a uniform and stable state, and then mix the mixture After casting and drying at 50°C for 2 hours, a film can be obtained. The relationship between the dielectric constant of the composite film and the frequency is as follows: Figure 5 As shown, the relationship between dielectric loss and frequency is as Figure 6 shown.

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Abstract

The invention discloses a core-shell structure compound fiber, a preparing method thereof and application of the compound fiber to a polymer base flexible compound thin film. The core-shell structurecompound fiber is composed of a core and a shell which are coaxial. The core is a ferrite fiber with the strong magnetism. The shell is a ceramic fiber with the high dielectric constant. The polymer base flexible compound thin film is prepared from the core-shell structure compound fiber as the filler and polymer base body material, and nanometer fibers in the compound thin film are arrayed in parallel (perpendicular to the surface of the thin film) in the direction away from the thin film; by means of the parallel fibers in the outward direction, the compound thin film can have the high dielectric strength and energy storage density under the low field intensity. Thus, due to the novel compound fiber structure and the presented excellent dielectric performance, the prepared polymer compound thin film is expected to be widely applied on the aspects of embedded capacitors, pulsed power supply technologies and other energy storage devices.

Description

technical field [0001] The invention relates to the technical field of electronic composite material preparation, in particular to a core-shell structure composite fiber, a preparation method thereof and an application in a polymer-based flexible composite film. Background technique [0002] In recent years, microelectronics integration and assembly technology has developed rapidly, and electronic circuits are developing in the direction of miniaturization, light weight and high integration. put forward higher requirements. Among them, high-performance dielectric materials are crucial because they are widely used in passive components of many electronic circuits, such as capacitors, resistors and inductors. Capacitors are commonly used in signal conversion, decoupling, filtering, dynamic random access memory and energy storage, etc. With the development of electronic packaging technology and the miniaturization of electronic products, the passive components are gradually e...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): D01F9/08D01D5/34D01D5/00
Inventor 张树君马昆杰张鑫
Owner WUHAN UNIV OF TECH
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