The present application relates to the technical field of
chip package aging test, in particular to a kind of
aging test method of multi-
chip package.The present application is related to the abnormal characteristics of real-time analysis current waveform and is associated with high-resolution temperature distribution change, and then realize before calculating
core particle completely failure, accurately determine its " near
scrap period " state, so that test
system can actively stop
aging test to critical device, avoid sample damage or burn due to excessive failure, preserve complete, valuable sample for subsequent
nondestructive analysis, secondly, the present application adopts the strategy of current and thermal
imaging data fusion analysis, through the double criterion of " current abnormal risk value " and " temperature deterioration index ", greatly reduce the misjudgment and omission caused by
single parameter monitoring, first through current
abnormality lock suspicious computing
core particle, then determine the temperature deterioration index of suspicious computing
core particle, temperature is the main factor leading to computing core particle failure.