A photocrosslinkable hole transport material containing benzophenone group and its preparation method and application
A hole transport material, benzophenone-based technology, used in light-emitting materials, chemical instruments and methods, semiconductor/solid-state device manufacturing, etc., can solve problems such as inability to obtain high-performance stacked devices, and achieve hole transport performance Excellent, short cross-linking time, excellent performance
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0047] The preparation method of embodiment 1, TFB-BP
[0048] 1) Preparation of Monomer 1
[0049] Under nitrogen protection, tris(4-bromophenyl)amine (16.00g, 33.2mmol) was dissolved in anhydrous THF (88.0mL), the reaction system was stirred in an ethanol bath at -78°C, and n-butyl Balithium (17.26 mL, 2.5M in hexane, 43.15 mmol) was added dropwise to the reaction system, and after reacting at -78°C for 1 h, anhydrous DMF (16 mL) was added to the reaction flask. After the dropwise addition, the reaction was continued at -78° C. for 1 h, the temperature of the system was returned to room temperature and the reaction was continued for 1 h, and deionized water was added to quench the reaction. The mixture was extracted three times with ether, the organic phases were combined, the organic layer was washed three times with saturated sodium chloride solution, dried over anhydrous magnesium sulfate, and the solvent was evaporated by a rotary evaporator. Using petroleum ether / et...
Embodiment 2
[0075] Embodiment 2, thermal stability, photophysics and electrochemical performance, solvent resistance and surface of TFB-BP hole transport material Surface morphology characterization and analysis
[0076] Figure 4 Thermogravimetric loss (TGA) and differential scanning calorimetry (DSC) figure of the photocrosslinking hole transport material TFB-BP (polymer 1) prepared for embodiment 1, by Figure 4 It can be seen that the decomposition temperature of the polymer TFB-BP is 326°C and the glass transition temperature is 123.8°C when the thermal weight loss fraction of the polymer TFB-BP is 5%, and the polymer TFB-BP has good thermal stability.
[0077] Figure 5 It is the ultraviolet-visible absorption spectrum of TFB-BP (polymer 1) before and after crosslinking. It can be seen from the figure that the initial absorption wavelengths of the film before and after crosslinking of TFB-BP are 429nm and 432nm, and the initial absorption wavelengths of the two before and after...
Embodiment 3
[0082] Example 3, Preparation and Characterization of Single Hole Devices (HOD) Based on Different Hole Transport Materials
[0083] In order to verify that the cross-linked material TFB-BP has high hole transport performance, we prepared a single-hole device based on TFB, uncross-linked TFB-BP and cross-linked TFB-BP. The structure of the device is: ITO (160nm) / PEDOT:PSS(32nm) / HTL(25nm) / QDs(15nm) / MoO 3 (2nm) / Al(100nm).
[0084] Figure 8 It is the current density-voltage curve of single hole device (HOD) based on different hole transport materials. It can be seen from the figure that at low voltage, the current density of TFB-BP before and after photocrosslinking is lower than that of the reference TFB, showing the Low leakage current; TFB-BP (polymer 1) after cross-linking compared to before cross-linking ( Figure 8 TFB-BP in ) has a lower leakage current, which is due to the denser film after cross-linking, which can effectively prevent leakage current; when the volt...
PUM
| Property | Measurement | Unit |
|---|---|---|
| decomposition temperature | aaaaa | aaaaa |
| glass transition temperature | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More 


