Method for improving corrosion resistance of hole absorption layer of perovskite solar cell
A solar cell, corrosion-resistant technology, applied in circuits, photovoltaic power generation, electrical components, etc., can solve the problems of reduced battery life, corrosion of the conduction layer, and reduced carrier conductivity of the hole transport layer and the absorption layer, etc. The effect of improving quality, good stability, good stability and mobility
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Embodiment 1
[0027] (1) First use nano-diamond powder to ultrasonically grind the substrate to make the surface of the substrate have a large roughness, and prepare the processed substrate; the substrate is an ITO substrate; the ultrasonic frequency of ultrasonic grinding is 36kHz, and the time is 1.5h;
[0028] (2) Put the treated substrate obtained in step (1) into the reaction chamber first, and then use the hot wire chemical vapor deposition process to deposit boron-doped diamond film on the substrate, and then use inert gas to clean the chamber after the deposition is completed , to obtain a substrate for depositing a boron-doped diamond film; the parameters of the hot wire chemical vapor deposition process are: the distance from the hot wire to the substrate is 7mm, the temperature of the hot wire is 2300°C, the temperature of the substrate is 460°C, and the carbon source concentration is 1.4% , the reaction pressure is 0.4kPa; the boron doping method is solid boron source doping, the...
Embodiment 2
[0032] (1) First, use nano-diamond powder to ultrasonically grind the substrate to make the surface of the substrate have a large roughness, and prepare the processed substrate; the substrate is an FTO substrate; the ultrasonic frequency of ultrasonic grinding is 32kHz, and the time is 2h;
[0033] (2) Put the treated substrate obtained in step (1) into the reaction chamber first, and then use the hot wire chemical vapor deposition process to deposit boron-doped diamond film on the substrate, and then use inert gas to clean the chamber after the deposition is completed , to obtain a substrate for depositing a boron-doped diamond film; the parameters of the hot wire chemical vapor deposition process are: the distance from the hot wire to the substrate is 6mm, the temperature of the hot wire is 2300°C, the temperature of the substrate is 420°C, and the carbon source concentration is 1.8% , the reaction pressure is 0.3kPa; the boron doping method is liquid boron source doping, the...
Embodiment 3
[0037] (1) First use nano-diamond powder to ultrasonically grind the substrate to make the surface of the substrate have a large roughness, and prepare the processed substrate; the substrate is an ITO substrate; the ultrasonic frequency of ultrasonic grinding is 38kHz, and the time is 1h;
[0038] (2) Put the treated substrate obtained in step (1) into the reaction chamber first, and then use the hot wire chemical vapor deposition process to deposit boron-doped diamond film on the substrate, and then use inert gas to clean the chamber after the deposition is completed , to obtain a substrate for depositing a boron-doped diamond film; the parameters of the hot wire chemical vapor deposition process are: the distance from the hot wire to the substrate is 8mm, the temperature of the hot wire is 2400°C, the temperature of the substrate is 480°C, and the carbon source concentration is 1.2% , the reaction pressure is 0.5kPa; the boron doping method is gas boron source doping, the dop...
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