Light and safe conductive film and preparation method thereof

A conductive thin film, safe technology, applied in the direction of resistance manufacturing, resistors with positive temperature coefficients, circuits, etc., can solve the problems of slow heat transfer, non-response, etc., to reduce the amount of metal used, not easy to separate the conductive layer, and strengthen the combination force effect

Inactive Publication Date: 2021-01-01
浙江长宇新材料股份有限公司
View PDF6 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the slow heat transfer rate inside the electronic product, it cannot quickly respond to its actual temperature, so that the PTC element cannot protect well before thermal runaway

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Light and safe conductive film and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] Conductive films were prepared by the following steps:

[0034] Step 1: uniformly mix polyvinylidene fluoride (PVDF) with a mass fraction of 70% and 30% conductive carbon nanotubes, heat, melt and stir evenly, and stretch to form a PTC matrix layer with a thickness of 6 μm after tape casting;

[0035] Step 2: Wind the PTC matrix layer on the drum, and place the drum equipment in a vacuum environment with a vacuum degree of ≤10 -3 Pa;

[0036] Step 3: Treating the PTC base layer material with plasma treatment of a mixed gas of oxygen and argon;

[0037] Step 4: In the vacuum environment, the aluminum-zinc alloy (80% aluminum, 20% zinc) is subjected to resistance heating, melting and evaporation to obtain gaseous metal, which is deposited on the PTC substrate layer to form a 50nm aluminum-zinc alloy reinforcement layer;

[0038] Step 5: Continue to melt and evaporate aluminum on the surface of the aluminum-zinc alloy reinforcement layer by means of resistance heating. T...

Embodiment 2

[0043] Conductive films were prepared by the following steps:

[0044] Step 1: uniformly mix polypropylene (PP) with a mass fraction ratio of 60% and 40% graphite, heat, melt and stir evenly, form a sheet by co-extrusion and then stretch to form a PTC matrix layer with a thickness of 6 μm;

[0045] Step 2: Wind the PTC matrix layer on the drum, and place the drum equipment in a vacuum environment with a vacuum degree of ≤10 -3 Pa;

[0046] Step 3: treating the PTC matrix layer material with nitrogen ions by ion implantation;

[0047] Step 4: In the vacuum environment, perform magnetron sputtering on the nickel target, and sputter a layer of 500nm metal nickel enhancement layer on the PTC substrate layer;

[0048] Step 5: Continue to deposit copper on the surface of the metal nickel reinforcement layer by magnetron sputtering. The deposited copper touches the metal nickel reinforcement layer to form a thin copper metal conductive layer, and the roller rolls back and forth wit...

Embodiment 3

[0053] Conductive films were prepared by the following steps:

[0054] Step 1: uniformly mix polyimide (PI) with a mass fraction ratio of 70% and 30% Ni powder, heat, melt and stir evenly, and stretch to form a PTC matrix layer with a thickness of 4.5 μm after tape casting;

[0055] Step 2: Take the polymer conductive composite material with positive temperature sensitive (PTC) effect as the matrix layer, wind it on the drum, and place the drum equipment in a vacuum environment, with a vacuum degree of ≤10 -3 Pa;

[0056] Step 3: Treating the PTC base layer material with plasma treatment of a mixed gas of oxygen and argon;

[0057] Step 4: In the vacuum environment, the metal tin is melted by resistance heating, and a layer of 200nm metal tin intermediate layer is evaporated on the PTC base layer;

[0058] Step 5: Melt and evaporate the copper-nickel alloy on the surface of the metal tin reinforcement layer by means of electron beam heating. The gaseous copper-nickel alloy c...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to view more

Abstract

The invention discloses a light and safe conductive film and a preparation method thereof. The conductive film mainly comprises five layers: a polymer flexible conductive composite material matrix layer, conductive layers on the upper surface and the lower surface, and a reinforcing layer between the matrix layer and the conductive layers. According to the invention, the reinforcing layer effectively enhances the binding force between the substrate layer and the conductive layer, so that the conductive film is not easy to generate conductive layer separation in the application process. And theconductive agent is added into the matrix layer, so that the binding force of the enhancement layer and the PTC matrix layer is effectively improved. Compared with a common metal foil material, the conductive thin film has the advantages that the thickness is reduced, the metal consumption is reduced, the light weight of an electronic product is realized, the material cost of the product is reduced, and the flexibility and the mechanical strength of the conductive thin film are effectively improved; due to the positive temperature sensitive effect of the polymer flexible conductive compositematerial matrix layer, when the internal temperature of the electronic product rises, the resistance can be suddenly increased, a circuit is effectively cut off, heat is prevented from being continuously generated, and therefore the safety of the electronic product is effectively improved.

Description

technical field [0001] The invention relates to the technical field of conductive materials and electronic product safety, in particular to a lightweight and safe conductive film and a preparation method thereof. Background technique [0002] With the current social development and technological progress, the use of electronic products is becoming more and more common. The conductive foil materials often used in electronic products include metal copper foil, metal aluminum foil, metal silver foil, etc., which have good conductivity but are expensive and of high quality. , affecting the lightweight of the final electronic products, and the safety of electronic products is also the focus of people's attention. The current electronic products want to maintain the long-term battery life of electronic products under the premise of pursuing quality reduction, resulting in unstable products. , Ordinary metal foil materials cannot effectively guarantee the safety performance of elec...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H01C7/02H01C17/00
CPCH01C7/021H01C7/027H01C17/00
Inventor 吴明忠严超黄云辉伽龙焦鑫鹏
Owner 浙江长宇新材料股份有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products