Etching solution and application thereof

An etching solution and etching technology, applied in the field of etching solution, can solve the problems of difficult seed layer, small etching coefficient, increase of copper circuit short circuit, etc., achieve the effects of saving time and energy consumption, simple preparation method, and accelerating etching rate

Active Publication Date: 2021-08-17
光华科学技术研究院(广东)有限公司 +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the circuit etching technology adopted today, copper etchant is usually used to etch the copper and nickel-chromium alloy layers at the same time, because the etching rate of copper etchant to nickel and chromium metal is relatively slow, and the copper etching solution on both sides of the bottom of the copper circuit , the replacement efficiency of the etchant is low, so it is difficult to etch the seed layer on both sides of the bottom of the copper line, causing the bottom of the line to expand
When making high-density circuits, the residual nickel and chromium metal seed layer on the edge of the circuit increases the risk of copper circuit short circuit and affects the yield of flexible circuit boards
If the seed layer exposed at the bottom of the line is removed by increasing the etching time, it will cause severe undercutting of the copp

Method used

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  • Etching solution and application thereof
  • Etching solution and application thereof
  • Etching solution and application thereof

Examples

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specific Embodiment approach

[0044] The present invention will be described in further detail below in conjunction with specific examples. The present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0045] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0046] Where "comprises," "has," and "comprises" are used herein, the intent is to cover a non-exclusive i...

Embodiment 1

[0095] This embodiment provides an etching solution and a preparation method thereof.

[0096] (1) In terms of the amount of substance, the composition of etching solution in the present embodiment is:

[0097]

[0098] (2) the preparation method of etching solution in the present embodiment is:

[0099] Add 1L of deionized water to the reaction vessel, slowly add sulfuric acid, after cooling to room temperature, add formic acid, sodium chloride and sodium persulfate in sequence, then stir until the solid is completely dissolved, then add deionized water to 2L, stand for later use .

Embodiment 2

[0101] This embodiment provides an etching solution and a preparation method thereof.

[0102] (1) In terms of the amount of substance, the composition of etching solution in the present embodiment is:

[0103]

[0104] (2) the preparation method of etching solution in the present embodiment is:

[0105] Add 1L deionized water into the reaction vessel, slowly add nitric acid, after cooling to room temperature, add citric acid, ammonium chloride, hydrogen peroxide and dodecyltrimethylammonium chloride in sequence, and then stir until the solid is completely dissolved, Add deionized water to 2L and let stand for later use.

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Abstract

The invention relates to an etching solution and application thereof. The etching solution comprises water, chloride, inorganic acid, organic acid and an oxidizing agent; the chloride is selected from at least one of sodium chloride, potassium chloride, copper chloride, ammonium chloride and hydrogen chloride; the inorganic acid is selected from at least one of nitric acid, sulfuric acid, phosphoric acid and perchloric acid; the organic acid is selected from at least one of iminodiacetic acid, formic acid, acetic acid, butyric acid, citric acid, isocitric acid, oxalic acid and malonic acid; the oxidizing agent is selected from at least one of hydrogen peroxide, sodium persulfate, ammonium persulfate, potassium persulfate, ammonium ceric nitrate, sodium ceric nitrate, potassium ceric nitrate, sodium hypochlorite and potassium hypochlorite; and the molar ratio of the chloride to the inorganic acid to the oxidizing agent is (55-70): (30-50): 1. The etching solution can quickly etch nickel, chromium or nickel-chromium alloy, has a small etching effect on copper, meets the process requirements of manufacturing fine lines in flexible printed circuit boards and integrated circuits at present, and is safe and reliable.

Description

technical field [0001] The invention relates to the field of metal etching, in particular to an etching solution and its application. Background technique [0002] With the continuous development of electronic products, especially the rapid development of wearable and portable electronic products, higher requirements are put forward for the circuit boards used. The circuit boards need to be light, small and bendable. Flexible printed circuit (FPC, Flexible Printed Circuit) has the advantages of small size, light weight and bendability, making it quickly become an important development direction of circuit board technology, and its market share is also increasing. [0003] At present, polyimide (Polyimide) substrates are widely used in flexible circuit boards. In the process of making circuit boards, in order to enhance the adhesion between the metal circuit and the polyimide base film, and at the same time as the seed layer of the copper circuit, a layer is usually formed b...

Claims

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Application Information

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IPC IPC(8): C23F1/28C23F1/30
CPCC23F1/28C23F1/30
Inventor 李治文袁明军胡秋雨段林侃
Owner 光华科学技术研究院(广东)有限公司
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