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Active metal brazing copper-clad ceramic substrate and preparation method thereof

A technology of copper-clad ceramic substrate and active metal solder is applied in the improvement of metal adhesion of insulating substrates, photovoltaic power generation, secondary treatment of printed circuits, etc. The performance difference is relatively large and other problems, so as to reduce the porosity, increase the density, and improve the screen printing performance.

Active Publication Date: 2022-08-05
NANJING ZHONGJIANG NEW MATERIAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

During the brazing process, due to the large difference in thermal and mechanical properties between ceramic materials and metals, there are residual stresses at the interface during the preparation process, which affects the bonding strength, and at the same time, there are problems such as cracking during the thermal cycle; at the same time, in the During the screen printing process, the dispersibility and thixotropy of the active metal solder will affect the printing quality, which will affect the problem of more and larger pores in the active metal layer after brazing, which will affect the compactness and flatness

Method used

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  • Active metal brazing copper-clad ceramic substrate and preparation method thereof
  • Active metal brazing copper-clad ceramic substrate and preparation method thereof
  • Active metal brazing copper-clad ceramic substrate and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0032] Step 1: (1) Place 12 parts of phytic acid and 4 parts of sodium dodecylbenzenesulfonate in a mixed solvent of 6 parts of ethanol and 78 parts of deionized water to obtain a cleaning agent; (2) put the AIN ceramic substrate on the Set a positioning reference hole with a diameter of 1.5 mm; place it in a cleaning agent, set the temperature to 75 °C, ultrasonically wash for 5 minutes, and blow dry with nitrogen to obtain a ceramic substrate A;

[0033] Step 2: (1) ultrasonically disperse 1g graphene oxide in 250mL ethanol, add 5mL tetrabutyl titanate, 2mL tetraethyl silicate, 5mL deionized water, stir evenly, set the temperature to 80°C for reflux for 6 hours, Freeze-dried; placed in a high-temperature furnace, heat treatment at a temperature of 420°C for 3.5 hours under a nitrogen atmosphere; heated to 820°C, nitrogen was replaced with ammonia gas, and the flow rate of ammonia gas was 100cm 3 / min, heat treatment for 3.5 hours, and cooling under nitrogen atmosphere to obta...

Embodiment 2

[0038] Step 1: (1) Place 10 parts of phytic acid and 4 parts of sodium dodecylbenzenesulfonate in a mixed solvent of 5 parts of ethanol and 78 parts of deionized water to obtain a cleaning agent; (2) put the AIN ceramic substrate on the Set a positioning reference hole with a diameter of 1.0 mm; place it in a cleaning agent, set the temperature to 70 °C, ultrasonically wash for 8 minutes, and blow dry with nitrogen to obtain a ceramic substrate A;

[0039] Step 2: (1) ultrasonically disperse 1g graphene oxide in 250mL ethanol, add 5mL tetrabutyl titanate, 2mL tetraethyl silicate, 5mL deionized water, stir evenly, set the temperature to 79°C and reflux for 7 hours, Freeze-dried; placed in a high temperature furnace, heat treatment at 400 °C for 4 hours under nitrogen atmosphere; heated to 800 °C, nitrogen was replaced with ammonia gas, and the flow rate of ammonia gas was 80 cm 3 / min, heat treatment for 4 hours, and cooling under nitrogen atmosphere to obtain graphene composit...

Embodiment 3

[0044] Step 1: (1) Place 12 parts of phytic acid and 5 parts of sodium dodecylbenzenesulfonate in a mixed solvent of 6 parts of ethanol and 80 parts of deionized water to obtain a cleaning agent; (2) place the AIN ceramic substrate on the Set a positioning reference hole with a diameter of 2.0 mm; place it in a cleaning agent, set the temperature to 80 °C, ultrasonically wash for 3 minutes, and blow dry with nitrogen to obtain a ceramic substrate A;

[0045] Step 2: (1) ultrasonically disperse 1 g of graphene oxide in 250 mL of ethanol, add 5 mL of tetrabutyl titanate, 2 mL of tetraethyl silicate, and 5 mL of deionized water, stir evenly, set the temperature to 82°C and reflux for 5 hours, Freeze-dried; placed in a high temperature furnace, heat treatment at 450 °C for 3 hours under nitrogen atmosphere; heated to 850 °C, nitrogen was replaced with ammonia gas, and the flow rate of ammonia gas was 100 cm 3 / min, heat treatment for 4 hours, and cooling under nitrogen atmosphere ...

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Abstract

The invention discloses an active metal brazing copper-clad ceramic substrate and a preparation method thereof. The preparation method of the copper-clad ceramic substrate comprises the following steps: step 1, forming a positioning reference hole in the ceramic substrate; performing ultrasonic washing in a cleaning agent, and drying to obtain a ceramic substrate A; 2, coating active metal solder on the ceramic substrate A in a pre-pattern manner, and drying to obtain an active metal solder layer; fixing a copper sheet on the active metal solder layer, and performing vacuum brazing to obtain a ceramic substrate C; and step 3, carrying out graphical processing on the ceramic substrate C, and removing a redundant copper layer to obtain the copper-clad ceramic substrate. According to the scheme, the graphene compound is introduced, stress buffering is increased, and the problem of cracking in the thermal cycle process is solved; the inorganic powder is respectively treated by using the organic auxiliary agent, so that the dispersity is improved; meanwhile, the material proportion is comprehensively regulated and controlled, so that the slurry has good thixotropic performance, the silk-screen printing performance is improved, the porosity is reduced, and the compactness is improved.

Description

technical field [0001] The invention relates to the technical field of copper clad laminates, in particular to an active metal brazing copper clad ceramic substrate and a preparation method thereof. Background technique [0002] Copper-clad ceramic substrate is an electronic material formed by compounding copper foil on the surface of ceramic material. It is widely used in multi-directional electronic fields such as automotive electronics, aerospace, and solar cells. Its composite process includes electroplating technology, high temperature bonding technology, laser activation technology and active metal brazing technology. The active metal brazing technology has become the most commonly used processing technology due to its better performance and more convenience. [0003] The active metal brazing technology is to weld metal solder on the ceramic substrate, and then use the metal solder as the medium to bond the copper foil by vacuum brazing. The copper-clad ceramic substr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B37/02H05K3/38
CPCC04B37/023H05K3/38C04B2237/125C04B2237/52Y02E10/50
Inventor 赵建光黄礼侃赵尉宁林晓光
Owner NANJING ZHONGJIANG NEW MATERIAL TECH
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