Self-etching copper surface bonding agent and preparation method thereof

A bonding agent and copper surface technology, which is applied in chemical/electrolytic methods to remove conductive materials, printed circuit manufacturing, electrical components, etc., can solve the problem of large fluctuations in production line yield and cleanliness affecting the use of copper surface bonding agents, etc. problem, to achieve the effect of promoting dissolution

Pending Publication Date: 2022-03-25
KUNSHAN CITY BANMING ELECTRONICS SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in actual use, it was found that due to the differences in photoresist components of different manufacturers, when using copper surface bonding agents for production, the yield rate of the production line fluctuates greatly; in addition, the cleanliness of the copper surface will also affect the copper surface bonding. The effect of the mixture

Method used

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Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment 1

[0026] (1) Add the following components in a 500ml four-necked flask equipped with a mechanical stirrer, a thermometer, a reflux condenser and nitrogen gas: 60g of 4-methyl-5-vinylthiazole, 30g of hydroxyethyl acrylate, acrylamide 10g, absolute ethanol 300g, azobisisobutyronitrile 0.3g. The above reaction system was reacted at 80°C for 6 hours to obtain a brown-yellow nitrogen-containing heterocyclic copolymer solution, and the monomer conversion rate was above 98%.

[0027] (2) Weigh 10 g of copper chloride and dissolve it in an appropriate amount of water, then add 5 g of the nitrogen-containing heterocyclic copolymer solution prepared in (1) (containing 1.225 g of nitrogen-containing heterocyclic copolymer), 5 g of ethanol, and 40 g of acetic acid, and stir At the same time, deionized water was added for dilution, and the volume was adjusted to 1 L to obtain the self-etching copper surface bonding agent A1.

specific Embodiment 2

[0029] (1) Add the following components in a 500ml four-neck flask equipped with a mechanical stirrer, a thermometer, a reflux condenser and nitrogen gas: 30g of 4-methyl-5-vinylthiazole, 55g of hydroxypropyl acrylate, acrylamide 15g, absolute ethanol 300g, azobisisobutyronitrile 0.3g. The above reaction system was reacted at 80°C for 6 hours to obtain a brown-yellow nitrogen-containing heterocyclic copolymer solution, and the monomer conversion rate was above 98%.

[0030] (2) Weigh 20g of ferric chloride and dissolve it in an appropriate amount of water, then add 10g of the nitrogen-containing heterocyclic copolymer solution prepared in (1) (containing 2.45g of nitrogen-containing heterocyclic copolymer), 2g of ethanol, and 60g of acetic acid, and stir At the same time, deionized water was added for dilution, and the volume was adjusted to 1 L to obtain the self-etching copper surface bonding agent A2.

specific Embodiment 3

[0032] (1) Add the following components to a 500ml four-neck flask equipped with a mechanical stirrer, a thermometer, a reflux condenser and nitrogen: 80g of 1-vinylimidazole, 15g of hydroxyethyl acrylate, methacryloyldimethylamino Ethyl ester 5g, absolute ethanol 300g, azobisisobutyronitrile 0.3g. The above reaction system was reacted at 80°C for 6 hours to obtain a brown-yellow nitrogen-containing heterocyclic copolymer solution, and the monomer conversion rate was above 98%.

[0033] (2) Weigh 2 g of sodium persulfate and dissolve it in an appropriate amount of water, then add 15 g of the nitrogen-containing heterocyclic copolymer solution prepared in (1) (containing 3.675 g of nitrogen-containing heterocyclic copolymer), 10 g of ethanol, and 5 g of acetic acid, and stir At the same time, deionized water was added for dilution, and the volume was adjusted to 1 L to obtain the self-etching copper surface bonding agent A3.

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PUM

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Abstract

The invention discloses a self-etching copper surface bonding agent and a preparation method thereof, and belongs to the technical field of chemicals for printed circuit board production. The bonding agent comprises an oxidizing agent, a nitrogen-containing heterocyclic ring copolymer, a hydroxyl-containing solvent, organic acid and the balance of deionized water, wherein the oxidizing agent is at least one of bivalent copper salt, trivalent iron salt, peroxide and persulfate; the nitrogen-containing heterocyclic ring copolymer is a polymer prepared by free radical copolymerization of a nitrogen-containing heterocyclic ring monomer, an alkyl acrylate monomer and a hydrophilic monomer according to the mass ratio of (20-90): (5-50): (5-15), the hydroxyl-containing solvent is at least one of an alcohol compound and an alcohol ether compound, and the organic acid is organic carboxylic acid. According to the bonding agent, two technologies of chemical micro-etching and chemical bonding are combined, the adhesive force between the copper surface and different photoresist can be effectively improved and kept stable, the change of the copper surface appearance is small, and meanwhile the requirements of fine line processing and high-frequency signal transmission on the copper surface appearance can be met.

Description

technical field [0001] The invention relates to a metal surface treatment agent and a preparation method thereof, in particular to a self-etching copper surface bonding agent and a preparation method thereof, and belongs to the technical field of chemicals for printed circuit board production. Background technique [0002] In the process of transferring the conductive pattern of PCB, a very critical step is the application of photoresist, and the adhesion between the photoresist and the copper surface requires long-lasting stability. The industry generally uses methods such as mechanical brushing, sandblasting or chemical micro-etching to pre-treat the copper surface. By increasing the roughness of the copper surface and increasing the anchoring area between the photoresist and the copper surface, a durable and stable of adhesion. Among them, chemical microetching is the most widely used. [0003] With the development of light, thin, short, and small electronic equipment, ...

Claims

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Application Information

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IPC IPC(8): C23F1/02C23F1/18H05K3/38H05K3/06
CPCC23F1/02C23F1/18H05K3/383H05K3/064
Inventor 王立中陈修宁李晨庆黄志齐王淑萍黄京华
Owner KUNSHAN CITY BANMING ELECTRONICS SCI & TECH
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