Laser cutting protection liquid as well as preparation method and application thereof

Abstract

The invention relates to a laser cutting protection liquid as well as a preparation method and application thereof, and the laser cutting protection liquid comprises the following components in percentage by weight: 1%-20% of water-soluble resin, 1%-30% of a solvent, 0.5%-5% of a humectant, 0.1%-1% of a water-soluble ultraviolet absorbent, 0.1%-0.5% of a water-soluble antioxidant, 2%-10% of a water-soluble red pigment, 1%-2% of a pH regulator, 0.1%-0.2% of an anticorrosive agent and the balance of water, totaling 100%; wherein the boiling point of the solvent is higher than 145 DEG C; the humectant comprises an alcohol containing two or more than two hydroxyl groups. The laser cutting protection liquid has excellent heat resistance, can adapt to various application requirements of laser cutting protection, and can save equipment and material cost.

Description

technical field

[0001] The invention relates to the technical field of laser cutting, in particular to a laser cutting protective liquid and its preparation method and application. Background technique

[0002] With the continuous expansion of the high-brightness LED market, the demand for improving production efficiency and product yield is rising. Therefore, laser ablation processing and invisible cutting methods have gradually become mainstream processes in high-brightness LED processing. Among them, laser ablation processing takes into account the balance of efficiency, pass rate and cost. Moreover, as the feature size of semiconductor integrated circuits continues to shrink, if a wafer with a low dielectric constant film (Low-k film) is cut by a traditional knife wheel, due to the brittleness of the Low-k material, there will be the following problems: scratches, Defects, etc., or the insulating film formed on the surface of the chip as a circuit element is peeled off....

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