The invention discloses a three-dimensional
chip thermal perception optimization method based on
tensor data flow, and relates to the field of integrated circuits, and the method comprises the steps: firstly, starting from the angle of
tensor data flow, providing a collaborative
thermal optimization process combining a network, an architecture,
physics and packaging; then, based on a quantitative modeling
tensor data flow energy optimization method, automatically identifying the most energy-saving tensor data flow under given three-dimensional
chip constraints by using a
heuristic optimization method; and finally, providing a
thermal sensing three-dimensional architecture spatial
layout method, simplifying the spatial
layout problem of the SRAM
macro block into an affine mapping
optimization problem, and optimizing an affine mapping relationship through a
heuristic optimization method to obtain the spatial
layout with optimal thermal performance. According to the method, the tensor calculation characteristics are optimized in a targeted manner, so that the three-dimensional stacked SRAM
chip meets the
thermal reliability requirement in a high-density integration scene.