An image capturing element 
package for an electronic 
endoscope is provided with a 
solid-state image capturing element, an insulating base member made of electronically insulating material and configured to hold the image capturing element, a metallic 
package housing surrounding the 
solid-state image capturing element, a proximal end portion of the metallic 
package housing being air-tightly welded to the insulating base member, a window portion being formed on a front end surface of the metallic package housing, a 
cover glass air-tightly secured to the window portion, and a housing reinforcing member arranged along an inner surface of the metallic package housing, the housing reinforcing member being formed not to deform when a force exceeding strength at which the package housing is durable against deformation.