Low-stress optical fiber ring adhesive capable of being cured at room temperature
A technology of room temperature curing and room temperature curing agent, applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problems of large expansion stress, cracking of ring body, low temperature crosstalk drop of optical fiber ring, etc., and achieve small expansion stress , reduce stress relaxation, improve the effect of precision
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[0036] 1. The preparation method of organosilicon modified epoxy resin, comprising the following steps:
[0037] 1) Add 844g (2mol) methacryloyloxypropyl polydimethylsiloxane, 284.3g (2mol) glycidyl methacrylate, 218.26g (1mol) dicyclopentadienyl methacrylate In the three-necked flask, then add 500g of solvent toluene, stir evenly, add 13g of azobisisobutyronitrile and 24g of chain transfer agent n-dodecyl mercaptan, and heat up to 70°C for 6 hours of insulation reaction;
[0038] 2) The product obtained by the reaction in step 1) is precipitated with refrigerated methanol, the upper layer solvent is removed to obtain a viscous liquid, and then the product is subjected to vacuum treatment at 40-60° C. for 24 hours using a vacuum drying oven to obtain the organosilicon Modified epoxy resin A1, the tested epoxy value is 0.15Eq / 100g.
[0039] 2. Synthesis of Coupling Agent Modified Reactive Diluent
[0040] 17.723g of silane coupling agent isocyanate methyltrimethoxysilane, 175...
Embodiment 1
[0046] A room temperature curing low stress optical fiber ring adhesive is composed of two components, A and B, wherein the A component is calculated by weight percentage, and the content of each component is: modified epoxy resin A1 70%, bisphenol E epoxy resin EPOX-MK R710 15%, coupling agent modified epoxy diluent A2 15%, the sum of each component meets 100%; component B is silicone modified room temperature curing agent 100%; A:B = 1.8:1 (mass ratio).
[0047] The preparation method of the above-mentioned low-stress optical fiber ring adhesive is as follows: according to the above-mentioned A group distribution ratio, weigh each raw material component, use a disperser to stir at about 70 ℃ for 60 minutes at a speed of 1000 rpm, and after completely mixing, Use a 500-mesh filter to filter and place it in a 40°C oven for 1 day to deaerate to obtain the finished product component A; after the synthesis of the B component, use a 500-mesh filter to filter the finished product c...
Embodiment 2
[0049] A room temperature curing low stress optical fiber ring adhesive is composed of two components, A and B, wherein the A component is calculated in weight percentage, and the content of each component is: modified epoxy resin A1 60%, bisphenol E epoxy resin EPOX-MK R710 20%, coupling agent modified epoxy diluent A2 20%, the sum of each component meets 100%; component B is silicone modified room temperature curing agent 100%; A:B = 1.56:1 (mass ratio).
[0050] The preparation method of the above-mentioned low-stress optical fiber ring adhesive is as follows: according to the above-mentioned A group distribution ratio, weigh each raw material component, use a disperser to stir at about 70 ℃ for 60 minutes at a speed of 1000 rpm, and after completely mixing, Use a 500-mesh filter to filter and place it in a 40°C oven for 1 day to deaerate to obtain the finished product component A; after the synthesis of the B component, use a 500-mesh filter to filter the finished product ...
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