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Photosensitive solder mask ink and processing technology thereof

A technology of solder resist ink and processing technology, applied in ink, household appliances, applications, etc., can solve the problems of complex process, low heat resistance and photosensitive performance, and unsuitable for mass production.

Pending Publication Date: 2022-02-08
广州市番禺区惠桥电子器械材料制品厂
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The selection of photosensitive resin is the key to high-quality solder resist ink. The supply process of solder resist ink on the market is complicated, not suitable for mass production, and the heat resistance and photosensitive performance are not high.

Method used

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  • Photosensitive solder mask ink and processing technology thereof
  • Photosensitive solder mask ink and processing technology thereof
  • Photosensitive solder mask ink and processing technology thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] Step 1: Melt 25g of benzoxazine resin at 85°C, add 3g of p-toluenesulfonic acid, and stir quickly; add 6.5g of molybdenum trichloride, mix well, dissolve with 10g of toluene as solvent, and ultrasonically until the resin is mixed uniform, and the solvent was distilled off under reduced pressure to obtain a molybdenum trichloride-modified benzoxazine resin.

[0024] Step 2: Add 8g propyl gallate and 29.6g m-cresol, stir, add 11g formaldehyde, add dropwise 6ml sulfuric acid, make the pH of the reaction solution = 1, heat, raise the temperature to 75°C, react for 2.5h, wash with water, use 20ml Extract with methanol, dry in vacuo, add 3g of 2-azo-1-naphthoquinone-5-sulfonyl chloride and dissolve in 50ml of dioxane, heat up to 45°C, stir, control PH=8, react for 2.5 hours, add 300ml of hydrochloric acid, Filtrate, wash with water, and dry to obtain propyl gallate-modified o-diazonaphthoquinone resin.

[0025] Step 3: Use 6g of terephthaloyl chloride and 7.2g of diethylenet...

Embodiment 2

[0028] Step 1: Melt 25g of benzoxazine resin at 90°C, add 3g of p-toluenesulfonic acid, and stir rapidly; add 6.5g of molybdenum trichloride, mix well, dissolve with 10g of toluene as solvent, and ultrasonically until the resin is mixed uniform, and the solvent was distilled off under reduced pressure to obtain a molybdenum trichloride-modified benzoxazine resin.

[0029] Step 2: Add 8g propyl gallate and 29.6g m-cresol, stir, add 11g formaldehyde, add dropwise 6ml sulfuric acid, make the pH of the reaction solution = 1, heat, raise the temperature to 80°C, react for 3h, wash with water, wash with 20ml methanol Extract, vacuum dry, add 3g of 2-azo-1-naphthoquinone-5-sulfonyl chloride, dissolve in 50ml of dioxane, heat up to 50°C, stir, control PH=8, react for 3 hours, add 300ml of hydrochloric acid, filter , washed with water, and dried to obtain propyl gallate-modified o-diazonaphthoquinone resin.

[0030] Step 3: Use 6g of terephthaloyl chloride and 7.2g of diethylenetriami...

Embodiment 3

[0033] Step 1: Melt 25g of benzoxazine resin at 80°C, add 3g of p-toluenesulfonic acid, and stir quickly; add 6.5g of molybdenum trichloride, mix well, dissolve with 10g of toluene as solvent, and ultrasonically until the resin is mixed uniform, and the solvent was distilled off under reduced pressure to obtain a molybdenum trichloride-modified benzoxazine resin.

[0034]Step 2: Add 8g of propyl gallate and 29.6g of m-cresol, stir, add 11g of formaldehyde, dropwise add 6ml of sulfuric acid, make the pH of the reaction solution = 1, heat, raise the temperature to 70°C, react for 2-3h, wash with water, and Extract with 20ml of methanol, dry in vacuum, add 3g of 2-azo-1-naphthoquinone-5-sulfonyl chloride, dissolve in 50ml of dioxane, heat up to 40°C, stir, control PH=8, react for 2 hours, add 300ml of hydrochloric acid , filtered, washed with water, and dried to obtain propyl gallate-modified o-diazonaphthoquinone resin.

[0035] Step 3: Use 6g of terephthaloyl chloride and 7.2g...

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Abstract

The invention discloses photosensitive solder mask ink and a processing technology thereof. The photosensitive solder mask ink comprises a main agent and a hardening agent. The main agent comprises heat-resistant resin, barium sulfate, phthalocyanine green, talcum powder and a solvent. The hardening agent comprises photosensitive resin and a photosensitizer. Molybdenum trichloride modified benzoxazine resin is used as heat-resistant resin, propyl gallate modified o-diazonaphthoquinone resin is used as photosensitive resin, and phthalocyanine green microcapsules are used as pigment, so that the prepared photosensitive solder mask ink has good heat resistance, mechanical property, stability and photosensitivity.

Description

technical field [0001] The invention relates to the technical field of solder resist ink, in particular to a photosensitive solder resist ink and a processing technology thereof. Background technique [0002] With the rapid development of miniaturization, light weight, high performance, multi-function and high-frequency signal transmission of electronic products, the corresponding component PCB has been rapidly moved from the traditional PCB industry to high-density, high-integration, and refined The product development path characterized by PCB, and the high density and high integration of PCB will inevitably lead to the thinning and thinning of its interconnection lines. [0003] In the manufacturing process of printed circuit boards, the coating of solder resist ink is a very critical process. The main function of the solder mask on the PCB board is to protect the circuit, prevent conductors from being stained with tin; prevent electrical short circuits caused by moistur...

Claims

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Application Information

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IPC IPC(8): C09D11/103C09D11/102C09D11/037C09D11/03
CPCC09D11/103C09D11/102C09D11/037C09D11/03
Inventor 吴健瑜
Owner 广州市番禺区惠桥电子器械材料制品厂
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