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Graphene-based mildew-proof heat conduction floor

A heat-conducting floor and graphene technology, applied in the direction of epoxy resin glue, adhesive type, adhesive additive, etc., can solve the problems that are not conducive to people's living health, the floor is easy to breed bacteria, and increase the weight of the floor, so as to achieve good sterilization and antibacterial Bacterial performance, simple preparation method, and enhanced antibacterial performance

Inactive Publication Date: 2020-07-10
ANHUI YANGZI FLOORING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the heat conduction layer made of metal materials greatly increases the weight of the floor. Therefore, in the field of floor heating equipment, a heat conduction layer with small mass and good heat conduction performance is urgently needed.
[0004] With the rapid development of the graphene industry, people began to add graphene to the floor to make the floor have a heating function, which can reduce the inconvenience of pre-buried floor heating in the past, but the floor in a humid and hot environment is prone to bacteria and mildew. Conducive to people's living health

Method used

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] see figure 1 Shown, the preparation method of antifungal agent is:

[0027] S1, add 0.1mol acetoacetanilide, 0.15mol thiourea, 0.15mol iodine elemental powder and 120ml solvent anhydrous methanol in the reaction flask, heat to reflux for 4h, after the reaction is finished, remove 2 / 3 of the solvent by distillation under reduced pressure, and Pour the remaining reaction solution into 100ml of hot water at a temperature of 90-100°C, heat and stir for 30 minutes, filter while it is hot to remove elemental sulfur, extract the filtrate three times with ether, combine the water layers to obtain the water phase, and drop into the water phase Add ammonia solution to adjust the pH to 8.1, naturally cool to room temperature, filter, and recrystallize the filtrate with absolute ethanol to obtain the aminothiazole compound with the structure of formula A; the yield is 84.7%;

[0028] The mass spectrometry detection result of aminothiazole compound A: HRMSm / z (ESI + )calcd for C ...

Embodiment 2

[0033] A graphene-based anti-mildew and heat-conducting floor, which is as follows from top to bottom: a surface layer, a graphene heat-conducting layer, and a bottom layer; the surface layer is melamine-impregnated film paper; the bottom layer is made of medium and high-density fiberboard ; The thickness of the graphene heat conducting layer is 22-43 μm;

[0034] The graphene heat-conducting layer is made of graphene heat-conducting adhesive, and the graphene heat-conducting adhesive includes the following raw materials in parts by weight: including 60g epoxy resin, 1g antifungal agent (aminothiazole compound B), 3g graphite Alkene, 0.5g dispersant, 10g curing agent, 17g deionized water;

[0035] Described dispersant is zinc stearate;

[0036] Described curing agent is trimethylhexamethylenediamine;

[0037] Preparation of graphene thermally conductive adhesive: Weigh the raw materials of each component and put them into a mixer for 60 minutes of mixing and stirring. After ...

Embodiment 3

[0039] A graphene-based anti-mildew and heat-conducting floor, from top to bottom: a surface layer, a graphene heat-conducting layer, and a bottom layer; the surface layer is natural veneer; the material of the bottom layer is plywood; the graphite The thickness of the thermal conductivity layer is 22-43μm;

[0040]Described graphene thermal conduction layer is made by graphene thermal conduction adhesive, and graphene thermal conduction adhesive comprises the raw material of following weight portion: comprises 70g epoxy resin, 1.5g antifungal agent (aminothiazole compound B), 5g Graphene, 1g dispersant, 12g curing agent, 20g deionized water;

[0041] Described dispersant is zinc stearate;

[0042] Described curing agent is trimethylhexamethylenediamine;

[0043] Preparation of graphene thermally conductive adhesive: Weigh the raw materials of each component and put them into a mixer for 50 minutes of mixing and stirring. After mixing evenly, put them into a homogenizer for ...

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Abstract

The invention discloses a graphene-based mildew-proof heat conduction floor. The graphene-based mildew-proof heat conduction floor sequentially comprises a surface layer, a graphene heat conduction layer and a bottom layer from top to bottom; the surface layer is made of melamine impregnated adhesive film paper, natural veneer or a PVC color film; the bottom layer is made of a medium-high densityfiberboard, a plywood, a shaving board or a stone-wood-plastic composite board; the graphene heat conduction layer is prepared from grapheme heat conduction adhesive; and the graphene heat conductionadhesive comprises, by weight: 50-70 parts of epoxy resin, 0.5-1.5 parts of a mildew inhibitor, 1-5 parts of graphene, 0.5-1 part of a dispersant, 8-12 parts of a curing agent and 15-20 parts of deionized water. Due to the fact that the heat conductivity coefficient of the graphene is 5300 W / (mk), the surface layer and the bottom layer of the floor can both play the roles of the high heat radiation performance and the high heat conductivity of the graphene, and heat conduction is fast; and in addition, by adding the small amount of mildew inhibitor into the graphene heat conduction adhesive, the cleanness and sanitation of the floor can be maintained for a long time, and the floor is not prone to being attacked by bacteria to generate mildew in a dim and humid environment.

Description

technical field [0001] The invention belongs to the field of floor technology, and in particular relates to a graphene-based anti-mildew and heat-conducting floor. Background technique [0002] In the prior art, floor heating equipment has been widely used, and the research on heating floors is relatively mature. Generally, electric heating materials are placed in the floor, and heating is achieved by energizing the electric heating materials in the floor. Purpose, so that the floor heats up for heating. [0003] The floor in the prior art is usually composed of multi-layer boards, and a metal heat conduction layer is arranged between adjacent boards, so that the heat generated by the heating element in the floor can be evenly transmitted. However, the heat conduction layer made of metal material greatly increases the weight of the floor, therefore, there is an urgent need for a heat conduction layer with small mass and good heat conduction performance in the field of floor...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): E04F15/10E04F15/18C09J163/00C09J11/04C09J11/06
CPCC09J11/04C09J11/06C09J163/00E04F15/10E04F15/181C08K3/042C08K5/47
Inventor 雷响周玉刚刘玉和
Owner ANHUI YANGZI FLOORING