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Preparation method and application of high-dielectric composite film

A composite film, high dielectric technology, applied in the field of materials, can solve the problems of large difference in surface energy, limited improvement of the dielectric properties of materials, and high cost, so as to avoid the generation of conductive channels, improve the dielectric constant, and the dielectric constant. The effect of low electrical loss

Active Publication Date: 2019-07-12
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, due to the large difference in surface energy between the two materials, the nanoparticles in the composite are easy to agglomerate, which affects the dielectric properties of the composite.
Although the modification of nano-ceramic materials and polymers can improve the generation of nano-particle agglomeration, this modification is not only costly, but also more complicated to operate, and the effect of improving the dielectric properties of materials is relatively limited.

Method used

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  • Preparation method and application of high-dielectric composite film
  • Preparation method and application of high-dielectric composite film
  • Preparation method and application of high-dielectric composite film

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preparation example Construction

[0021] Specifically, the main steps of the preparation method of the present invention are as follows:

[0022] (a) forming a first polymer film on a substrate;

[0023] In this step, a polymer film can be formed on a substrate made of glass or the like by means of spray coating, spin coating or casting.

[0024] In some preferred embodiments of the present invention, the above forming process includes: dissolving the polymer in an organic solvent, then spraying, spinning or casting the resulting coating to form a film, heating and drying, and cooling to room temperature to form the first coating. A polymer film.

[0025] In some more preferred embodiments of the present invention, the raw material polymers used for the preparation of the first polymer film are: polyvinylidene fluoride-based polymers, polyurea-based polymers, soluble polyimide-based polymers, polyurethane, and poly One or more of vinyl alcohol and other polymers;

[0026] The solvent used to form the coatin...

Embodiment 1

[0048] First, on the cleaned glass substrate, the polyvinylidene fluoride-trifluoroethylene (P(VDF-CTFE)) coating was cast to form a cast film, and dried on a heating table for 12 hours and slowly cooled to At room temperature, the thickness of the film after drying is 3 μm, which is the first polymer film.

[0049] Then, an aluminum layer with a thickness of about 30 nm (measured by a step tester) was formed on the surface of the surface film of the first polymer film by vacuum evaporation.

[0050] Finally, the polyvinylidene fluoride-chlorotrifluoroethylene (P(VDF-CTFE)) coating was cast to form a P(VDF-CTFE) cast film on the surface of the aluminum coating, and dried on a heating table for 12 Hours slowly cooled to room temperature, the thickness of the film after drying was 3 μm, and the total thickness of the double-layer film was 6 μm.

[0051] Embodiment 1 preparation flow process is as figure 1 shown.

Embodiment 2

[0053] On the cleaned glass substrate, the polyvinylidene fluoride-chlorotrifluoroethylene (P(VDF-CTFE)) coating was cast to form a casting film, and dried on a heating table for 12 hours and slowly cooled to room temperature. After drying, the thickness of the film is 20 μm, which is the first polymer film.

[0054] A zinc layer with a thickness of about 50 nm is formed on the surface of the surface film of the first polymer film by vacuum evaporation.

[0055] The polyvinylidene fluoride-trifluoroethylene (PVDF-TrFE) coating is cast to form a P (VDF-TrFE) casting film on the surface of the aluminum coating, and it is dried on a heating table for 12 hours and slowly cooled to room temperature. The thickness of the film after drying was 10 μm, and the total thickness of the bilayer film was 30 μm.

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Abstract

The invention provides a preparation method and an application of a high-dielectric composite film. The preparation method comprises the following steps: forming a first polymer film on a substrate; then forming a metal layer on the first polymer film; and finally forming a second polymer film on the metal layer by curtain casting, wherein the curtain casting preferably selects solution curtain casting, and more preferably a solvent in a coating used for the solution curtain casting can dissolve and / or swell the first polymer film. The preparation method allows the polymer / metal-polymer composite layer / polymer three-layer three-dimensional composite film to be obtained by combining the vacuum metal coating film with the solution curtain casting process with the polymer film as a substrate,so the compounding of a conductive material and the polymer is realized, conductive channels are avoided, the reliability of the high-dielectric composite film is improved, and the improvement of thedielectric constant of the composite film is benefited.

Description

technical field [0001] The invention relates to the field of materials, in particular to a preparation method and application of a high dielectric composite film. Background technique [0002] In recent years, the development of electronic equipment is changing with each passing day, and it is increasingly moving toward miniaturization and intelligence. As an important part of electronic products, the performance of capacitors determines the performance and efficacy of products. Dielectric materials are the core material components of capacitors, and improving their electrical properties is very important for the further development of electronic products. [0003] At present, common dielectric materials are mainly ceramic materials and polymer materials. Due to the characteristics of brittleness and poor adhesion of ceramic materials, their processing is more difficult and the cost is higher. Although polymer materials are easier to process and shape, and have better adh...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J7/04C08J5/18C08L27/16
CPCC08J5/18C08J2327/16C08J2427/16C08J7/0423
Inventor 周榆久徐建华王婷陈富佳
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA