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Vertical Ga2O3 nanotube ordered array and preparation method thereof

A technology of ordered arrays and nanotubes, applied in nanostructure manufacturing, nanotechnology, nanotechnology, etc., can solve difficult problems such as direction, length, size and tube wall thickness

Active Publication Date: 2021-06-29
NANJING UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these synthetic methods are difficult to achieve for β-Ga 2 o 3 Control of direction, length, size and wall thickness of nanotubes
Although these methods have been studied and achieved certain results, they all have some shortcomings, such as β-Ga with controllability, good repeatability, simple preparation process and low cost. 2 o 3 Preparation of nanotubes remains a challenge

Method used

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  • Vertical Ga2O3 nanotube ordered array and preparation method thereof
  • Vertical Ga2O3 nanotube ordered array and preparation method thereof
  • Vertical Ga2O3 nanotube ordered array and preparation method thereof

Examples

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Embodiment 1

[0037] a vertical Ga 2 o 3 A method for preparing an ordered array of nanotubes, the steps comprising:

[0038] (1) The device is ultrasonically cleaned with acetone, ethanol, and deionized water in sequence, and then dried with nitrogen, wherein the device is a GaN film grown on the substrate;

[0039] (2) Using plasma-enhanced chemical vapor deposition to grow a layer of SiO with a thickness of 200 nm on the cleaned device 2 Thin film, and then a layer of Ni metal film with a thickness of 20nm is deposited by electron beam evaporation;

[0040] (3) annealing the above metal-plated device to form a Ni metal nanoparticle structure used as an etching mask on the surface, the annealing temperature is 850 ° C, and the time is 10 min;

[0041] (4) Put the annealed device into RIE and ICP etching equipment sequentially, and use Ni metal nanoparticles as a mask to perform a dry etching process, wherein the RIE etching conditions: the etching gas is CF 4 / O 2 , the flow ratio is...

Embodiment 2

[0046] a vertical Ga 2 o 3 A method for preparing an ordered array of nanotubes, the steps comprising:

[0047] (1) The device is ultrasonically cleaned with acetone, ethanol, and deionized water in sequence, and then dried with nitrogen, wherein the device is a GaN film grown on the substrate;

[0048] (2) on the device after cleaning, be the Ni metal thin film of 5nm by electron beam evaporation coating one deck thickness;

[0049] (3) annealing the above metal-coated device to form a Ni metal nanoparticle structure used as an etching mask on the surface, the annealing temperature is 750 ° C, and the time is 1 min;

[0050] (4) Put the annealed device into the ICP etching equipment and use Ni metal nanoparticles as a mask to perform a dry etching process. ICP etching conditions: the etching gas is Cl 2 / BCl 3 , the flow ratio is 24 / 6sccm, the etching power is 50 / 100W, the chamber pressure is 5mTorr, and the etching time is 4min to obtain an ordered array of vertical GaN ...

Embodiment 3

[0055] a vertical Ga 2 o 3 A method for preparing an ordered array of nanotubes, the steps comprising:

[0056] (1) The device is ultrasonically cleaned with acetone, ethanol, and deionized water in sequence, and then dried with nitrogen, wherein the device is a GaN film grown on the substrate;

[0057] (2) Using plasma-enhanced chemical vapor deposition to grow a layer of SiO with a thickness of 400 nm on the cleaned device 2 Thin film, and then a layer of Ni metal film with a thickness of 50nm is deposited by electron beam evaporation;

[0058] (3) annealing the above metal-plated device to form a Ni metal nanoparticle structure used as an etching mask on the surface, the annealing temperature is 950 ° C, and the time is 20 min;

[0059] (4) Put the annealed device into RIE and ICP etching equipment sequentially, and use Ni metal nanoparticles as a mask to perform a dry etching process, wherein the RIE etching conditions: the etching gas is CF 4 / O 2 , the flow ratio is...

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Abstract

The invention discloses a preparation method of a vertical Ga2O3 nanotube ordered array. The basic principle is that a GaN core nanowire in a GaN / beta-Ga2O3 nanowire array obtained after thermal oxidation is removed through ICP (Inductively Coupled Plasma) etching by utilizing the etching difference between beta-Ga2O3 and a GaN material, so that a beta-Ga2O3 nanotube array which is vertically arranged and is controllable in size is prepared. The preparation method comprises the following steps of: firstly, evaporating a nickel film on the surface of a GaN film on a substrate, annealing to enable the nickel film to become a nano island-shaped structure to serve as an etching mask, and preparing a GaN nanowire ordered array by utilizing an ICP (Inductively Coupled Plasma) etching technology; carrying out thermal oxidation on the obtained GaN nanowire ordered array at a certain temperature and in an oxygen atmosphere to obtain a GaN / beta-Ga2O3 nanowire array; and removing the GaN nanowire serving as a core by adopting a process condition beneficial to GaN etching, so as to obtain the vertical Ga2O3 nanotube ordered array. The method is a brand-new, low-cost and relatively simple method for preparing the beta-Ga2O3 nanotube, and has a potential application prospect in the fields of novel micro-nano electronics and optoelectronics.

Description

technical field [0001] The present invention relates to a vertical Ga 2 o 3 Ordered array of nanotubes and method for preparing same. Background technique [0002] Gallium oxide single crystal is a direct bandgap oxide semiconductor with a forbidden band width of 4.8-4.9eV, equivalent to more than 4 times that of silicon, even higher than silicon carbide (3.3eV) and gallium nitride (3.4eV). Known as the fourth generation of ultra-wide bandgap semiconductors. Gallium oxide single crystal has many crystal forms, among which β-Ga 2 o 3 most stable. Gallium oxide has unique ultraviolet transmission characteristics (absorption edge can reach 250nm); the breakdown electric field strength is as high as 8MV / cm, which is nearly 27 times that of the first-generation semiconductor silicon (Si), the third-generation semiconductor silicon carbide (SiC) and More than 2 times that of gallium nitride (GaN); the Baliga figure of merit (Baliga figure of merit index), which is an indicat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B82B3/00B82B1/00B82Y40/00H01L21/02H01L21/3065
CPCB82B3/0014B82B1/001B82Y40/00H01L21/02565H01L21/3065
Inventor 修向前张丽颖谢自力张荣
Owner NANJING UNIV
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