A preparation method of curved surface printed board based on jet printing

Abstract

The invention relates to a method for preparing a curved printed board based on jet printing. The method includes the steps of 1) designing the three-dimensional structure of the medium and the conformal circuit on the surface according to the application object; 2) performing pretreatment on the medium qualified for NC machining; 3) using electroless copper or magnetron sputtering on the medium A copper layer is formed on the outer surface; 4) The copper layer is pretreated in a chemical solution to remove oil and grease; 5) A photoresist with a suitable viscosity is coated on the surface of the copper layer through a piezoelectric spray system; 6) The coated A good photoresist is exposed, etched and removed; 7) The final plating layer and thickness of nickel and gold plating are formed by electroless plating / electroplating. Compared with the circuit chip technology, this preparation method can meet the requirements of high-temperature engineering plastics, and can prepare radiation layers on any visible curved surface, with a minimum line width of 0.1 mm and a bonding force of 5 MPa. In addition, the invention does not need to modify the medium, which improves the electrical stability.

Description

technical field [0001] The invention belongs to the technical field of wireless networks, and specifically relates to a method for preparing curved surface printed boards based on jet printing, which is used for signal radiation and transmission of antenna feeder products. Background technique [0002] Circuit manufacturing is the process of integrating electronic components such as chips, diodes, transistors, resistors, capacitors, etc. with certain functional circuits, and the interconnecting wires connecting them into the surface of a physical object. The circuit board is an important part of such an electronic product, and it is the connector of various electronic components. In the circuit board manufacturing process, a protective layer needs to be printed on the circuit board to protect the plating layer. This protective layer is photoresist. [0003] The key processes of traditional printed circuit molding include board making, exposure, development, and etching. Bec...

AI Technical Summary

Problems solved by technology

[0003] The key processes of traditional printed circuit molding include board making, exposure, development, and etching. Because the convenience of board making and the light dose will affect the curing effect of photoresist, this process can only be applied to flat printed boards.

[0004] At present, the preparation method of curved surface printed circuit is to directly paste the flexible printed circuit board on the dielectric body. This manufacturing method has the following problems: 1) The assembly of the flexible printed circuit board needs to be glued and cured, and the process is complicated, and the glue layer affects the electrical performance; 2) The assembly error after bending affects the subsequent interconnection process, such as the difficulty in alignment of soldering components; 3) It is impossible to prepare complex three-dimensional curved surfaces and non-developable curved surfaces, such as spherical surfaces; 4) Positioning assembly between printed boards and supporting materials There are errors, etc.

However, the LDS substrate is doped with metal compounds, and the original pure plastic is modified, which brings a lot of instability to the electrical performance of the antenna.

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