A preparation method for single-crystal superalloy low-diffusion single-phase platinum-aluminum coating
A high-temperature alloy and low-diffusion technology, applied in the direction of solid-state diffusion coating, metal material coating process, coating, etc., can solve the problems of high cost and demand, and achieve low cost, high controllability, and controllable thickness Effect
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[0028] In the specific implementation process, the preparation method of the present invention for nickel-based single crystal superalloy low-diffusion single-phase platinum-aluminum coating comprises the following steps:
[0029] (1) Surface treatment method: pre-grind and sandblast the substrate, and then degrease with alkali washing and ultrasonic treatment;
[0030] (2) Electroplating Ni-Re on the treated substrate: the electroplating solution is an aqueous solution prepared from nickel sulfate, sodium chloride, boric acid, sodium sulfate, potassium perrhenate, and sodium lauryl sulfate, and the pH value is maintained at 5 during electroplating. Between ~5.5, the prepared solution is placed in a water bath at 40~65°C, and the current density is 1~5A / dm 2 , Electroplating is performed with a pure nickel plate as the anode, and the thickness of the electroplated Ni-Re layer is 2-10 μm.
[0031] (3) Platinum plating on the prepared Ni-Re coating: an alkaline platinum plating...
Embodiment 1
[0036] In this example, the substrate used is nickel-based second-generation single-crystal superalloy N5, and the substrate size is Φ15×2mm. Before electroplating, the substrate is polished with 240# and 400# SiC sandpaper in sequence, and then aluminum oxide is sandblasted. Use NaOH aqueous solution to remove oil, and use alcohol and acetone solution to ultrasonically clean for 15 minutes, and dry it for later use.
[0037] Electroplating Ni-Re layer: The Ni-Re coating is deposited by electroplating. The formulation of the plating solution is shown in Table 1. The electroplating was carried out with a DC power supply, and the electroplating was carried out in a magnetic stirrer with a stirring speed of 10 r / min. The whole electroplating process is kept at a constant temperature, the temperature is controlled at 45°C during electroplating, and the average current density is controlled at 5A / dm 2 , a Ni-Re coating with a thickness of 5 μm was obtained after electroplating fo...
Embodiment 2
[0049] In this example, the substrate used is nickel-based single crystal intermetallic compound IC21, and the substrate size is 15×10×2mm. Before electroplating, the substrate is polished with 240# and 400# SiC sandpaper in sequence, and corundum dry sandblasting is performed. Then wash with NaOH aqueous solution to remove oil, and use alcohol and acetone solution to ultrasonically clean for 15 minutes, and dry it for later use.
[0050] Electroplating Ni-Re layer: the Ni-Re coating layer was deposited by electroplating method, and the composition of the electroplating solution is shown in Table 3. The electroplating was performed with a DC power supply, and a magnetic stirrer was used during the electroplating with a stirring speed of 10 r / min. During the electroplating process, the bath is kept at a constant temperature, the temperature is controlled at 60°C, and the current density is 5A / dm 2 , A Ni-Re coating with a thickness of 7 μm was obtained after electroplating for...
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