LED packaging conductive polyamide hot melt adhesive and preparation method thereof

A polyamide hot-melt adhesive and LED packaging technology, which is applied in the directions of adhesives, adhesive additives, non-polymer adhesive additives, etc. and other problems, to achieve the effect of reducing surface dust adsorption, improving adhesion and stable electrical conductivity

Inactive Publication Date: 2020-04-10
湖南省和祥润新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the polyamide hot-melt adhesive used in the market has the defect of not being waterproof. When the product is stained with water, the hot-melt adhesive on it is prone to detachment, and the overall performance of the existing conductive polyamide hot-melt adhesive needs to be improved.

Method used

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  • LED packaging conductive polyamide hot melt adhesive and preparation method thereof

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preparation example Construction

[0024] The invention provides a conductive polyamide hot-melt adhesive for LED packaging and a preparation method thereof. The hot-melt adhesive components include by weight: 75 parts of unsaturated fatty acid dimer, 19 parts of ethylenediamine, 18 parts of hexamethylenediamine, 16 parts of sebacic acid, 6 parts of dimethyl silicone oil, 1 part of alkyl modified organosiloxane, 7 parts of waterproof filler, 8 parts of conductive agent, 3 parts of tackifier, 2 parts of viscosity regulator, 2 parts of anti-aging agent 4 parts, 4 parts of transparent agent and 2 parts of fluorescent powder;

[0025] Described waterproof filler is made up of silicon micropowder and sodium bentonite, and the ratio of described silicon micropowder and sodium bentonite is set to 2:1;

[0026] Further, the tackifier is set to hydrophobic water-soluble polyelectrolyte, and the viscosity modifier is set to cyclohexanol;

[0027] Further, the conductive agent is set to conductive mica powder, and the an...

Embodiment 2

[0038] The invention provides a conductive polyamide hot-melt adhesive for LED packaging and a preparation method thereof. The hot-melt adhesive components include by weight: 76 parts of unsaturated fatty acid dimer, 20 parts of ethylenediamine, 19 parts of hexamethylenediamine, 17 parts of sebacic acid, 7 parts of dimethyl silicone oil, 1.5 parts of alkyl modified organosiloxane, 8 parts of waterproof filler, 9 parts of conductive agent, 4 parts of tackifier, 3 parts of viscosity regulator, 3 parts of anti-aging agent 5 parts, 5 parts of transparent agent and 3 parts of fluorescent powder;

[0039] Described waterproof filler is made up of silicon micropowder and sodium bentonite, and the ratio of described silicon micropowder and sodium bentonite is set to 3:1;

[0040] Further, the tackifier is set to hydrophobic water-soluble polyelectrolyte, and the viscosity modifier is set to cyclohexanol;

[0041] Further, the conductive agent is set to conductive mica powder, and the...

Embodiment 3

[0052] The invention provides a conductive polyamide hot-melt adhesive for LED packaging and a preparation method thereof. The hot-melt adhesive components include by weight: 77 parts of unsaturated fatty acid dimer, 21 parts of ethylenediamine, 20 parts of hexamethylenediamine, 18 parts of sebacic acid, 8 parts of dimethyl silicone oil, 1.5 parts of alkyl modified organosiloxane, 9 parts of waterproof filler, 9 parts of conductive agent, 4 parts of tackifier, 4 parts of viscosity regulator, 3 parts of anti-aging agent 5 parts, 5 parts of transparent agent and 4 parts of fluorescent powder;

[0053] Described waterproof filler is made up of silicon micropowder and sodium bentonite, and the ratio of described silicon micropowder and sodium bentonite is set to 4:1;

[0054] Further, the tackifier is set to hydrophobic water-soluble polyelectrolyte, and the viscosity modifier is set to cyclohexanol;

[0055] Further, the conductive agent is set to conductive mica powder, and the...

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Abstract

The invention discloses an LED packaging conductive polyamide hot melt adhesive and a preparation method thereof. The conductive polyamide hot melt adhesive comprises 55-100 parts of an unsaturated fatty acid dimer, 10-20 parts of ethylenediamine, 10-20 parts of hexamethylene diamine, 15-20 parts of sebacic acid, 5-12 parts of dimethyl silicone oil, 1-2 parts of alkyl modified organosiloxane, 5-12parts of a waterproof filler, 5-10 parts of a conductive agent, 3-5 parts of a tackifier, 1-4 parts of a viscosity regulator, 2-4 parts of an anti-aging agent, 3-8 parts of a transparent agent and 2-5 parts of phosphor. The prepared conductive polyamide hot melt adhesive has the advantages of good heat resistance, good heat dissipation property, waterproof and impermeable performance, chemical erosion resistance, abrasion resistance and high binding power, and also has excellent conductivity, excellent dispersity and stable conductivity due to the conductive mica powder used as the conductiveagent.

Description

technical field [0001] The invention relates to the technical field of hot-melt adhesive processing, in particular to a conductive polyamide hot-melt adhesive for LED packaging and a preparation method thereof. Background technique [0002] Polyamide hot melt adhesive is based on polyamide resin, which is a linear thermoplastic resin with many repeated amide groups on the main molecular chain. Compared with other thermoplastic resins, polyamide hot melt adhesives have a remarkable feature, that is, when it is heated and cooled, the melting and solidification of the resin occur within a narrow temperature range. This feature makes the polyamide hot melt adhesive solidify quickly after heating, melting and coating, and cooling for a while during construction, and also enables it to still have good bonding performance at a temperature close to the softening point. The hydrogen on the amide group of the polyamide resin can combine with the electron-donating carbonyl group on an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J177/08C09J183/04C09J11/04C09J11/06C09J11/08C08G69/34
CPCC08G69/34C08K2201/001C08L2201/04C08L2201/08C08L2201/10C08L2203/206C08L2205/035C09J11/04C09J11/06C09J11/08C09J177/08C08L83/04C08L93/04C08K3/36C08K3/346C08K5/05C08K3/34C08K13/02
Inventor 廖平湘
Owner 湖南省和祥润新材料有限公司
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