Formula of single-crystal silicon texturing additive containing polysaccharide and alcohol
An additive, single crystal silicon wafer technology, applied in the direction of single crystal growth, single crystal growth, polycrystalline material growth, etc., can solve the problem of affecting the photoelectric conversion efficiency of solar cells, the ineffective release of bubbles on the surface of silicon wafers, and affecting the textured light. Absorption effect and other issues, to achieve the effect of shortening texturing time, improving photoelectric conversion efficiency, and excellent texturing effect
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Embodiment 1
[0025] Take the following steps in the texturing process: 1) Additive preparation: use 1L of deionized water as a solvent, add 8.0g of dextrin, 22.0g of tert-butanol, 5.0g of sodium phenylacetate, and 4.0g of sodium silicate to fully dissolve; 2) Texture making Liquid preparation: Add 35.0mL of NaOH solution with a concentration of 30% by weight to 1 L of deionized water, and add 15.0mL of additives to obtain an alkaline texturing liquid; 3) After pre-cleaning the cut monocrystalline silicon wafers, Immerse in the texturing solution, the temperature of the texturing solution is 78°C, and the texturing time is 15 minutes; 4) Wash the monocrystalline silicon wafer after texturing with mixed acid and then with deionized water, and place the product in a drying box The size of the pyramids formed on the surface of the textured monocrystalline silicon wafer after drying is 0.5-3.5 μm, the entire surface of the silicon wafer is uniform in color, the lowest reflectivity is 8.8%, and t...
Embodiment 2
[0027] Take the following steps in the texturing process: 1) Additive preparation: use 1L of deionized water as a solvent, add 6.0g of β-cyclodextrin, 18.0g of n-butanol, 4.0g of sodium benzoate, and 3.0g of sodium silicate to fully dissolve; 2) Preparation of texturing solution: Add 40.0 mL of NaOH solution with a concentration of 30% by weight in 1 L of deionized water, and add 12.0 mL of additives to obtain an alkaline texturing solution; 3) After pre-cleaning the cut monocrystalline silicon wafers, Immerse it in the texturing solution, the temperature of the texturing solution is 82°C, and the texturing time is 12 minutes; 4) The monocrystalline silicon wafer after texturing is cleaned with mixed acid and then washed with deionized water, and the product is placed in a dry place. Dry in an oven to obtain textured monocrystalline silicon wafers.
Embodiment 3
[0029]Take the following steps in the texturing process: 1) Additive preparation: use 1L of deionized water as a solvent, add 4.0g of water-soluble starch, 20.0g of 1,2-propanediol, 3.0g of sodium propionate, and 2.0g of sodium silicate to fully dissolve; 2. ) Preparation of texturing solution: add 42.0 mL of 30% NaOH solution to 1 L of deionized water, add 10.0 mL of additives, and obtain an alkaline texturing solution; 3) pre-clean the monocrystalline silicon wafer after cutting , immerse it in the texturing liquid, the temperature of the texturing liquid is 85°C, and the texturing time is 10 minutes; 4) The monocrystalline silicon wafer after texturing is washed with mixed acid and then washed with deionized water, and the product is placed in Dry in a drying oven to obtain a textured monocrystalline silicon wafer.
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