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A kind of circuit silver conductor paste, matrix and preparation method

A matrix and silver powder technology, applied in cable/conductor manufacturing, printed circuit manufacturing, circuit, etc., can solve the problems that the gold substrate can no longer be arranged on the circuit, the service life of the ceramic substrate is short, and the silver conductor paste cannot be printed. Or the effect of small impedance, prolonging service life and reducing heat generation

Active Publication Date: 2022-08-05
西安腾星电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] In the related art, the existing silver conductor paste is printed on the ceramic substrate of Al2O3, the service life of the ceramic substrate is short, and the service life of the precious metal substrate is long, but the silver conductor paste cannot be printed on the precious metal substrate, for example The silver conductor paste cannot be printed on the gold substrate made of metal gold, so that the circuit can no longer be arranged on the gold substrate, the function is single, and the use scene is single

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  • A kind of circuit silver conductor paste, matrix and preparation method

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Effect test

Embodiment 1

[0035] A circuit silver conductor paste comprises the following raw materials by mass percentage: 75%-85% of silver powder, 0.05%-0.5% of glass powder, 0-0.2% of barium carbonate and 14.3%-24.95% of organic solvent. Glass powders include: bismuth oxide, silicon oxide, boron oxide, zinc oxide and calcium oxide. In this embodiment, a small amount of glass powder can well combine the silver conductor paste with the metal gold substrate, and after the combination, a substrate is obtained, which realizes the thick film process to make conductive lines on the gold substrate, and reduces the total circuit circuit of the substrate. The resistance value or impedance can be reduced, the heat generation can be reduced, the power consumption can be reduced, and the performance of the substrate with the gold substrate is better. At the same time, the silver conductor paste prepared from the above-mentioned raw materials can also be printed on the ceramic substrate.

[0036] Among them, ba...

Embodiment 2

[0038] On the basis of the first embodiment, this embodiment further defines that the mass percentages of bismuth oxide, silicon oxide, boron oxide, zinc oxide and calcium oxide in the glass powder are 10%-20%, 10%-15%, 20%, respectively. %~30%, 0~5% and 30%~50%.

[0039] Further, the organic solvent includes the following raw materials: ethyl cellulose, maleic acid resin, terpineol and diethylene glycol butyl ether, in the organic solvent ethyl cellulose, maleic acid resin, terpineol and diethylene glycol The mass percentages of butyl ether are respectively 1%-5%, 1%-8%, 30%-60% and 30%-57%.

[0040] Among them, ethyl cellulose and maleic acid resin are in powder form.

[0041] The silver conductor paste printed on the gold substrate or gold-based ceramic substrate in this embodiment must meet four requirements in terms of quality and performance: first, the square resistance must be less than or equal to 3 milliohms, and second, the gold substrate must meet the requirements...

Embodiment 3

[0044] A second aspect of the embodiments of the present invention provides a base body including: a metal substrate 10 on which a base layer circuit is printed. A conductive film 20 is provided on the metal substrate 10 . The conductive film 20 is formed by printing the silver conductive paste made from the raw materials in the first or second embodiment. The material of the metal substrate 10 includes: metal gold. In this embodiment, the silver conductor paste made of the raw materials in the above-mentioned embodiments is printed on the gold substrate to form the conductive film 20 . While the base circuit is arranged on the gold substrate, a secondary current can be arranged on the conductive film 20 . Therefore, a thick film process is realized to fabricate conductive lines on the gold substrate, which increases the functionality of the substrate, and at the same time, the gold substrate is corrosion-resistant and prolongs the service life. While the silver conductor pa...

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Abstract

The invention discloses that the invention provides a circuit silver conductor paste, comprising the following raw materials by mass percentage: silver powder 75%-85%, glass powder 0.05%-0.5%, barium carbonate 0-0.2% and organic solvent 14.3%- 24.95%; the glass powder includes: bismuth oxide, silicon oxide, boron oxide, zinc oxide and calcium oxide. The invention also relates to a preparation method of a matrix machine. A small amount of glass powder is added to the raw material of the conductive paste of the present invention, so that the silver in the silver conductive paste can be combined with the gold substrate, and the silver conductive paste of the present invention can also be used on the ceramic substrate, which increases the function , expanding the usage scenarios. In the substrate of the present invention, the silver conductor paste is printed on the gold substrate to form a conductive film, and current circulation lines and / or signal transmission lines can be arranged on the conductive film twice, which increases the functionality and expands the use scene. The total resistance or impedance of the circuit lines of the base body is relatively small, which reduces heat generation and can reduce power consumption.

Description

technical field [0001] The invention belongs to the technical field of silver conductor paste materials, and particularly relates to a circuit silver conductor paste, a substrate and a preparation method. Background technique [0002] Thick film technology is to coat insulating dielectric paste, resistance paste and silver conductor paste and other materials on the substrate by screen printing. After high temperature sintering, a functional film with strong adhesion is formed on the substrate. In the circuit, the silver conductor paste is used for the conductive connection between various functional components. The existing silver conductor paste is mostly silver paste, and the silver paste has excellent performance in terms of conductivity, solderability, adhesion, and stability. [0003] In the related art, the existing silver conductor paste is printed on the aluminum oxide ceramic substrate, the ceramic substrate has a short service life, and the precious metal substrate...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B1/16H01B1/22H05K1/09H01B13/00H05K3/12
CPCH01B1/16H01B1/22H05K1/092H01B13/00H05K3/1216H05K3/1291
Inventor 杨锋
Owner 西安腾星电子科技有限公司
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