6 results about "Apparent temperature" patented technology

This invention relates to the field of intelligent floor temperature control technology, specifically disclosing an environmentally adaptive intelligent floor temperature control system and control method, including the following steps: Step S1: Collect historical user temperature setting data and floor temperature control operating data; Step S2: Analyze historical data to establish a correlation model between indoor perceived temperature and air temperature; extract user temperature setting curves, generate behavioral habit feature curves, and classify them through a recurrent neural network to obtain several categories and their average feature curves; Step S3: Match the current user behavior curve with the historical average curve to predict the target temperature curve for the next day; combine the temperature correlation model to dynamically adjust the floor temperature; This method achieves personalized and adaptive temperature control optimization through data-driven and machine learning approaches.

This invention discloses an automatic control method for a thermocouple calibration furnace based on temperature data acquisition, belonging to the field of temperature control technology. The method includes: constructing an error decomposition model using a dynamic inertial prediction layer, a residual structure separation layer, and a disturbance suppression layer based on temperature-related dynamic response parameters, and performing frequency separation to obtain the intrinsic measurement error components; correcting the apparent temperature sequence based on the intrinsic measurement error components, and performing dynamic compensation inversion in conjunction with the temperature-related dynamic response parameters to generate a true temperature sequence and a temperature reliability index; evaluating the stability of the calibration temperature field based on the true temperature sequence and the temperature reliability index, generating heating control commands, adjusting the heating power in the calibration furnace, and generating a calibration temperature field control report. This invention, by constructing temperature-related dynamic response parameters and establishing an error decomposition model, achieves a structured analysis of the dynamic hysteresis behavior and intrinsic measurement errors of thermocouples by temperature sensors.

The application relates to an infrared thermal imager temperature measurement method, device and equipment based on environmental temperature self-compensation. The method comprises the following steps: acquiring a target parameter of a target object; wherein the target parameter comprises a current apparent temperature of the target object measured by using an infrared thermal imager and a current environmental parameter of a target region where the target object is located, the current environmental parameter at least comprising a current environmental temperature; determining a temperature difference according to the current environmental temperature and the current apparent temperature, inputting the current environmental temperature, the current apparent temperature and the temperature difference into a temperature compensation model to obtain a current temperature compensation value of the target object; and compensating the current apparent temperature by using the current temperature compensation value to obtain a real temperature of the target object. By using the method, the influence of the environmental temperature can be self-adaptively compensated, and the infrared temperature measurement accuracy of the measured object is improved.

A display system includes an acquirer, an estimator, and a controller. The acquirer acquires a first detection value and a second detection value from a temperature sensor and a humidity sensor, respectively. The temperature sensor and the humidity sensor are both included in a ventilator that ventilates a room. The estimator estimates, based on the first detection value and the second detection value that are acquired by the acquirer, an apparent temperature distribution representing a distribution of apparent temperatures in a height direction in the room. The controller makes a display device present the apparent temperature distribution estimated by the estimator.

This invention discloses a high-frequency switching power supply temperature and load joint compensation and lifetime prediction system, specifically relating to the field of high-frequency switching power supply temperature and load technology. By constructing a load-sensitive thermal mapping reference model and introducing temperature rise mismatch characteristics and thermal state vectors, it can identify the spatial partitioning characteristics of internal thermal stress of the chip at different operating stages. This allows the temperature compensation and load adjustment strategies to no longer rely solely on apparent temperature safety judgments, but actively constrain the accumulation rate of local extreme thermal stress, thereby avoiding the problem of latent thermal failure induced even under controlled external temperatures. Simultaneously, it temporally couples the local thermal state with the thermal cycling damage evolution process, updating the damage accumulation and lifetime prediction results in real time after the compensation control is executed. This enables the remaining lifetime assessment to truly reflect the degradation mechanism dominated by local hot spots, significantly reducing the risk of overly optimistic lifetime prediction.

This invention belongs to the field of integrated chip technology for mobile terminals, specifically relating to a multifunctional integrated chip for smartphones and its applications. The chip integrates a main processing module, a health monitoring module, an environmental sensing module, a motion state recognition module, a data processing module, an intelligent power management module, a communication interface module, and a speed calculation unit. The environmental sensing module integrates temperature, humidity, and air pressure data to calculate perceived temperature; the data processing module extracts physiological parameters through health analysis algorithms; and the intelligent power management module optimizes power consumption by switching between sleep, daily, and exercise modes based on the user's activity level. Smartphones equipped with this chip integrate biological, environmental, and motion sensors and a positioning module, displaying health parameters, environmental assessment results, and exercise data in real time on the screen. This invention, through highly integrated design and multi-module collaboration, achieves accurate monitoring of health, environment, and exercise while maintaining low power consumption, significantly improving the level of intelligence and user experience.